Enea to Showcase Enea dSPEED Platform at UK Embedded Masterclass
Enea (Nordic Exchange/Small Cap/ENEA), a world leading provider of network software and services, announced that it will present the Enea dSPEED Platform at the UK Embedded Masterclass, to be held in London on May 8 and in Bristol on May 13, 2008. The Enea dSPEED Platform provides high-performance, comprehensive management services for DSP clusters executing data plane applications.
Cypress Webinar Announces Capacitive Sensing Webinar
Cypress Semiconductor Corp. (NYSE:CY) announced a free online seminar that looks at the benefits gained from adding a capacitive sensing interface to an actual system design. The 60-minute webinar entitled “Using Capacitive Sensing to Solve Real-World Design Problems” will be presented in conjunction with Electronic Engineering Times on Wednesday, March 26 at 9:00 a.m. PDT.
Broadcom Demonstrates First Single Chip High Definition AVS Set-Top Box
Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, announced that it is the first company to demonstrate single-chip high definition (HD) audio video coding standard (AVS) for digital set-top box (STB) applications. The highly integrated system-on-a-chip (SoC) solution will enable set-top box manufacturers to rapidly design and deploy HD boxes compliant with China’s new AVS specification.
PrismTech Offers Middleware for Real-time Embedded Systems Webcast
PrismTech(tm), a leader in high-performance middleware and development tools, continues its series of webcasts in March and April focused on high-end middleware solutions. The webcasts are free and intended for managers, architects, and technologists responsible for data-centric applications and/or the distributed systems they run on.
Atmel Debuts AT73C209 Mixed Mode Analog Companion IC for Music Players
Atmel® Corporation (Nasdaq: ATML), announced the release of its AT73C209 Analog Companion power supply and audio interface IC designed for low-cost music players. The AT73C209 supplies the required voltages and currents to all the sections of these portable devices taking energy from a single alkaline battery, and also provides a high-quality audio interface.
Toshiba Ramps Up Production of MLC NAND Solid State Drives
Toshiba America Electronic Components, Inc. (TAEC) announced that Toshiba Corp.’s first multi-level cell (MLC) NAND-flash-based solid-state drives (SSDs) have started mass production. The initial models to begin shipping this month are 128GB drives in a lightweight, 15 gram embedded module form factor.