EVE Hosts Billion-Cycle Challenge Seminars
EVE, the leader in hardware/software co-verification, announced that it will host a series of seminars to address the “Billion-Cycle Challenge,” or when a design team can no longer manage a billion cycles with ordinary simulation. Each seminar, which run from 9 a.m.–noon, will demonstrate a different kind of approach through the use a proven verification methodology known as hardware-assisted verification.
Open Kernel Labs Announces OKL4 for FIC’s OpenMoko Smart Phone
Open Kernel Labs (OK), a global provider of embedded systems software and virtualization technology, announces the availability of OKL4 for FIC’s OpenMoko Neo1973 smart phone and the FancyPants advanced GUI platform from Fluffy Spider Technologies (FST). The products will be demoed at the upcoming ARM Developers Conference (Booth 511).
Broadcom Rolls Out Single-Chip GPS Solution for Mobile Applications
Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, announced its first single-chip global positioning system (GPS) solution, highlighting the company’s successful integration of its Global Locate acquisition and its commitment to delivering the industry’s best GPS technology. The GPS receiver sets new standards in performance and power consumption with state-of-the-art sensitivity and navigation performance, and less than half the power consumption of competitive solutions. The new Broadcom(R) chip and associated software will be demonstrated at this week’s Institute of Navigation (ION) conference in Ft. Worth, Texas beginning tomorrow.
Cypress Creates Smallest USB Transceiver
Cypress Semiconductor Corp. (NYSE:CY) introduced a high-speed USB 2.0 transceiver available in the industry’s smallest package. The new MoBL-USB(TM) TX3LP18 transceiver is offered in a 20-pin WLCSP (Wafer Level Chip Scale Package) package that measures only 2.2 mm x 1.8 mm — almost three times smaller than a standard golf ball dimple. In addition to having a footprint 20 percent smaller than any competitive solutions, the device offers ultra-low power consumption. This combination saves board space and prolongs battery-life for a wide range of portable applications such as mobile handsets, PDAs, PMPs, and GPS units.
Pyxis Technology, PDF Solutions Drive Higher Yields
Pyxis Technology, the design for manufacturing (DFM) routing company, announced that it is delivering software products based on a multi-year license agreement with PDF Solutions. PDF Solutions’ process-characterized yield data is utilized directly within Pyxis’ NexusRoute DFM-aware yield-driven auto router. Pyxis and PDF Solutions have been working together since early 2006 to leverage the pDfx(R) technology to address manufacturing complexities of routing in advanced technology nodes. The incorporation of pDfx(R) into NexusRoute is designed to deliver faster design closure and yield ramp to clients and better predicted yield for designers by bringing real world manufacturing data directly into the integrated circuit (IC) implementation phase.
Avnet Unveils EXP Modules for FPGA Development Boards
Avnet Electronics Marketing Americas, a part of Avnet, Inc. (NYSE: AVT), announces the release of three new EXP expansion modules for EXP-enabled FPGA development boards…
GDA Technologies Introduces Data Cruncher PCI-Express Card
GDA Technologies, Inc. (San Jose), a fast growing IP and Electronic Design Services (EDS) company announced the market-leading availability of the “Data Cruncher” PCI-Express card equipped with a Quad port Gigabit Network Interface using Freescale Semiconductor’s MPC8548E PowerQUICCIII(TM) processor built on Power Architecture(TM) technology.
Texas Instruments Technology Powers Chinese Handsets
Texas Instruments Incorporated (TI) (NYSE: TXN) announced that two Chinese manufacturers are using TI integrated wireless technology for handsets shipping worldwide. Amoi Electronics Co., Ltd. and TCL Communications Technology Holdings Limited (TCL) are using TI technology to bring a range of handsets to consumers around the world, from ultra low-cost phones to affordable, feature-rich smartphones. Amoi and TCL join a premier list of China-based TI customers, including Bird, Konka and Lenovo. TI is a long-time supporter of local Chinese manufacturers and was among the first wireless chipset suppliers to support the booming China mobile phone market with its first mobile phone design-win in 1998. The announcement builds on the long-term relationship TI already enjoys with Amoi and TCL.
Renesas Selects Cadence 45nm Encounter Statistical Timing System
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, announced that Renesas Technology Corp., a leading worldwide semiconductor system solutions provider, has adopted the statistical static timing analysis (SSTA) technology from the Cadence(R) Encounter(R) digital IC design platform to be part of its next-generation design flow. This advanced statistical timing analysis and optimization technology—an integral part of the Cadence Encounter Timing System and SoC Encounter(TM) RTL-to-GDSII System—allows Renesas to accurately account for the effects of process variability in its leading-edge 45-nanometer digital designs. The benefits include reduced silicon-failure risk, improved design robustness and convergence, enhanced quality of silicon (QoS), significantly faster turnaround time and a streamlined sign-off flow.
Dubai Silicon Oasis Establishes IC Design Center with Synopsys
Synopsys, Inc. (NASDAQ: SNPS), a world leader in semiconductor design software, announced that the Dubai Silicon Oasis Authority (DSOA), the region’s innovation hub for high-technology industries, has chosen Synopsys’ Professional Services and Synopsys’ Pilot Design Environment to establish the Dubai Circuit Design (DCD) center. This center is the region’s first chip design center for physical implementation of advanced integrated circuits (ICs).