Intel Rolls Out Fibre Channel over Ethernet Software Package for Linux
Intel Corporation has released a software initiator package to drive the development of Fibre Channel over Ethernet (FCoE) solutions for the Linux operating system. FCoE is a proposed specification that will allow Fibre Channel SAN traffic to run over Ethernet. By consolidating LAN and SAN traffic onto a single fabric, FCoE will simplify network infrastructure in the datacenter.
Rudolph Acquires Applied Precision’s Semiconductor Business
Rudolph Technologies, Inc. (NASDAQ:RTEC), a leading provider of process characterization equipment and software for thin film measurement and macro defect inspection, announced that it has signed an agreement to acquire the net assets of the semiconductor business of Applied Precision®, LLC. Applied Precision, headquartered in Issaquah, Washington, provides precision wafer probe card metrology systems and wafer probe process management systems to semiconductor final manufacturing facilities.
Strategy Analytics Comments on MediaTek Acquisition of ADI Handset Unit
The Strategy Analytics RF & Wireless Component Strategies service has released, “Strategy Analytics: MediaTek Emerges as a World-Class Baseband Supplier,” reporting on the MediaTek acquisition of the Analog Devices Handset Products portfolio.
ABI Research Publishes Report on Voice over Wi-Fi
While Voice over Wi-Fi (VoWi-Fi) has made some inroads in consumer markets, several inhibiting factors are temporarily restraining its adoption by business, according to a new study from ABI Research.
AnalogicTech Unveils AAT3663 Battery Charger IC for Dual Cells
Advanced Analogic Technologies Incorporated (AnalogicTech) (Nasdaq: AATI), a developer of power management semiconductors for mobile consumer electronic devices, announced the AAT3663, the first in a family of new 1A linear battery charger ICs capable of charging up to two Li-ion cells in series. Designed to operate from either an AC adapter or a USB port, this new device features AnalogicTech’s innovative Digital Thermal Loop charge reduction circuit which monitors the internal die temperature and gradually steps down the charge current to avoid thermal shutdown.
Toshiba, IBM to Collaborate on 32nm CMOS Process Research
IBM (NYSE: IBM) and Toshiba Corporation announced that they have entered into a joint development agreement on 32nm bulk complementary metal oxide semiconductor (CMOS) process technology. Since December 2005, IBM and Toshiba have collaborated on fundamental advanced research related to semiconductor process technologies at the 32nm technology generation and beyond at the research facilities in Yorktown and Albany, New York. Building on the success of this ongoing research collaboration, the two companies have agreed to extend the scope of the joint development work to now include 32nm bulk CMOS process technology.
NI, Emona Introduce Digital Analog Telecommunications EXperimenter
National Instruments (Nasdaq:NATI) and Emona Instruments, a National Instruments Alliance Partner, are working together to help educators teach students analog and digital communication fundamentals with the release of a new add-on telecommunications board, the Digital Analog Telecommunications EXperimenter (DATEx) for the NI Educational Laboratory Virtual Instrumentation Suite (NI ELVIS). With DATEx and the NI ELVIS integrated design and prototyping platform, students now can visualize telecommunications concepts in a hands-on learning environment. DATEx also operates with the NI LabVIEW graphical development environment to give students more control for building telecommunications projects using the graphical system design and block diagram approach.