Thermo Electric Generator Powers Wireless EEG System
IMEC has developed a 2-channel wireless EEG (electroencephalography or monitoring of brain waves) system powered by a thermo-electric generator. It uses the body heat dissipated naturally from the forehead. The wearable EEG system operates completely autonomous and maintenance-free with no need to change or recharge the batteries. This is a major advantage for body-worn sensors, a key theme in the Human++ program within the Holst Centre.
Intel Unveils Q35 Express Chipset for Embedded Systems
Intel Corporation announced extended lifecycle support for the Intel® Q35 Express Chipset for embedded and communications applications requiring graphics. The Intel Q35 chipset allows a 50 percent power savings over the previous-generation Intel® Q965 Express Chipset. With a 13.5-watt thermal design power, the chipset is ideal for low-power, small motherboard form factors for interactive clients, print imaging, digital security surveillance and network security applications, such as the 17×17cm Mini-ITX.
Freescale, Continental Team on Multi-Core 32-bit Microcontroller for EBS
Continuous advances in microelectronics are helping make electronic braking systems (EBS) more reliable, responsive and affordable for mainstream vehicles. To enable the next generation of EBS and chassis control systems, Freescale Semiconductor and Continental Automotive Systems’ EBS business unit in Frankfurt have joined forces to design a high-performance, multi-core microcontroller (MCU) optimized for EBS applications.
Wind River, Freescale Create Enablement Platform for Embedded Market
Wind River Systems, Inc. (NASDAQ:WIND), the global leader in Device Software Optimization (DSO), and Freescale Semiconductor have introduced an enablement platform that addresses growth opportunities in the embedded mass market. The joint platform is designed to simplify and accelerate application development for embedded computing applications using Freescale’s multi-core MPC5121e processor and the Wind River Linux operating system (OS).
Lanner Electronics Unveils IAC-F850 PICMG 1.0 Single Board Computer
Lanner Electronics Inc, a global leader in embedded and industrial computing hardware, announced the addition of the PICMG 1.0 compliant IAC-F850 SBC, based on the Intel 82945G chipset, and offering support for the latest Intel Core 2 Duo processors.
Tensilica Ports MPEG-4 BSAC Decoder for DMB to HiFi 2 Audio Engine
Tensilica, Inc. announced that it has added a MPEG-4 Bit Sliced Arithmetic Coding (BSAC) decoder to Tensilica’s HiFi 2 Audio Engine, the most popular commercial audio core for system-on-chip (SOC) designs. This BSAC decoder is used in Digital Multimedia Broadcasting (DMB) applications, which allow radio, TV and datacasting to mobile devices, particularly mobile phones.
NI, Anritsu Develop LabVIEW, LabWindows/CVI Instrument Drivers
National Instruments (Nasdaq:NATI) and Anritsu Company announced a joint effort to develop LabVIEW Plug and Play and LabWindows/CVI instrument drivers for Anritsu test instruments. The companies are working together to make it easy for engineers and scientists to combine the popular LabVIEW graphical development platform and the proven LabWindows/CVI ANSI C integrated development environment with Anritsu RF and wireless communications test instruments.
Cirronet Introduces ZMN2405HP ZigBee OEM Modules
Cirronet, Inc. (a subsidiary of RF Monolithics, Inc. (NASDAQ: RFMI)) announced immediate availability of the latest in ZigBee(TM) technology in its new ZMN2405HP original equipment manufacturer (OEM) modules. The new single-chip ZigBee products feature the Cirronet proprietary CSM profile that virtually eliminates OEM design engineer programming requirements when adding ZigBee wireless connectivity into their products. The 65mW ZMN2405HP provides robust performance with exceptionally low power consumption (25dB of output power adjustment is provided through software configuration allowing use under ETS 300328 rules).
eRide Announces Opus III eZ GPS, A-GPS Chip
eRide, Inc., a leader in Global Positioning System (GPS), Assisted GPS (A-GPS) and Satellite Navigation Technology, announced its new Opus III eZ(TM) chip which provides a unique solution for true positioning indoor and in harsh environments to markets ranging from handset to personal navigation devices, automotive, tracking, and security.
