Mentor Debuts Questa Multi-view Verification, inFact Testbench Tools
Mentor Graphics Corporation (Nasdaq: MENT) announced the Questa® Multi-view Verification Components product and the inFact(tm) intelligent testbench automation tool – two new solutions that use breakthrough technologies to speed up verification and drastically improve verification coverage of today’s SoC (System on Chip) designs.
OneSpin Solutions Unveils GapFreeVerification for Formal Verification
OneSpin Solutions, an EDA company that provides innovative, field-proven formal verification solutions, unveiled GapFreeVerification(tm) – a patent-pending, systematic verification process for its award-winning 360 Module Verifier (360 MV) solution that dramatically boosts verification productivity. The new process systematically delivers predictable, repeatable verification results for complex modules and IP.
Silicon Integration Initiative Offers Common Power Format Tutorials
Silicon Integration Initiative (Si2) announced the availability of an on-line Common Power Format (CPF) tutorial. The tutorial is a self-paced, 2 and ½ hour slide and audio presentation that educates engineers on the CPF Standard and provides detailed examples of actual usage. The syntax and semantics of the CPF format are also discussed in detail. It is presented by one of the three Low Power Coalition Architects, Qi Wang, with an introduction by Dr. Sumit Dasgupta of Si2.
ON Semiconductor Debuts GreenPoint Reference Design for Power Adapters
ON Semiconductor (Nasdaq: ONNN), a leading global supplier of power management solutions, introduced a GreenPoint(tm) reference design for 200 watt (W) power adapters used to power game consoles. This solution provides a blueprint for design engineers to implement adapters that minimize both active- and standby-mode power consumption.
GiDEL Upgrades PROCStarIII System with Stratix III 340 FPGAs
GiDEL, a leading supplier of FPGA-based compute accelerator systems, announced that the new PROCStarIII(tm) family of products is now available with the largest capacity and fastest FPGA, the Stratix III 340L from Altera. With four such FPGA devices, pipelined SoC designs up to 12 million ASIC gates in size can be prototyped and verified. Multiple systems can be combined for verifying even larger designs.
Kontron Offers 3 Rugged Versions for CP6923 cPCI GBit Ethernet Switch
Kontron’s proven 6U CompactPCI Gbit Ethernet switch for high-end communication solutions is now available in three rugged levels, offering users and OEMs scalable ruggedness to meet the different needs of individual applications. Designed for reliable and robust operation under the broadest range of conditions, the Kontron CP6923 now comes in three rugged levels defined as R1, R2 and R3.
Aeroflex Announces RF Spectrum Analyzer Option, P25 Parametric Test
Aeroflex has announced the release of a new RF spectrum analyzer option for the 3500 hand-held 1GHz radio test set. The new spectrum analyzer option now allows users to see the signal they are receiving instead of just the frequency. In addition, the 3500 will have P25 parametric test capabilities by summer 2008, making it even more versatile.
NXP Semiconductors Boosts 32nm Research with Nangate Library Creator
Nangate, the leading provider of tools for design-specific digital cell libraries, announced that its Library Creator software has been adopted by NXP Semiconductors, the independent semiconductor company founded by Philips. NXP has chosen to use Library Creator for fast cell library prototyping and prediction of impact caused by technology changes, such as changes to design rules, cell architectures, transistor device models, etc. as they move into 32nm manufacturing processes and beyond.
Freescale, S60, Symbian to Enhance 3G MXC Reference Design
Freescale Semiconductor continues to enhance the first 3G mobile phone reference design using Freescale’s Mobile eXtreme Convergence (MXC) architecture combined with S60 and Symbian OS(tm). Based on a significant joint investment, the collaboration offers both mature and newly introduced reference design solutions, which reduce cost and time-to-market.
NextWave Wireless Introduces TDtv Device Integration Pack
NextWave Wireless Inc. (NASDAQ: WAVE), a global provider of mobile multimedia and broadband technologies, paved the way for handset manufacturers to easily participate in the global market for TDtv by announcing a TDtv Device Integration Pack. NextWave’s TDtv Device Integration Pack includes a low-power TDtv System in Package (SiP), a complete MBMS software stack, and MediaFusionTM multimedia client software from PacketVideo Corporation (PV).
Elma Introduces E-Frame Open Access Test Chassis
Elma Electronic Inc., a global manufacturer of electronic packaging products, has announced a new open frame chassis for test/debugging. The unit does not have side or back walls around the card cage area, leaving it open for easy access. The E-frame was designed with the high (and flexible) power and cooling requirements for VPX (VITA 46/48) systems. However, any 3U or 6U backplanes can be used. This includes VME/64x, VXS, CompactPCI, and other backplane architectures.
DSM Computer Announces Low-noise 96M1594 ATX-Infinity Industrial PC
DSM Computer’s “96M1594″ ATX-Infinity® industrial PC is now available in an extremely low-noise variant. With regard to noise emission, the four HM computer conforms to the requirements of the “Blue Angle” environmental label (RAL-UZ 78 Version 01.2007) for personal computers. This means the “96M1594″ is suitable for use in noise-sensitive environments, for example, in a control room, in a machine room or in medical engineering applications.