News – 2007.10.17 – Late Edition

Silicon Integration Initiative Announces Si2 OpenAccess+ Conference
The Silicon Integration Initiative (Si2) announced that its 11th OpenAccess+ Conference will be held on November 5, 2007, at Sun Microsystems’ Santa Clara Conference Center in Santa Clara, California. The Conference will feature speakers and demonstrations from several of the industry’s leading semiconductor and electronic-design automation (EDA) companies. Cadence Design System’s Ted Vucurevich, Sr. Vice President, Chief Technology Officer, Advanced Research & Development, will be providing the keynote address.

Agilent, Solution Technology Offer Fibre Channel Training
Agilent Technologies Inc. (NYSE: A) and Solution Technology, a technical training provider and book publishing company for high-tech companies, announced an agreement to provide training classes for developers, integrators and managers for Fibre Channel technology.

National Instruments Hosts Online Pan-European Automated Test Summit
National Instruments is hosting the first online Pan-European Automated Test Summit, which features technical sessions on identifying trends and overcoming new challenges in automated test. The Pan-European Automated Test Summit is a free, full-day event hosted live on the Internet on Nov. 27. During the summit, attendees can view keynote presentations, watch technical sessions, participate in live Q&A forums and interact with vendors in the exhibitor area. This event will be available on demand for 30 days after the live event.

Cadence Design Systems Forms Academic Network in Europe
Cadence Design Systems, GmbH (NASDAQ: CDNS), the leader in global electronic-design innovation, announced the formation of an academic network in Europe to promote the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence. This initiative will establish a knowledge network among selected European universities, research institutes, industry advisors and Cadence to facilitate the sharing of technology expertise in the areas of verification, design and implementation of microelectronic circuits.

Rapita RapiTime 1.3 Code Analysis Tool Supports Eclipse Standard
Rapita Systems have announced that their acclaimed software analysis tool RapiTime has undergone a number of significant updates, a key feature being that RapiTime is now integrated with the industry standard Eclipse IDE. Rapita’s state-of-the-art RapiTime worst-case execution time analysis solution has enjoyed a great deal of success and recognition since its inception and the additional features are expected to broaden its appeal amongst embedded software developers.

BAE RAD750 Radiation-Hardened SBCs Control WorldView-1 Satellite
Two BAE Systems RAD750(TM) radiation-hardened single-board computers are managing the command and control functions onboard the WorldView-1 satellite, launched Sept. 18 aboard a Delta II rocket. WorldView-1 was built by Ball Aerospace and owned and operated by DigitalGlobe in Colorado. It is part of the National Geospatial Intelligence Agency’s NextView program, which will provide high-resolution images of Earth. NextView is a new generation of imaging satellites capable of collecting geospatial intelligence in support of national security.

Two Pi Selects AMI Ezairo 5900 DSP Platform
AMI Semiconductor (NASDAQ:AMIS), a designer and manufacturer of state-of-the-art mixed-signal and digital products for the automotive, medical, industrial, and military/aerospace sectors, announced that Two Pi Signal Processing Applications GmbH (Two Pi), a specialized provider of advanced software solutions addressing hearing loss and communications in noisy environments, has selected the Ezairo 5900 series of integrated circuits and packaged hybrids to further develop its suite of sound processing algorithms for hearing aid devices.

iBiquity Digital Expands HD Radio Seminar in China
iBiquity Digital’s recent HD Radio Seminar in Shenzhen, China, held on the eve of the Hong Kong Electronics Fair, had to be expanded this year to accommodate increased demand from Asian component and product manufacturers. More than 300 executives, product planners, design engineers and production managers attended the two-day program which included presentations on topics such as product certification, factory setup, product design and planning. Companies attending represented a wide range of partners from test and support services, to module manufacturers, ODMs, and brands from China, Hong Kong, Japan, Korea, and Taiwan all developing HD Radio products.