Freescale Semiconductor to Acquire SigmaTel
Freescale Semiconductor, a privately held, global leader in the design and manufacture of embedded semiconductors, and SigmaTel, Inc. (NASDAQ: SGTL), announced that they have entered into a definitive agreement for Freescale to acquire SigmaTel. SigmaTel is a leading provider of analog intensive, mixed-signal integrated circuits (ICs) for the digital multimedia market.
GE Fanuc Unveils AXISLite Multiprocessor Software Development Tool
Further enhancing the company’s position as a leading supplier of advanced multiprocessor solutions for mission-critical applications, GE Fanuc Intelligent Platforms announced the availability of AXISLite for free download. AXISLite allows prospective customers to thoroughly evaluate the capabilities of AXIS prior to purchasing the full AXIS suite.
MIT, TI Create Chip Design with 10x More Energy Efficiency
Researchers at MIT and Texas Instruments (TI) (NYSE: TXN) unveiled a new chip design for portable electronics that can be up to ten times more energy-efficient than present technology. The design could lead to cell phones, implantable medical devices and sensors that last far longer when running from a battery. The innovative design will be presented Feb. 5 at the International Solid-State Circuits Conference (ISSCC) in San Francisco.
Discretix, VisualOn, Axel Debut Mobile TV Solution for Handset OEMs
Discretix, multimedia application provider VisualOn, and mobile TV middleware developer Axel Technologies, have partnered to provide a pre-integrated Mobile TV solution for handset OEMs. The DVB-H-based solution, which supports both the OMA BCAST Smartcard and DRM Security Profiles, delivers an ultra-reliable, out of the box strategy for the “next big thing” in cell phones: digital television.
Synopsys Supports USB 2.0 Link Power Management, High Speed Inter-Chip
Synopsys, Inc. (NASDAQ: SNPS), a world leader in software and IP for semiconductor design and manufacturing, announced a major expansion to its leading DesignWare® USB IP product line with support for the USB 2.0 Link Power Management (LPM) and High Speed Inter-Chip (HSIC) standards. The new DesignWare USB LPM and HSIC digital controller and PHY IP reduce power consumption and area for USB-enabled chips.
DAFCA, GiDEL Team on SoC Verification, Debug Tools
DAFCA Incorporated, the leading vendor of on-chip reconfigurable instruments and analysis tools for on-chip, at-speed silicon validation, and GiDEL, a leading supplier of reconfigurable systems for SoC verification and complex algorithm acceleration, will work closely to extend and enhance the integration of their two product families, so that the resulting products will deliver a comprehensive suite of verification/debug tools for teams using GiDEL’s reconfigurable PROC(tm) systems and DAFCA’s ClearBlue(tm) reconfigurable instruments. The combined solution will accelerate system-level transaction, function, and protocol validation, and provides a robust RTL source-level debugging capability.
Vitesse Launches VSC3406 Multi-rate Backplane Transceiver
Vitesse Semiconductor Corporation (Pink Sheets:VTSS), a leader in high-speed communication IC solutions, announced the VSC3406, a 6.375 Gigabit per second (Gbps) multi-rate backplane transceiver. The VSC3406 builds upon Vitesse’s portfolio of proven, industry-recognized technology, incorporating the latest clock-data recovery (CDR) techniques and signal integrity toolset for backplane and interconnect design.
austriamicrosystems Unveils AS3532 HD Audio Player IC for Music Phones
austriamicrosystems (SWX:AMS), a leading global designer and manufacturer of high performance analog ICs for communications, industrial, medical and automotive applications, announces the first member of a new family of media player ICs based on innovative IP aimed at bridging the gap between the audio experience of music phones and Hi-Fi home audio devices.
Global Semiconductor Alliance Rolls Out IPecosystem Tool Suite 4.0
Global Semiconductor Alliance (GSA) announces the release of its IPecosystem (IPe) Tool Suite Version 4.0 that addresses the risk factors and risk assessments of intellectual property (IP) integration. The update to the IPe Tool Suite will be introduced at DesignCon 2008, February 4 in Santa Clara, Calif. Version 4.0 includes the Hard IP Licensing Risk Assessment Tool, in addition to the Hard IP Quality Risk Assessment Tool previously released.
Microchip Announces Academic Partner Program
Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, announced the creation of the new Microchip Academic Partner program, providing an opportunity for academia to increase their knowledge base in embedded applications. The program, which offers free local training and curriculum to educators via Microchip’s Regional Training Centers (RTCs) and Web site; as well as discounts on development tools and software for both students and educators, is also expanding beyond universities to the K-12 grade levels.
Xilinx Presents, Demonstrates at DesignCon 2008
Xilinx Inc. (Nasdaq: XLNX), the world’s leading supplier of programmable logic solutions, outlined plans for participation at next week’s DesignCon 2008 conference, including an FPGA industry business forum panel, DesignVision awards, high-speed serial backplane conference session and a Virtex(TM)-5 FPGA enabled cell broadband demonstration.