ST VD6725 Mobile Phone Camera Sensor

The VD6725, from STMicroelectronics (NYSE: STM), is the market’s smallest single-chip camera sensor for mobile applications. ST’s 2-megapixel mobile-phone camera sensor is a 1/5-inch optical-format imaging sensor, with an active pixel array of 1600 x 1200 (UXGA), a high-performance image processor and camera control functions on a single chip. The VD6725 fits in phone camera modules smaller than 6 x 6 x 3.8 mm as a result of its 1.75-micron pixel design and ST’s advanced sensor architecture.

STMicroelectronics VD6725 camera image sensor diagram

Engineering samples and demo-kits are available now, with the volume production scheduled for the end of June 2008. Unit pricing is in the $2 range, depending on the production period and quantities. ST’s VD6725 single-chip camera sensor is available in two package options, as a COB (Chip On Board) die or in the TSV wafer-level package.

ST’s latest developments in pixel defect correction, adaptive noise reduction and sharpness enhancement ensure that the embedded Image Signal Processor delivers outstanding picture quality. Advanced anti-vignetting algorithms (balancing uneven illumination) and automatic white-balance control support excellent color rendition in varying light conditions. The camera sensor is also able to identify and neutralize defective (dead) pixels that fail to sense light levels correctly.

The VD6725′s embedded image processor enables the users to apply a wide range of special effects on snapshots, including flipped and mirror-reversed images or pure black-and-white conversion for whiteboard content capture, document extraction and barcode reading.

ST’s new single-chip camera sensor produces digital video streams at 15 frames per second (fps) at full UXGA resolution and 30 fps at VGA resolution. It supports fast context switching, which means that the sensor switches extremely fast from ‘preview’ to ‘capture mode’, minimizing the delay of the capture control.

The VD6725 single-chip camera sensor is available in ST’s TSV (Through Silicon Via) wafer-level package. This type of package enables the production of reflowable camera modules. These are soldered directly on the phone motherboard, which saves cost, space and time compared with the process of fixing traditional camera modules in the board socket. ST is one of the very few companies that have reflowable camera modules in production.

More info: STMicroelectronics