TI Offers Crosspoint Switches with 4.25 Gbps Data Rate Support
Texas Instruments Incorporated (TI) (NYSE: TXN) introduced two new crosspoint switches supporting data rates up to 4.25Gbps. The four-by-four and two-by-two switches provide an exceptional combination of high speed, low power and low jitter performance for applications such as XAUI signal buffering/muxing, backplane redundancy and high-speed network routing in end equipment such as wireless base stations and IP network routers.
S2 Technologies Debuts STRIDE 2.1 Embedded Software Verification Platform
S2 Technologies (S2), the leader in embedded software verification, announced the STRIDE 2.1 Embedded Software Verification Platform, a scalable, embedded verification platform that enables the development of software integral to the new wireless digital handsets supporting both standard cellular telephony and push-to-talk two-way radio service. STRIDE ensures the delivery and carrier acceptance of each handset in record time.
Silicon Laboratories Creates Smallest, Lowest Loss AC Current Sensor
Silicon Laboratories Inc. (Nasdaq:SLAB), a leader in high-performance, analog-intensive, mixed-signal ICs, announced the world’s smallest low-loss high-accuracy ac current sensors for a wide range of power applications. The Si8500 family measures up to 20 amps of current for control and protection in power systems and is ideal for a broad range of applications including ac-dc switching power supplies, isolated dc-dc supplies, motor control and electronic ballasts for lighting.
SUSS MicroTec Unveils Gamma XPress Coating Cluster for Wafer Bumping, LED
SUSS MicroTec (FWB:SMH)(GER:SMH), leading manufacturer of precision equipment for the semiconductor and related markets, launches the Gamma XPress, an advanced coating cluster targeting wafer bumping as well as LED manufacturing applications. The Gamma XPress coating cluster is offered in different configurations designed for specific applications. These include gold bump coating, under bump metal or redistribution coating, high volume LED coating as well as standard and dry film developing. The market-oriented concept of the Gamma XPress combines an efficient and flexible production setup with short lead times, thus helping to keep the customers’ time to market to a minimum.
Fujikura Introduces Fusion Splicer for Industrial Fibre Optics
Fujikura Europe Ltd. announced the launch of a new fusion splicer to support the increasing use of fibre optics in industrial applications. With Large Diameter Fibre (LDF) splicing capability, the new LDF series of products is capable of splicing all types of fibre currently available.
SPIRIT Audio Engine Supports Analog Devices Blackfin Processor
SPIRIT DSP, the world’s leading provider of embedded voice, video and audio software products, announced that SPIRIT Audio Engine now supports the Blackfin(R) Processor architecture, and that SPIRIT is now a member of The Collaborative, Analog Devices’ Third Party Program for Embedded Processor and DSP applications. SPIRIT Audio Engine is based on highly optimized audio codecs and the SPIRIT MP3 Encoder can rip up to 25 professional quality stereo channels on a single 533 MHz Blackfin(R) core.
Crossbeam Selects Altera FPGAs for X-Series Security Services Switches
Altera Corporation (NASDAQ: ALTR) announced that Crossbeam Systems is incorporating Altera(R) devices in its next-generation line of X-Series security services switches to achieve a level of performance and functionality not possible with alternative solutions. Crossbeam’s X-Series switches are the industry’s only open and scalable security platforms with carrier-class availability running multiple security applications from leading vendors. These switches are being used by companies worldwide, including CheckFree, Scottrade, and H&R Block.
Winbond Israel Adopts Cadence Incisive Palladium Emulator System
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, announced that Winbond Israel, a design and marketing center for Winbond Electronics Corp., has adopted the Cadence(R) Incisive(R) Palladium(R) emulator system for its advanced system-level verification needs. Winbond Israel develops ICs for the PC and server markets and serves PC OEM and ODM companies worldwide.
ITT to Develop SDR Applications with PrismTech’s Spectra Tools
PrismTech(TM), an acknowledged leader in the provision of state-of-the-art middleware and development tools, announced that ITT Corporation has selected PrismTech’s Spectra(TM) Tools for the development and deployment of software-defined radio applications. ITT, a major military contractor involved in the JTRS program and the developer of the Soldier Radio Waveform (SRW), will use Spectra Tools for waveform and platform component design, code generation and to verify portability, code accuracy, and Software Communications Architecture (SCA) compliance.
Actel Adds Advinno, Mouser, Tecnomics, Caelera to Sales Network
In an aggressive move to extend the reach of its low-power, flash-based programmable technologies and expand the company’s geographic footprint, Actel Corporation announced the expansion of its Asia Pacific sales network with the addition of Advinno Technologies Pte and Mouser Electronics Pte as new distributors and value-added resellers (VARs). The company also announced that its Indian distributor, Tecnomics, will now also include responsibility for Singapore, Thailand, Indonesia, Malaysia, the Philippines and Vietnam, complementing established distributors already operating in these regions. Simultaneously, Caelera has been appointed by Actel to boost sales of Actel’s IGLOO low-power field-programmable gate array (FPGA) family in Australia and New Zealand.