Teledyne Unveils Plastic HRIP Solid-State Power Controllers
Teledyne Microelectronic Technologies (TMT) announced the new PC605 Power Series; a family of 10 Amp to 25 Amp plastic encapsulated, HRIP (High Reliability Industrial Part) Solid-State Power Controllers (SSPC) designed for use in Power Management & Distribution for Defense and Commercial Aviation applications.
EnOcean Releases Developer Kit for Self-Powered Wireless Sensors
EnOcean released a Developer’s Platform that enables OEMs to design self-powered wireless sensors that do not require batteries or external power. The EVA 120C Evaluation Kit includes everything necessary to quickly develop and test ultra low power wireless sensor modules for a variety of electrical and electronics applications.
NEC Rolls Out Power MOSFETs with Ultra-Low On-State Resistance
NEC Electronics America, Inc. introduced the newest additions to its NP Series of low-voltage power MOSFETs with ultra-low on-state resistance [RDS(on)]. Featuring an innovative fabrication process and advanced packaging solution, the new NP160N040TUG and NP160N04TDG devices are designed to reduce leakage current, efficiently manage heat dissipation and enable one of the industry’s lowest on-state resistances, 2.0 milliohms (maximum). The new power MOSFETs are ideal for applications such as automotive systems, low-voltage DC motor controllers and uninterruptible power supplies, where high current capability, stringent power management and reliability are required.
AMD Releases Specifications for Light-Weight Profiling Technology
AMD (NYSE: AMD) made available a new specification describing “Light-Weight Profiling” (LWP), a technology designed to increase the performance of software applications by providing a mechanism that allows software to more effectively leverage the benefits of multi-core processing. The LWP specification describes the first technology that supports a recently introduced initiative called “Hardware Extensions for Software Parallelism,” which will encompass a broad set of innovations designed to improve software parallelism, and thus application performance, through new hardware features in future versions of AMD processors. LWP is a CPU mechanism that could have broad benefit to software including, but not limited to, runtime environments such as Sun Microsystems’ Java Virtual Machine and Microsoft’s .NET Framework.
CSR BlueCore Multimedia Powers BlueAnt Z9 Bluetooth Headset
Following the launch of the new BlueAnt Z9 Bluetooth Headset, the company continues to ‘unveil’ further insight into the complexity of the device. BlueAnt has revealed that the Z9 incorporates CSR’s BlueCore-Multimedia platform, allowing them to produce a headset which offers superior sound quality, power efficiency and an all-round greater audio experience.
Nexsem Selects Jazz Semiconductor’s Analog Bipolar-CMOS-DMOS Process
Jazz Semiconductor, a leader in specialty RF and Analog foundry solutions and wholly-owned subsidiary of Jazz Technologies, Inc. (AMEX:JAZ), and Nexsem, a provider of power management integrated circuits (ICs), announced Nexsem has selected Jazz Semiconductor’s 0.5-micron Bipolar-CMOS-DMOS (BCD05) process technology targeted for power management ICs. By utilizing BCD05, Nexsem will be able to develop a variety of products such as step down (Buck) converters widely used in power management products.
Vaupell Prototypes Chest Drain with Somos WaterShed 11120 Resin
According to the Advanced Medical Technology Association (AdvaMed), the medical device industry grew to nearly $220 billion worldwide by 2006 and is poised to grow by yet another 10% in 2007. In this fast-paced, research-intensive sector, there is an increasing need for rapid prototyping processes and materials that can cost-effectively produce parts with challenging performance requirements including water resistance, electromagnetic interference shielding and sterilizability. For many medical device prototypes, Somos stereolithography (SL) resins are providing an attractive solution.