News – 2008.04.01 Late Edition

Adeneo Releases Windows Embedded CE 6.0 BSP for NXP LH7A404 ARM9
Adeneo, a Microsoft Windows Embedded Gold Partner with facilities in Europe and in the USA, announced the full commercial release of the Windows Embedded CE 6.0 BSP for NXP Semiconductors LH7A404 ARM9(tm) processor-based microcontroller. The LH7A404 ARM based microcontroller features high-resolution integrated LCD controllers and provides System-on-Chip capability for customers in consumer, entertainment, industrial, medical and automotive industries.

AXIOMTEK Rolls Out eBOX630-821-FL Compact Rugged Embedded Computer
AXIOMTEK announced the release of a fanless high-performance compact embedded computer, the eBOX630-821-FL, which features dual display ports (optional) and supports a superior socket 478 Intel® Pentium® M (up to 2.0GHz/2MB) / Celeron® M (up to 1.5GHz/1MB) processor or an onboard ultra low voltage Intel® Celeron® M 600MHz/512KB processor.

Toshiba Offers Embedded Removable Memory for Mobile Handsets
Memory subsystems in mobile handsets continue to grow in capacity and complexity, driven by growing storage requirements for images, music, video, and data as more features such as audio players, megapixel cameras, streaming video, GPS, and Mobile TV are integrated into mobile phones. As a result of its high capacity, fast write performance and low cost-per-bit, NAND flash has become the preferred data storage solution for mobile handsets.

NextWave Wireless Introduces NW2000 Wave 2-ready Mobile WiMAX Chipset
Demonstrating leadership in delivering cutting-edge WiMAX silicon to market, NextWave Wireless Inc. (NASDAQ: WAVE), a global provider of mobile multimedia and wireless broadband technologies, announced the NW2000 Wave 2-ready family of advanced, second-generation mobile WiMAX chipsets. NextWave’s innovative ‘No Compromise’ WiMAX silicon solutions raise the bar for mobile WiMAX chipsets.

Sound Design Unveils VOYAGEURII Audio Processing DSP Platform
Sound Design Technologies (SDT), a leading designer and manufacturer of ultra-low power semiconductor solutions for hearing instruments, has launched the VOYAGEURII(tm) series of DSP solutions, consisting of programmable DSP platforms as integrated circuits or packaged hybrids and preconfigured hearing aid solutions. The VOYAGEURII(tm) series will be unveiled this week during AudiologyNOW! in Charlotte, North Carolina.

GCT Creates Chip for Mobile WiMAX IEEE 802.16e WAVE 2, WiFi 802.11 b/g
GCT Semiconductor, a leading supplier of Mobile WiMAX solutions to the global market, announced the world’s first highly integrated single-chip solution, GDM7215, supporting mobile WiMAX (IEEE 802.16e WAVE 2) and WiFi (802.11b/g). GDM7215 implements mobile WiMAX RF/MAC/PHY and WiFi RF/MAC/PHY on a monolithic die. This solution is being demonstrated on an Ultra Mobile PC (UMPC) with WiMAX and WiFi connectivity during the CTIA wireless event at the Las Vegas Convention Center.

Hitachi Maxell Improves Fuel Cells with New Highly-Active Catalyst
Hitachi Maxell, Ltd. (TSE: 6810) has announced development of a new catalyst used for oxygen-reduction reactions at the cathode of a polymer electrolyte fuel cell (PEFC). The new catalyst is gold-platinum (AuPt) nano-particle 2 to 3 nm in size and can generate approximately 4.8 times the oxygen-reduction current per unit area than commercial platinum catalysts.

Texas Instruments, IIT Kharagpur Team on Medical Technology Research
Texas Instruments Incorporated (TI) (NYSE: TXN) has signed a collaborative agreement with the School of Medical Science and Technology (SMST), Indian Institute of Technology (IIT) Kharagpur, to develop semiconductor technologies that will help improve the quality, comfort and accessibility of health care. This is the first time that TI has partnered with any IIT in India on research projects devoted to medical electronics innovation.

Tensilica to Make Multiple Presentations at Multicore Expo
As the provider of the broadest line of controller, CPU and specialty DSP processors on the market today, Tensilica, Inc. is recognized as an industry leader with its low-power, benchmark-proven processor cores. The company has been selected to participate in presentations and panels at the Multicore Expo held April 1-3, 2008, in San Jose, California.

WiMAX World EMEA 2008 Conference and Expo Reveals Keynote Speakers
The third annual WiMAX World EMEA Conference & Expo is expected to bring together over 2,000+ professionals from some of the most exciting and fastest-growing companies in the world as well as from the large and active WiMAX Forum membership community. The conference will take place May 19-21, 2008, at the ICM Munich, Germany.

Red Bend vCurrent Mobile Client, TI LoCosto Platform Upgrade Handsets
Red Bend Software, the market leader in Mobile Software Management, announced support for its market-leading vCurrent® Mobile client software for firmware over-the-air (FOTA) updating on Texas Instruments’ (TI) LoCosto(tm) platform for entry-range handsets. Red Bend will be providing handset manufacturers with a pre-tested and optimized solution for rapid, reliable and secure FOTA updating on entry-level mobile devices using TI’s LoCosto technology.

Motive, Red Bend Software Announce Mobile Interoperability
Motive, Inc. (OTC: MOTV), a leading provider of service management software for broadband and mobile data services, and Red Bend Software, the market leader in Mobile Software Management, announced interoperability between the two companies’ solutions, enabling service providers to improve the profit potential of their mobile and converged service offerings.