Atmel, SEGGER Team on embOS RTOS for AVR32 Microcontrollers
Atmel® Corporation (Nasdaq: ATML),and SEGGER Microcontroller, a leading manufacturer of middleware for embedded systems, announced the availability of the real time operating system (OS) embOS for the AVR®32 microcontrollers. The modern AVR32 architecture from Atmel is specially crafted to meet RTOS requirements with its fast multilevel interrupt controller, memory protection unit and the support for nested interrupts.
AMCC Introduces PowerPC 440EPr Embedded Processor
Applied Micro Circuits Corporation (NASDAQ: AMCC), a global leader in embedded Power Architecture(tm) processing, optical transport and storage solutions, announced the newest member of its Power Architecture family, the PowerPC® 440EPr processor. The outstanding balance of performance and affordability makes the PowerPC 440EPr the ideal choice for a wide range of cost sensitive applications.
MathWorks to Discuss Multidomain Modeling, System-Level Verification
The MathWorks will discuss the use of Model-Based Design and embedded systems within the electronic system industry through tutorials and workshops. The MathWorks will discuss the use of multidomain modeling and system-level verification for electronic design automation and embedded systems design at DATE Conference 2008 in Munich, Germany. Experts from The MathWorks will participate in the technical program and provide in-booth demonstrations and presentations on these topics.
Hilscher cifX Communication Interface Driver Ports to INtime RTOS
TenAsys Corp., a leading provider of real-time OS and virtualization software, announced that the cifX Communication Interface PCI card software driver from Hilscher GmbH of Hattersheim, Germany has been ported to the INtime® RTOS, enabling real-time Windows applications to utilize the wide array of real-time industrial Ethernet interfaces supported by this Hilscher I/O card, including PROFINET IRT, EtherNet/IP, EtherCAT, Powerlink, SERCOS III and Modbus TCP/IP.
Electronics.ca Publishes Report on Wafer Level Packaging
ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “WLP & Embedded Die Technologies 2008.” Wafer level packaging (WLP) is all about filling that gap: by making the packaging and assembly steps a whole collective wafer level process, packaging has now the potential to scale with the cost and size evolutions of most stringent semiconductor applications.
Aeroflex Announces TM500 LTE for 3G Long Term Evolution Test
Aeroflex has introduced the TM500 LTE test mobile designed to address the challenges of 3GPP LTE (3G Long Term Evolution) network infrastructure development test and roll-out. The TM500 LTE’s extensive Layer 1, Layer 2 and higher layer test features provide complete visibility into even the lowest layers of the radio modem by generating the detailed diagnostic data needed for engineers to verify the required functionality and optimise network operation and performance.
Inphi Unveils 3200EC Dual CDR with EDC for 10GBASE-LRM XFP Modules
Inphi Corporation announced the 3200EC 10 Gbps Dual Clock Data Recovery (CDR) with Electronic Dispersion Compensation Engine (EDC) for use in 10GBASE-LRM (LRM) XFP modules. The feature-rich single-chip device integrates Inphi’s patented analog signal processing EDC technology with XFI-compliant transmit and receive CDRs in a compact 7mm x 7mm QFN package. Replacing up to three separate chips, the 3200EC simplifies the design and reduces the bill of materials of an XFP transceiver module.
Microchip Design Partner Program Features Over 700 Companies
Microchip Technology Inc. announced its expanded Design Partner Program of more than 700 partners worldwide. Microchip Design Partners have expertise in a wide range of markets, such as the medical, appliance and automotive markets; and in applications such as motor control, lighting and power supplies, among others. They also receive priority technical support, free extended samples and discounted development tools from Microchip.