News – 2007.11.08

Renesas Designs RX Complex Instruction Set Computer CPU Architecture
Renesas Technology Corp. announced that it has completed the design of an innovative new CISC(1) (Complex Instruction Set Computer) CPU architecture that will deliver unmatched capabilities in code efficiency, processing performance, and power consumption for a future generation of Renesas’ CISC microcontrollers (MCUs). Products based on the new architecture will be branded as the ‘RX’ family.

GE Fanuc Introduces CM6 3U CompactPCI Single Board Computer
Demonstrating once again the company’s ability to deliver maximum functionality in the smallest space, GE Fanuc Intelligent Platforms announced the rugged CM6 3U CompactPCI single board computer. Featuring a Freescale(TM) PowerPC(TM) MPC8641 operating at up to 1.33 GHz with either a single- or dual-core processor, the CM6 supports up to 1 Gigabyte of DDR2 SDRAM ECC memory. Designed for applications including military/aerospace, tele-communications, simulation/ training and test and measurement, both system mode and non-system mode are supported.

Trusted Logic, TRANGO Virtual Processors Secure Embedded Systems
Trusted Logic®, the leading provider of secure open technology for embedded systems, and TRANGO Virtual Processors(TM), a leading provider of embedded virtualization IP, announce they have teamed up to provide a complete security solution for the embedded systems market. The companies will focus on the payment terminal market, with applications on wireless devices.

Atheros Launches AR3031 ROCm Bluetooth SoC for Headsets
Atheros Communications, Inc. (Nasdaq: ATHR), a leading developer of advanced wireless solutions, announced the second member of its growing ROCm(TM) family of Bluetooth wireless solutions — the Atheros AR3031. This system-on-chip (SoC) meets the growing demand for Bluetooth wireless mono headsets by providing a powerful combination of market-leading power-efficiency, design flexibility and cost.

OKI Miniaturizes Camera Modules for Mobile Phones
Oki Electric Industry Co., Ltd. (TOKYO:6703) announced it has started a contract assembly service for W-CSP (Wafer level Chip Sized Package) semiconductors using through-hole technology. With this technology, OKI’s customers such as sensor and camera module manufacturers can now obtain camera modules that are half the size of conventional modules. In September, OKI established a volume production line for through-whole technology based W-CSP assembly at its production site in Tokyo and started operation in October.

CSR Integrates vTuner Internet Radio Portal into RadioPro Reference Design
CSR announced that it has integrated the vTuner internet radio portal into CSR’s RadioPro reference design. vTuner is an online service that provides access to over 11,000 radio stations around the world. The partnership with vTuner enables OEMs of RadioPro internet radios to provide their customers with a differentiated product with minimal time to market.

Leadis Technology Samples Charge-pump LED Drivers for Mobile Devices
Leadis Technology, Inc. (Nasdaq:LDIS), an analog and mixed-signal semiconductor developer of color display drivers, LED drivers, and audio ICs for mobile consumer electronic devices, announced sample availability of the LDS8866, LDS8865, and LDS8864, a new family of charge-pump based LED drivers that uses the company’s proprietary PowerLite(TM) Current Regulator to deliver up to 95% power efficiency for longer battery life.

Personal Navigation Devices to Exceed 100 Million Units by 2011
The consumer navigation market has seen unprecedented levels of activity and growth in 2007, mainly driven by PNDs (personal navigation devices) which offer a compelling mix of ease of use, features, portability, and affordability. As an established mass market CE category, PND markets will continue to grow strongly to reach a global sales volume of more than 100 million units by 2011. Dedicated PNDs will remain the preferred form factor for use in the car but will be complemented by handset-based systems for pedestrian navigation and new use cases such as outdoors. New form factors such as portable media players, ultra mobile PCs, Internet tablets and mobile Internet devices will also appear.

Broadcom Introduces 65nm 5-port Gigabit Ethernet Switch
Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, announced the industry’s first 65 nanometer (nm) 5-port Gigabit Ethernet (GbE) switch in a single-chip design that enables the ubiquitous deployment of GbE connectivity to consumer electronic devices and home networking equipment. 65nm process technology allowed Broadcom to develop an intelligent switching solution with the industry’s smallest footprint, achieving unprecedented performance and a 30% reduction in power versus previous generations of Broadcom® silicon. For the first time, a GbE switch is now available with a power level and price point that can drive the transition from Fast Ethernet (FE) to GbE in home routers, residential gateways, set-top-boxes and other consumer electronics devices.

Roamware Receives Approval for Roaming Patent
The European Patent Office recognized Roamware, Inc.’s thought leadership in the field of international mobile connectivity and roaming by awarding Roamware exclusive patent rights for its invention of a “Method and System for Cellular Network Traffic Redirection” (European Patent Number 1527653). The invention, now embraced by the GSM Association’s mobile industry standards known as “Steering of Roaming”, empowers a mobile roamer’s home network operator’s system to direct any of its subscribers to roam on its preferred roaming partner’s network when using their mobile phones abroad.

EA Games Run on Broadcom’s VideoCore Mobile Multimedia Processor
Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, announced that it has signed an agreement with Electronic Arts Inc. (EA) to enable popular EA Mobile(TM) game titles on mobile phones powered by Broadcom® solutions. The game titles will be optimized for the latest generation VideoCore® III mobile multimedia processor from Broadcom that supports high definition (HD) content and a new level of mobile phone graphics performance equivalent to today’s dedicated handheld game consoles. This agreement enables EA to deliver games into handsets that contain Broadcom silicon as these handsets come to market.