News – 2007.09.20

TI Reduces Component Count by 75% with Direct Down Conversion Demodulator
Expanding its broad portfolio of analog and digital signal processing products for wireless infrastructure base station manufacturers, Texas Instruments (TI) (NYSE: TXN) introduced a new monolithic, high-linearity quadrature demodulator for direct down conversion applications. The new device reduces the component count of the receive signal chain in 3G base stations by at least 75 percent, compared to superheterodyne architectures. The TRF3710 demodulator improves the RF receive signal chain by integrating all the devices required to go directly from RF to baseband onto one chip. With the addition of this device, TI now offers a more complete analog signal chain for wireless infrastructure.

Cymbet Rolls Out EnerChip Thin-Film Batteries for Embedded Systems
Cymbet Corporation announced at the Embedded Systems Conference in Boston the commercial availability of its EnerChip(TM) family of solid-state, thin-film batteries. For the first time, Cymbet’s technological advancements have made possible — in volume — a small form factor, highly rechargeable device to distribute energy. The solid state battery can be economically and reliably integrated as an embedded device or as a surface-mounted component.

Denali, Tokyo Electron Device Create DFI DDR2 SDRAM PHY for Xilinx FPGA
Tokyo Electron Device, Ltd. (TED), an electronics technology and trading company focused on semiconductor products, and Denali Software, a world-leading provider of electronic design automation (EDA) software and intellectual property (IP), announced the co-development and release of a DDR2 SDRAM PHY Design running on Virtex-5, the largest and fastest FPGA in the world, produced by Xilinx, Inc., compatible with DDR PHY Interface (DFI), which is the industry- standard interface for DDR memory controller and PHY.

EMA, AEi Roll Out Power IC Model Library 2.0b for Cadence PSpice
EMA Design Automation(TM), a full-service provider of Electronic Design Automation (EDA) solutions, and AEi Systems, a world leader in power electronics modeling and analysis, announced the release of version 2.0b of AEi Systems’ Power IC Model Library for the Cadence(R) PSpice(R) simulator.

PMC-Sierra Introduces PM8800 WiZIRD 2Tx/2Rx WiMAX MIMO RF IC Solution
PMC-Sierra, Inc. (Nasdaq:PMCS) has introduced its first WiMAX RF IC solutions for Femtocell base stations, Customer Premises Equipment, and Mobile Station designs. The PM8800 WiZIRD 2Tx/2Rx is the industry’s most integrated WiMAX RF IC solution with full 2Tx/2Rx Multiple In/Multiple Out (MIMO) capability to support a maximum downlink data rate of 63Mbit/s per sector and a peak uplink data rate of 28Mbit/s per sector in a 10MHz channel. The PM8800′s Multi-Band capability (2.3GHz -2.7GHz and 3.3GHz -3.8GHz) allows a single design to cover all popular licensed radio spectra in the world. These advanced features enable next generation consumer services such as gaming, video and voice conferencing, streaming media applications, as well as video posting and sharing (e.g.YouTube).

NXP, Adeneo Port .NET Micro Framework to LPC2000, LPC3180 Microcontrollers
NXP, the independent semiconductor company founded by Philips, and Adeneo, a Microsoft Windows(R) Embedded Gold Partner, announced that the Microsoft(R) .NET Micro Framework has been ported to support NXP’s popular LPC2000 microcontroller family based on the ARM7(TM) processor and the NXP LPC3180 microcontroller based on the ARM9(TM) processor.

MOSIS Announces IBM’s CMOS Image Sensing Technology Through MPW Service
MOSIS, a provider of low-cost prototyping and small volume production services for custom ASICs, announces availability of IBM’s image sensing technology (CIMG) through its multi-project wafer (MPW) service. This means that companies working on imaging applications for everything from camera phones to high end digital cameras can access the technology at less than one-tenth of the cost of using a dedicated wafer run. They share wafers with other designs, paying only for the proportion of each wafer that they use.

Synopsys DesignWare USB 2 NanoPHY, PCIe PHY IP Achieve SMIC 130nm Compliance
Synopsys, Inc. (NASDAQ: SNPS), a world leader in semiconductor design software, announced that its DesignWare(R) USB 2.0 nanoPHY IP achieved USB logo certification and its PCI Express (PCIe) PHY IP passed compliance testing when implemented in SMIC’s popular 130-nm G process technology. As the leading technology provider of complete IP solutions for PCI Express and USB 2.0, Synopsys continues to provide designers with high-quality IP that can be integrated with low risk and speed time to market with increased interoperability and standards compliance.

Microchip Technology Announces 1 Mb SPI Serial EEPROM Devices
Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller and analog semiconductors, announced the 25AA1024 and 25LC1024 (25XX1024)—the fastest (20 MHz) 1 Megabit (Mb) SPI serial EEPROM devices in the industry. The Company also announced the 25AA128, 25LC128, 25AA512 and 25LC512 (25XX128/512) 128 Kbit and 512 Kbit devices, meaning Microchip now provides serial EEPROMs across the entire SPI memory-density range (1 Kbit – 1 Mbit). All of the new devices are specified to operate up to 125 degrees Celsius (125°C), and all provide the features and performance for which Microchip’s entire portfolio of serial EEPROM devices is known, including over 1 million erase/write cycles and 200-year data retention.

MontaVista Joins LiMo Foundation
MontaVista(R) Software, Inc., the leading provider of Linux(R) for intelligent devices and communications infrastructure, announced that the company has joined the nonprofit LiMo Foundation to help LiMo’s mission of increasing the adoption of Linux operating system software in cell phones and other mobile devices.