ARM Launches RealView Profiler Embedded Software Analysis Tool
ARM (LSE:ARM) (Nasdaq:ARMHY) announced at the ARM(R) Developers’ Conference, Santa Clara, Calif., the launch of the RealView(R) Profiler, a unique tool specifically designed to enable non-intrusive analysis of software performance and code coverage of real system workloads running over minutes, hours or days. Using the tool, developers can typically improve the performance of their application by more than 20 percent, while at the same time enabling reduction of the ROM size requirements by a similar amount. The RealView Profiler also includes comprehensive analysis of both statement and branch code coverage, enabling software testing to achieve and demonstrate 100 percent code coverage to ensure the highest levels of software validation.
STMicroelectronics Rolls Out Nano Three-Axis Linear Accelerometers
STMicroelectronics (NYSE: STM), one of the world’s leading manufacturers of MEMS (Micro Electro-Mechanical System) devices, introduced a new generation of ‘nano’ three-axis linear accelerometers. The versatile, low-power MEMS sensors provide complete output flexibility and embedded smart features, meeting the exploding demand for miniaturized motion-sensing solutions in the consumer and industrial markets.
TI Introduces TMS320C6452, TMS320C6455 Digital Signal Processors
Designers of telecom access infrastructure equipment can now double the number of VoIP and conferencing channels per dollar, lowering system cost and power while boosting overall performance. Texas Instruments Incorporated (TI) (NYSE: TXN) announced the availability of the high-performance, cost-effective TMS320C6452 digital signal processor (DSP) designed to optimize price and performance for today’s process intensive multi-channel infrastructure and medical imaging systems. Simultaneously, TI has strengthened its performance leadership position by announcing that the TMS320C6455 DSP at 1.2-GHz is the world’s fastest single core DSP.
GreenPeak Debuts Battery-Free Wireless Communication for Sense, Control
GreenPeak Technologies announced a revolutionary new product portfolio for ultra-low-power wireless sense and control networks. The new company offers open standard, easy-to-install wireless communications devices for sensor applications that can operate without power cabling or a battery.
Fraunhofer IIS Offers First Embedded Implementations of MPEG Surround
MPEG Surround brings universal surround sound to any digital broadcasting system in an easy and cost efficient way. It allows high quality surround sound at low bit rates and avoids simulcasting of stereo and surround programs while being compatible with mono and stereo receivers. Fraunhofer IIS presents the world’s first MPEG Surround decoder implementations on fixed-point processors from Analog Devices and Freescale.
Compound Semiconductor Industry to Spend $2 Billion
Strategy Analytics has predicted consolidation in the compound semiconductor industry, but industry player strategies have matured beyond simply buying competitors for market share. Companies now look for valuable intellectual property and opportunities to expand product portfolios into multiple new markets.
Broadcom Samples VideoCore III Multimedia Processor for Mobile Handset
Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, announced sampling of the industry’s first low power multimedia processor that enables a high definition (HD) video camcorder and playback in cell phones and portable media players. The Broadcom® VideoCore® III multimedia processor also supports an up to 12 megapixel digital camera and delivers high performance yet ultra-low power 3D graphics for a world-class gaming experience. HD video, 3D games and high resolution 12 megapixel pictures can be displayed at top quality on full-sized HD televisions and monitors using an on-chip industry standard HDMI interface.
TI Introduces Puma 5 DOCSIS 3.0 Based Cable Modem Chipsets
Texas Instruments Incorporated (TI) [NYSE: TXN] announced that the company is delivering on its promise to introduce the Puma 5 family of DOCSIS® 3.0-based (Data Over Cable Service Interface Specification) cable modem chipsets to support CableLabs® DOCSIS 3.0 testing in Certification Wave 56. This milestone will help drive the next wave of cable modem innovation and services.
Texas Instruments Announces Digital Audio Amplifier Power Stages
Texas Instruments Incorporated (TI) (NYSE: TXN) introduced its next generation of high-performance digital amplifier power stages. The TAS5352 is capable of continuously driving two channels at 100 Watts (W), and the TAS5342 is capable of driving 125 W per channel at 10 percent total harmonic distortion plus noise (THD+N) into a 4-ohm load. Their high signal-to-noise ratio (SNR) of 98 dB allows manufacturers to meet consumer demand for high performance audio and home theater applications, such as high-power DVD receivers, home theaters in a box and mini component systems.
ARM, EVE to Create High-End Co-Emulation Environment
EVE, the leader in hardware/software co-verification, announced that it has signed a partnership agreement with ARM where both companies have agreed to integrate their tools to produce a high-end co-emulation environment. The ARM® RealView® SoC Designer electronic system level (ESL) design software will be coupled and integrated with EVE’s ZeBu hardware-assisted verification platform for early architectural exploration and prototyping. This co-emulation environment will allow complete system level ARM technology-based SoC modeling including the use of existing register transfer level (RTL) code and offer the ability to migrate from models to RTL implementation.
PCI Express Integrators List Gains Three More PLX Chips
PLX Technology, Inc. (NASDAQ: PLXT), the leading global supplier of PCI Express® (PCIe®) switch and bridge silicon, announced three more PCIe products have passed the stringent interoperability and compliance testing needed to be included on the PCI-SIG® integrators list. There now are 25 PLX® PCIe switches and bridges on the venerable list today, with several more in development.
QUALCOMM Licenses 3D Graphics Core Technology from AMD
AMD (NYSE: AMD) announced an agreement to license cutting-edge graphics core technology to QUALCOMM Incorporated, a leading developer and innovator of advanced wireless technologies and mobile data solutions, for next-generation chipsets. This intellectual property (IP) licensing agreement is part of each company’s ongoing commitment to drive a strong mobile gaming ecosystem and unleash state-of-the-art graphics across a range of handheld devices to delight mobile consumers everywhere.
Carbon Design Systems CTO to Present Power Optimization at ARM Conference
Bill Neifert, chief technology officer at Carbon Design Systems(TM), the leading supplier of tools for the automatic creation, validation and deployment of virtual hardware models, will present, “Understand How to Implement Software-Driven Power Optimization,” during ARM Developers’ Conference.