hueggenberg Offers Course on DSP Theory, Algorithms, Architectures
hueggenberg gbr, the experts for technical training courses, are offering a technical course on theory, algorithms and architectures of digital signal processing. The course is taking place from November 6th to 9th, 2007, in Munich. The syllabus of this four day course held in English spans all the way from the basics of signal processing and the generic DSP system via frequency domain analysis, digital filtering, DSP software/hardware, DSP audio/baseband processing, signal (audio) source coding, adaptive DSP algorithms, computationally efficient DSP linear systems, digital communications, DSP for mobile and wireless down to DSP (software) enabled radio architectures and DSP on FPGAs.
RadiSys Introduces Endura Motherboards with Intel Q35 Express Chipset
RadiSys Corporation (NASDAQ:RSYS), a leading global provider of advanced embedded solutions, announced the introduction of three advanced motherboards that are compatible with today’s Intel® Core(TM)2 Duo processors. The latest addition to RadiSys’ Endura® portfolio of motherboards, the new boards are based on the Intel® Q35 Express chipset which provides enhanced graphics performance, support for the latest DDR2-800 memory technology, more USB 2.0 ports for a larger number of external peripherals, support for external SATA drives and greater energy efficiency.
Tundra Debuts Serial RapidIO Switch with PCI Bridging, FPGA Interface
Tundra Semiconductor Corporation (TSX:TUN), a leader in System Interconnect, introduced the Tsi620 (TM), an innovative multi-standard Serial RapidIO Switch that lowers 3G baseband costs by bridging RapidIO-based DSP clusters to low cost embedded processors and FPGAs.
Freescale MPC8360E-RDK Supports INTEGRITY RTOS, EtherNet/IP, DeviceNet
A comprehensive platform for industrial markets from Freescale Semiconductor is attracting support from a growing number of industrial software and protocol providers. As a result, manufacturers can now quickly and easily incorporate a safety-certified operating system and two popular networking communication protocols when creating next generation industrial control solutions.
Microchip Launches MCP41XX/42XX Digital Potentiometers with SPI
Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, announced the MCP4141/2, MCP4241/2, MCP4161/2 and MCP4261/2 (MCP41XX/42XX) non-volatile digital potentiometers. The 7- and 8-bit devices have a SPI interface and are specified over the extended industrial temperature range of -40 to 125 degrees Celsius. They are available in several industry-standard packages, including the popular 3 mm x 3 mm DFN package.
General Software Customizes BIOS for Windows-based HLX Hobart Scale
General Software, Inc. has been selected by Hobart to help design a customized BIOS for the Windows-based HLX Hobart scale used by grocery stores to reduce “shrink” and increase profits within deli and produce departments. By partnering with General Software, Hobart gained a huge time-to-market advantage, shaving off four months from a 14 month-long development phase.
AFORE, Cavium, GE Fanuc Team on Carrier Grade Ethernet Platform
AFORE Solutions, Inc., Cavium Networks, and GE Fanuc Intelligent Platforms, leaders in the embedded computing industry, announced their joint effort to deliver a Carrier Grade Ethernet (CGE) platform to provide the reliability and dependability of SONET transport networks for CGE. A live demonstration at the AdvancedTCA Summit, October 16 – 18, allows participants to view this hardware and software solution providing CGE on a packet processor AdvancedMC/MicroTCA platform.
GE Fanuc Introduces bCOM2-L1000 Module, CCAR-L1000 Carrier
Confirming the company’s strategy to address a broad range of applications that require powerful embedded computing solutions in constrained spaces, GE Fanuc Intelligent Platforms announced its first COM Express products with the bCOM2-L1000 Type 2 module and the CCAR-L1000 carrier. Designed for applications including industrial, simulation/training, test and measurement, gaming and transportation, the bCOM2-L1000 offers a choice of Intel® Core(TM)2 Duo, Core(TM) Duo or Celeron processors with up to 2 Gigabytes of memory, and is supported by the CCAR-L1000 carrier board for customer evaluation of the bCOM2-L1000.