Cypress Announces Designing with USB in Embedded Systems Webinar
Cypress Semiconductor Corp. (NYSE:CY), the market leader in USB, announced a free online seminar that introduces embedded system designers to development with the USB protocol. The 60-minute webinar entitled “Introduction to USB Development in Embedded Systems,” will be presented in conjunction with Electronic Engineering Times on Wednesday, March 19 at 9:00 a.m. PDT.
ISaGRAF 5 Control Software Fully Supports TenAsys INtime RTOS
ICS Triplex ISaGRAF Inc., the leading automation software technology partner, announced that their ISaGRAF 5 control software now fully supports TenAsys’ INtime real-time operating system (RTOS). INtime provides deterministic, hard real-time control, leveraging the powerful capabilities of Intel® Architecture processors.
GE Fanuc Introduces IS-100, IS-200 Industrial Grade Servers
GE Fanuc Intelligent Platforms announced the IS-100 and IS-200 industrial grade servers. Both products benefit from GE Fanuc Intelligent Platforms’ industry-leading Product Lifecycle Management (PLM) programs, which ensure IS-100 and IS-200 hardware continuity over five years – thus eliminating the time and cost incurred by customers in regularly recertifying hardware caused by component and subsystem obsolescence.
TED Rolls Out TB-5V-LX330-EX Virtex-5 FPGA LX330 Evaluation Platform
Tokyo Electron Device Limited (TED) has announced the inrevium “TB-5V-LX330-EX” evaluation platform for ASIC prototyping with the Xilinx Virtex-5 FPGA LX330, which is the industry’s high density and high performance FPGA in the market.
Tensilica Supports MPEG-4 AAC-LC, aacPlus Multi-Channel Decoders
Tensilica®, Inc. has become the first processor IP (intellectual property) company to announce the approval and availability of MPEG-4 AAC-LC, aacPlus(tm) v1, and v2 multichannel decoder implementations from Dolby Laboratories, Inc (NYSE:DLB). These three multichannel decoders provide up to 7.1-channel surround sound for home entertainment devices. They are available now for the Tensilica HiFi 2 Audio Engine, the most popular audio architecture for system-on-chip (SOC) design.
Advansus Rolls Out i965GM-DCQI Intel GME965 Mini-ITX Motherboard
Advansus announces the roll out of i965GM-DCQI, an Intel® GME965 Mini-ITX motherboard designed for high definition video gaming machines and digital signage systems. The i965GM-DCQI Mini-ITX motherboard delivers excellent user experience with 3D graphics, dual-view display, dual audio streams, a 6 watt audio amplifier, dual LAN and an onboard Trusted Platform Module (TPM) providing a hardware cryptoprocessor for increased data security.
ABI Research Publishes Report on IP Multimedia Subsystems
IP Multimedia Subsystem (IMS) is expected to provide mobile telephone operators with a forecasted $300 billion in extra revenue over the next five years, according to a new study from ABI Research. Major operators such as Sprint, Verizon and British Telecom (BT) will increasingly deploy IMS across their networks in a quickening tempo starting this year.
ISQED Panel to Discuss Electronic System Level 2.0
CoWare, Inc., the leading supplier of platform-driven electronic system-level (ESL) design software and services, announced that a panel to be held Tuesday, March 18, during the International Symposium on Quality Electronic Design (ISQED) will discuss “Electronic System Level (ESL 2.0) — Is Anybody Using It 2.0?” It will be held from 3:45-5:30 p.m. in the Siskiyou/Cascade/Sierra Room at the DoubleTree Hotel in San Jose.
Ambric to Demonstrate teraOPS class Am2045 MPPA at SPIE 2008
Ambric®, Inc., a fabless semiconductor company shipping the world’s first one teraOPS-class Am2000(tm) chip family of highly scalable, massively parallel processor arrays (MPPAs), using Ambric’s award-winning structured object programming model tools to make massively parallel software development practical for complex embedded systems, will be exhibiting and delivering a paper at SPIE Defense+Security 2008.
Future Horizons Publishes Semiconductor Applications Markets Report
Future Horizons released the 2008 edition of its annual Semiconductor Applications Markets Report. The report identifies applications that are expected to drive semiconductor market growth through to 2012 and quantifies system volumes, semiconductor content and revenue for each application.
eASIC Corporation Raises $48 Million
eASIC Corporation announced it has raised $48M in late stage financing. The financing round was lead by Advanced Equities Incorporated. Also participating in the round were previous investors Khosla Ventures, Kleiner Perkins Caufield and Byers, Crescendo Ventures and Evergreen Venture Partners. The eASIC Chief Financial Officer, Craig Klosterman, also invested in this round.
Trendsmedia, Beacon Events Reveal Details of WiMAX World Asia
Event organizers Trendsmedia and Beacon Events announced that leading business executives will be keynoting the 2nd Annual WiMAX World Asia Conference & Expo, to be held in Bangkok, Thailand on March 18-20, 2008. WiMAX World Asia is the only independently run event focused on the entire WiMAX and mobile Internet industry, and features over three days of comprehensive program and more than 80 speakers and over 75 sponsors and exhibitors.