News – 2007.09.21

Texas Instruments Creates Smallest Digital Temperature Sensor
Texas Instruments Incorporated (TI) (NYSE: TXN) introduced the industry’s smallest low-power digital temperature sensor with SMBus/two-wire serial interface. Packaged in a SOT563, which is only 0.6mm tall including the leads, the TMP102 is 30 percent smaller than other leaded devices available today. The sensor features low quiescent current of 10uA (maximum) in the active mode and 1uA (maximum) in the shutdown mode. The extremely small size and the low power requirement make the TMP102 suitable for portable consumer electronics and other battery-powered end equipment.

Ramtron Launches VRS51L3072 8051 Microcontroller with 2K FRAM
Ramtron International Corporation (Nasdaq: RMTR), a leading developer and supplier of non-volatile ferroelectric random access memory (FRAM) and integrated semiconductor products, has launched the VRS51L3072, an 8051-based microcontroller with 2-kilobit (Kb) of non-volatile FRAM memory. Ramtron has added FRAM to its fast and flexible Versa 8051s for a quick and reliable non-volatile data storage and processing system that is ideal for saving system status, data logging, and storing nonvolatile variables in a range of applications from sensors and meters to industrial controls, instrumentation and medical devices.

Lambda Funds University Research
Leading power supply manufacturer Lambda UK is investing an initial $100,000 in a collaborative research project with The University of Sheffield. The initial 12-month project is with the Electrical Machines and Drives (EMD) Group at the University. The project is another example of Lambda’s investment in UK engineering, coming alongside its sponsorship of graduates and undergraduates.

WiMAX Forum Global Congress Events Reveals Speakers, Exhibitors
The WiMAX Forum(R) and Informa Telecoms & Media, producers of the WiMAX Forum Global Congress Events Series of trade shows and conferences, announced they have already secured participation commitments from ten executive keynote speakers and more than 30 sponsors and exhibitors for their 2008 Events Series. With commercial availability of Mobile WiMAX Certified(TM) products expected in 2008, the WiMAX Forum Global Congress Events Series promises to be the year’s premier industry event, bringing together WiMAX(TM) leaders from around the globe to address key market needs for adoption of certified WiMAX deployments and strengthening the network of operators, manufacturers and service providers within the WiMAX Forum.

ABF Industrielle Automation, Symeo Track Steel for voestalpine Grobblech
voestalpine Grobblech GmbH is equipping its plant in Linz/Austria with a new warehouse management and logistics system to optimise material throughput. To be able to determine the exact warehouse location of the steel sheets produced by voestalpine Grobblech at all times, project contractor ABF Industrielle Automation GmbH has decided to implement a radar location system from Symeo GmbH. The Munich company’s patented Local Positioning Radar (LPR) precisely determines where the gigantic cargo cranes pick up and put down the steel products and immediately sends this information to the warehouse management’s mainframe. This radar system is completely maintenance-free and is not affected by dirt or grease build-up.

Semiconductor Assembly Equipment Vendor Selects Telelogic
Telelogic (STO:TLOG) announced that it has signed a 776,684 USD agreement with a world leader in semiconductor assembly equipment. The agreement includes license, maintenance and professional service. The company, an existing user of Telelogic Rhapsody(R), the leading Model Driven Development (MDD) environment for embedded and real time systems and software applications, has extended the current usage to incorporate additional divisions.

SMIC Holds Technology Symposium
Semiconductor Manufacturing International Corporation (SMIC; NYSE: SMI and HKSE: 981) held its technology symposium in Shanghai on September 21st, 2007, attracting more than 300 customers, design services providers, technology partners, and vendors.