New on EDA Blog – 2007.09.14

Kontron nanoETXexpress COM Standard
nanoETXexpress, which was defined by Kontron, is a new footprint variant of the Computer-On-Module (COM) standard. The nanoETXexpress specification is targeted to deliver extremely power-saving COMs with mid to high performance x86 technology on a footprint that is a mere 55 mm x 84 mm. This is 39% of the original COM Express module Basic form factor 125 x 95 mm footprint and 51% of microETXexpress (95mm x 95mm). The new COM form factor follows the PICMG COM Express standard and will be 100% compliant with the COM.0 Type 1 connector. The locations of the identically mapped pin-outs will also be 100% COM.0 compliant.

Ultracapacitors Challenge Batteries
Strategy Analytics has an interesting report about the possibility of ultracapacitors replacing batteries. Their report analyzed ultracapacitor potential, especially following the recent the Toyota Supra HV-R victory in the Tokachi 24-hour endurance race. The HV-R was equipped with ultracapacitors, instead of rechargeable batteries, for power storage.

Design and Verification Conference Call for Papers
The 2008 Design and Verification Conference (DVCon) is now accepting paper, panel and tutorial submissions. The DVCon Technical Program Committee is seeking topics about low-power design and verification, formal verification, multi-clock verification, design and verification case studies, verification and design release management, functional coverage and verification data management, verification methodology and testbenches, verification IP development, and appropriate academic and research information.

Mobile Phone Market – Q2 2007
IDC and Strategy Analytics recently released their mobile phone data. Global mobile phone shipments grew 11% year-over-year, to reach 258 million units in Q2 2007. According to both research firms, Samsung has moved past Motorola for the number two spot in global market share.