RadiSys Acquires Intel’s Modular Communications Platforms Business
RadiSys Corporation and Intel Corporation announced that they have signed a definitive agreement for Intel to sell certain assets of its modular communications platforms business to RadiSys. The acquisition will further RadiSys’ global leadership position in ATCA platforms and solutions for telecommunication equipment manufacturers worldwide and is expected to close in September, subject to normal closing conditions. The consideration for this transaction will consist of a purchase price of $25 million plus $6.75 million of inventory and other considerations. RadiSys expects the transaction to add at least $50 million of ongoing revenue per year once integrated into RadiSys’ operations.
Cadence Announces What You Design Is What You Get (WYDIWYG) Modeling
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, announced a broad set of new design products and capabilities for faster production of digital system-on-chip (SoC) designs. These new capabilities are included in advanced Cadence(R) SoC and custom implementation solutions that provide “what you design is what you get” (WYDIWYG) modeling and optimization for critical manufacturing variations during the design phase. This results in a manufacturing-intelligent physical implementation and signoff capability that correlates to foundry signoff.
Agilent Introduces Wireless Networking Test Set for Mobile WiMAX
Agilent Technologies Inc. (NYSE:A) introduced a wireless networking test set and OFDMA measurement application software, forming a complete one-box transmitter and receiver test solution for Mobile WiMAX devices. With its superior specifications and fast manufacturing test time, this solution effectively meets the needs of cell phone, ODM and CM manufacturing engineers testing WiMAX mobile subscriber devices or modules that use IEEE 802.16e-2005.
ARC, Cadence Announce CPF Low-Power Reference Design Methodology
ARC International (LSE:ARK) and Cadence Design Systems, Inc. (NASDAQ:CDNS), announced a new automated Common Power Format (CPF)-enabled low-power reference design methodology (LP-RDM) has been implemented in ARChitect, ARC’s patented processor configuration tool. This LP-RDM together with the Cadence(R) Low Power Solution ensures that ARC’s new Energy PRO technology is captured in RTL and implemented consistently throughout the design flow to GDSII. Users of the reference design flow may achieve up to a four-fold reduction of IP core power.
Ambarella Introduces Ambacast 3000 Video CODEC Chip
Ambarella, Inc., the leader in high- definition (HD) video compression semiconductors, announced a new video CODEC chip targeting the broadcast market. The Ambarella Ambacast 3000 processor more than doubles the computing power of its predecessors and can be programmed for increased video quality as well as encoding full 1080×1920 resolution HD at 60 frames per second in a single chip. The platform enables the design of broadcast encoders to increase picture quality; while the low power and high integration allows a reduced form factor and power consumption.
ARC Energy PRO Technology Lowers Core, Subsystem Power by 4x
ARC International (LSE:ARK), the leader in configurable multimedia subsystems and CPUs/DSPs, extended its leadership in enabling energy efficient system-on-chip (SoC) design by introducing “Energy PRO” technology that enables ultra low power operation. Configurability enables creation of power efficient cores. Energy PRO further reduces power consumption by as much as four fold. ARC’s new Energy PRO technology is supported by hardware and software solutions, and integrated with a new low power EDA flow and libraries that have been specifically optimized to Energy PRO.
MediaTek, Apache Target 65nm, 45nm Physical Design Challenges
Apache Design Solutions, the technology leader in power signoff and complete silicon integrity platform solutions for system-on-chip (SoC), analog, and system designs, announced that MediaTek, a leading fabless semiconductor company for wireless communications and digital media solutions, has selected Apache as their EDA partner for addressing 65 and 45nm physical design challenges. The MediaTek-Apache collaboration will focus on areas of power and noise, including power signoff, advanced low power and leakage optimization, reliability methodology, thermal integrity, and IC-package noise management.
Ramtron Launches FM111x 4-bit Quad State Savers
Ramtron International Corporation (Nasdaq: RMTR), a leading developer and supplier of non-volatile ferroelectric random access memory (FRAM) and integrated semiconductor products, has expanded its non-volatile state saver family with the quad state saver – a 4-bit FRAM-based device that retains logic states without power and restores outputs automatically upon power up. Any change in state is automatically recorded in the non-volatile ferroelectric latch, which is possible due to the fast writes, low power, and extremely high endurance of FRAM memory technology.
P-Product Ports Codec to Tensilica’s HiFi 2 Audio Engine
Tensilica, Inc. announced that P-Product has joined its Xtensions partner network. P-Product has already ported audio software to Tensilica’s HiFi 2 Audio Engine and has significant expertise in audio and video software porting.
Apache Design Announces Technology Seminars in Taiwan, Japan
Apache Design Solutions, the leader in power signoff and complete silicon integrity platform solutions for system-on-chip (SoC) designs, announced that the company will be hosting technology seminars in Taiwan and Japan on September 11 and 14, 2007, respectively. The first seminar “Silicon Integrity Signoff for 65/45nm Designs” will be held in Hsinchu, Taiwan focusing on the challenges associated with managing power and noise for SoC, analog, and system (IC-Package-PCB) designs. The second seminar “Design Challenges for 45/32nm” to be held in Yokohama, Japan will bring together industry speakers from STARC, Toshiba and Kobe University to share their views on the upcoming challenges of 45/32nm designs. Dr. Andrew Yang, CEO of Apache Design Solutions will be presenting at both seminars.
Avnet, SiliconSystems Team on Solid-State Storage for Embedded Market
Avnet Technology Solutions, a value-added distributor of enterprise computing products, embedded subsystems, software and services and an operating group of Avnet, Inc. (NYSE: AVT), and SiliconSystems, Inc., a world leader in advanced storage technology, announced that the two companies have signed a North American distribution agreement. Under this agreement, Avnet will distribute SiliconSystems’ complete line of SiliconDrive advanced storage products to embedded original equipment manufacturers (OEMs). Embedded OEMs will also be able to leverage Avnet’s world-class distribution, engineering, integration and logistics services to improve their time to market.
Mindray Implements Actel ProASIC3 FPGAs in Medical Monitoring System
Demonstrating the success of its low-power and power-efficient programmable technologies, Actel Corporation announced that Mindray Medical International Limited (NYSE: MR), China’s leading developer and manufacturer of medical devices, has chosen Actel’s flash-based ProASIC3 field-programmable gate arrays (FPGAs) for implementation in its portable patient monitoring systems. Selected for the low-power, enhanced security, performance, and firm-error immunity it offers, the 60,000-gate ProASIC3 A3P060 is being deployed to provide the highest possible levels of secure patient data management.