ADLINK Technology Acquires Ampro Computer
The board of ADLINK Technology (6166 TT, “ADLINK”) adopted a resolution to acquire 100% shareholding of Ampro Computer Inc.(“Ampro”). ADLINK will acquire a total of 39,743,137 common shares in Ampro (representing 100% of Ampro’s shareholding) with a total investment amount of US$20 million. The relevant Share Purchase Agreements have been executed by and between ADLINK International.
Agilent Eliminates Physical Test Points for In-Circuit Tests
Agilent Technologies Inc. (NYSE:A) unveiled a limited access solution for In-Circuit Test (ICT) users that eliminates the need for physical test points, offering benefits that traditional VTEP test cannot provide. Part of Agilent’s VTEP v2.0 Powered test suite, the Agilent Cover-Extend Technology is a hybrid between two established test methodologies in the electronic manufacturing industry: Boundary Scan and VTEP Vectorless Test.
InterDigital SlimChip Modem Platform Achieves Category 8 HSDPA Speed
InterDigital, Inc. (NASDAQ:IDCC) announced that its SlimChip mobile broadband modem turned in market leading performances in HSDPA benchmark testing conducted by Signals Research Group, LLC, a widely-recognized independent research consultancy, and Spirent Communications, who provided its test equipment and engineering support.
ON Semiconductor, TTTech Team on Time-Triggered Protocol Controller
TTTech, the foremost supplier of solutions in the field of time-triggered technologies, and ON Semiconductor (Nasdaq:ONNN), a global leader in power management solutions, have agreed to join forces to develop a controller for TTP® (Time-Triggered Protocol). This new TTP controller is targeted at cross-industry applications and especially the aerospace market.
Mentor Graphics Announces 2008 Integrated Electrical Solutions Forum
Mentor Graphics Corporation (Nasdaq: MENT) announced its 2008 Integrated Electrical Solutions Forum (IESF) program. IESF is a full one day event that, now in its seventh year, has become one of the leading forums for electrical and electronic systems design, modeling, simulation and analysis within the automotive industry. This event series has now has been expanded in 2008 to include additional military and aerospace events and new forums in Brazil, Japan and Korea.
Outsourced Power Semiconductor Packaging Markets Report
The trend to outsource packaging requirements to Asia grows among power semiconductor manufacturers due to declining profit margins and escalating competition. Their new business models speed consumer adoption of their products by reducing time to market and production costs. New analysis from Frost & Sullivan, Outsourced Power Semiconductor Packaging Markets, finds that the markets earned revenues of $887.6 million in 2007 and estimates this to reach $1.4 billion by 2011.
MSC Vertriebs Acquires ABLE Design
MSC Vertriebs GmbH in Stutensee has acquired the majority stake in ABLE Design GmbH. In addition to sales of standard assemblies with TFT, electroluminescent and plasma displays, ABLE Design GmbH, which was founded in 1994 and is located in Munich, focuses mainly on the design of high-quality, customer-specific display solutions. In 2007, the company with twelve employees achieved revenues of 4.5 million Euros.