News – 2008.03.13 Late Edition

austriamicrosystems Launches AS1369 Ultra Low Dropout Regulator
austriamicrosystems (SWX: AMS), a leading global designer and manufacturer of high performance analog ICs for communications, industrial, medical and automotive applications, has launched the AS1369 ultra-low dropout regulator with a guaranteed 200mA output current. The AS1369 has been specifically designed for all space critical applications such as mobile phones and PDAs which require high performance despite limited PCB space.

Strategy Analytics Comments on Buyout of Siemens Wireless Modules
Strategy Analytics believes that T-Mobile Venture Fund’s planned purchase of Siemens Wireless Modules business as part of a leveraged buy-out will create a new market powerhouse. With an estimated 30% of the global M2M (machine to machine) modules business, the total M2M market will be worth almost $40 billion dollars in 2011. This announcement is indicative of an accelerated consolidation in the M2M market.

Lambda Rolls Out NV-Power Family of Configurable AC-DC Power Supplies
Lambda has introduced a new range of digitally controlled modules to its innovative NV-Power family of configurable AC-DC power supplies enabling increased power output of up to 1450W peak rating for 10 seconds. The new modules enable Lambda to satisfy the increasing demand for 1U high configurable power solutions above 1000W in broadcast, instrumentation and medical markets, and other applications, such as ATE, automation, routers and servers, and security networks.

Power Distribution Network Design Methodologies
Research and Markets has announced the addition of Power Distribution Network Design Methodologies to their offering. “Power Distribution Network Design Methodologies” is a collection of cogently written articles by 49 industry experts that fills in the void on PDN design procedures, and addresses among others such related topics as DC-DC converters, selection of bypass capacitors, DDR2 memory systems, powering of FPGAs, synthesis of impedance profile.

Broadcom Chips Power Downstream Channel Bonding Modems
Broadcom Corporation (Nasdaq: BRCM) announced that it has shipped more than one million units of its advanced channel bonding cable modem silicon for downstream channel bonding cable modems. Broadcom® cable modem silicon delivers downstream data rates of up to 150 Megabits per second (Mbps) and enables multiple service operators (MSOs) to deploy downstream channel bonding functionality immediately, without delays or costly upgrades to their CMTS infrastructures.