FPGA and EDA Highlights – 2007.12.21

Webcast: Evaluating Implementation Choices for Low-Power Digital Sound in SOCs
Tensilica has an on-demand webcast entitled, “Evaluating Implementation Choices for Low-Power Digital Sound in SOCs.”

Darnaw1 FPGA Module
Darnaw1 is a Spartan(TM)-3E FPGA module from Enterpoint. The module enables the use of FPGA technology in industrial and military sectors where the volume or assembly technology available precludes the use of BGA packaged FPGA devices. Encapsulating all the elements to support operation of the FPGA, the module has a simple to solder PGA pinout and operates with a single 3.3V power supply.

Nextreme Copper Pillar Bump for Flip Chip Packaging
Nextreme has integrated cooling and power generation into the widely accepted copper pillar bumping process used in high-volume electronic packaging. The innovation in flip chip process technology addresses two of the most serious issues in electronics today – thermal and power management constraints. Nextreme’s approach uses proven, fully scalable technology to deliver new, enabling functionality in flip chip applications.

AKA LCD Controller IP
Advanced Knowledge Associates (AKA) announced that LCD driver core IP is now available as standard on its range of Prepackaged Reconfigurable Integrated System-on-Module (PRISM) solutions. This removes the need for any external controller or device because video displays can be driven directly from the PRISM’s FPGA. It also simplifies the process of integrating LCD and TFT displays into embedded systems.

Embedded Ethernet Applications Market
Ethernet semiconductor vendors will continue to reap benefits from existing fast Ethernet (FE) and gigabit Ethernet (GE) product lines during the 2007-2012 forecast period. However, the more attractive opportunity is the embedded Ethernet applications segment, particularly blade switching and storage networking. With a worldwide CAGR of 6.3% through 2011, this segment will encourage the long-awaited adoption of 10GE technology and provide additional, more robust revenue streams.

Actel IGLOO Icicle Kit
Actel Corporation’ $99 Icicle(TM) Kit enables designers to easily and rapidly program, evaluate, and modify low-power IGLOO-based portable designs. The 1.4″ x 3.6″ Icicle evaluation board, which is powered by a lithium-ion battery, consumes less than one-seventh the power of competitive FPGA development solutions in a design the size of a small cell phone. Actel’s Icicle Kit allows designers to closely examine power consumption in various modes.

Linux in the Embedded Systems Market
According to Venture Development Corporation (VDC), a significant portion of embedded software and systems engineering teams continue to adopt Linux as their primary target operating system. VDC’s research also suggests that this migration may be lasting, as the majority of current Linux users surveyed plan to use Linux again as their primary operating system on future projects.

Aldec Active-HDL 7.3
Aldec, Inc. released Active-HDL 7.3 today. The 7.3 release includes multi-threaded HDL compilation, new waveform viewer, and expanded VHDL 2006 construct support. The new version improves performance in VHDL, Verilog, and mixed RTL compilation and simulation. Active-HDL is a mixed-language design creation, FPGA Project Management and simulation environment supporting VHDL, Verilog, SystemVerilog, and SystemC.

World Markets for Microcontrollers in Automotives
According to Frost & Sullivan, the proliferation of electronic content in automobiles aimed at reducing human errors as well as the growing number of automobile safety features such as additional radars, ultra sonic sensors, cameras, and automatic parking assistance are increasing demaind for microcontrollers. In addition, the introduction of multiplexing in the automotive industry has triggered sales of high performance microcontrollers by amplifying the need for additional processing power and intelligence. According to a Frost & Sullivan report, the automotive microcontroller market generated revenues of $5.83 billion in 2006 and will reach $9.52 billion in 2010.

Pentek Model 7141 Dual Multiband Transceiver
Pentek’s Model 7141 Dual Multiband Transceiver with FPGA is a complete software radio system for connection to HF or IF ports of a communications system and joins Pentek’s family of high-performance PMC/XMC transceiver modules. Model 7141 is an enhanced successor to Pentek’s Model 7140 transceiver, which is widely deployed by many customers for SIGINT, software radio, and communications applications. Pentek has significantly boosted analog performance in the Model 7141 so that the signal-to-noise ratio and the spurious free dynamic range are improved by 10 dB, when compared to many competitive products.

2006-2012 Worldwide Handset Semiconductor Forecast
According to In-Stat, semiconductor components in handsets are the largest semiconductor market in the world by volume, if not in total revenue. In 2007, total revenue from handset semiconductors will exceed $31 billion worldwide.

SANYO CCA-BC200 Automotive Backup Camera System
SANYO Electric Co. selected Altera Corporation’s (NASDAQ: ALTR) Cyclone® II FPGAs and Nios® II embedded processor for the CCA-BC200 Automotive Rear-View Backup Camera System. The Cyclone II FPGA featuring a Nios II embedded processor provides SANYO with a high-performance image-processing solution that minimizes distortion in wide-angle views and hard-to-interpret perspectives. The single-chip FPGA-based approach provides a more compact and reliable solution compared to digital signal processing (DSP) device-based approaches, which typically require two or more devices.