MMCA, JEDEC Publish Embedded MMC and Card Product Standard v4.3
The MultiMediaCard Association (MMCA) and the JEDEC Solid State Technology Association (JEDEC) announced their joint publication of version 4.3 of the Embedded MMC (eMMC) and Card Product Standard. The specification marks an important step in the evolution of eMMC as an industry-leading memory technology, providing a standardized protocol for embedding mass storage flash memory on host systems. The new features build on the eMMC standard, which is currently supported by all major handset and navigation product manufacturers.
Digi Introduces Connect WAN 3G Upgradeable Wireless WAN Router
Digi International (NASDAQ:DGII) introduced the Digi Connect WAN 3G, an upgradeable third generation (3G) Wireless WAN router for primary and backup connectivity to remote sites and devices. It is a targeted function Ethernet-to-cellular router that supports both HSDPA and EVDO 3G standards and adds a cost optimized, high-speed solution to Digi’s industry leading line of cellular routers.
AWR Reveals Seminar Schedule for North America, Australia
AWR, the innovation leader in RF EDA, will demonstrate how the latest versions of Microwave Office, Visual System Simulator (VSS), and AXIEM software can be the innovative tools behind the scenes that empower designers to deliver their next-generation electronic devices faster, more reliably, and at a lower cost. Technical experts will showcase AWR industry-first technologies: VSS RFA RF architectural tool, AXIEM three-dimensional (3D) planar electromagnetic (EM) software, and Microwave Office ACE(tm) automated circuit extraction tool.
SIDSA Unveils Enter e1 Demodulator plus Application Processor Chipset
SIDSA enters the DVB-H semiconductor market with its new Enter e1 demodulator plus application processor chipset. This new chipset complements the current offering of Intellectual Property for DVB-H demodulator. SIDSA is the leading provider of DVB-H demodulator Intellectual Property and counts as IP customers to three of the top semiconductor vendors.
Rudolph Technologies Announces AXi 940 Macro Defect Inspection Module
Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced the availability of the AXi 940 macro defect inspection module. The new AXi 940 module will perform wafer frontside inspection as part of the all-surface Explorer(tm) Inspection Cluster—a multi-surface inspection system designed to deliver fast, accurate and reliable macro inspection at a low cost-of-ownership. The new module is featured at this week’s semiconductor manufacturing industry trade show, SEMICON® Korea, in Seoul.
SIDSA Enables Live DVB-H Mobile TV Coverage of CSTB Show in Moscow
SIDSA will be the only company to bring live DVB-H Mobile TV signals to one of the most important trade shows in Russia, the CSTB, that will take place in Moscow, 4th to 7th February. SIDSA will use transmitters from its partner MIER Communications and will showcase the services in Samsung mobile TV phones. SIDSA has a strong presence in Russia, with a commercial office in Moscow, and providing the technology to one of the first DVB-H pre-commercial networks worldwide in the city of Yekaterinburg.