Automobile Electronic Content Drives ASIC, ASSP, FPGA
The market continues to witness a proliferation of automobile electronic content due to government pollution guidelines, safety and security regulations, and the ongoing oil crisis. This growing need directly influences the markets of automobile application specific integrated circuits (ASICs), application specific standard parts (ASSPs), and field programmable gate arrays (FPGAs).
Toumaz Debuts Sensium Platform Integrated Development Environment Resource
Toumaz Technology Limited, the leading provider of ultra-low power wireless infrastructure for body monitoring solutions, announces the immediate availability of its Sensium (TM) Platform Integrated Development Environment Resource (SPIDER), which allows customers to rapidly create and test end-to-end Sensium-based solutions. The development kit comprises two Sensium hardware development boards (one for the sensor transmitter and one for the receiver base station), Keil 8051 compiler and JTAG debugger to enable the development of system applications for the Sensium within a familiar and easy-to-use environment.
Kontron Defines nanoETXexpress COM Express-Compliant Footprint
Three years after the 2004 launch of the ETXexpress specification, which has become the PICMG COM Express (COM.0) standard, Kontron defines a new footprint variant of the Computer-On-Modules (COMs) standard: nanoETXexpress. The nanoETXexpress specification is targeted to deliver extremely power-saving COMs with mid to high performance x86 technology on a footprint that is a mere 55 mm x 84 mm. This is 39 percent of the original COM Express module Basic form factor 125 x 95 mm footprint and 51 percent of microETXexpress (95mm x 95mm). This new COM form factor follows the PICMG COM Express standard and will be 100 percent compliant with the COM.0 Type 1 connector. The locations of the identically mapped pin-outs will also be 100 percent COM.0 compliant.
Arasan Debuts MIPI 1.0 Serial Low-Power Inter-Chip Media Bus IP
Arasan Chip Systems, Inc. (“Arasan”), a leading supplier of reusable Intellectual Property (IP) cores, software, and associated design services, announced the availability of a new version of its SLIMbus (Serial Low-power Inter-chip Media bus) IP complaint with the just released Version 1.0 of the MIPI SLIMbus specification. The new SLIMbus IP is optimized for customer applications providing a number of hardware/software partitioning choices depending on the SLIMbus operation needed. Arasan offers a complete SLIMbus Software Stack for supporting the SLIMbus protocol and software customization services to support legacy buses like I2C, I2S, SPI and UARTs. The IP also comes with source Verification IP to permit efficient system-level validation of a SLIMbus component working as a Device or a Master/Host.
NEXCOM PEAK 765VL2 PICMG 1.0 SBC Supports Intel Core 2 Duo CPU
Everything is possible with innovative thinking. NEXCOM has successfully integrated Intel’s Q965 chipset into the PEAK 765VL2 Single Board Computer to comply with the PICMG 1.0 standard. The PEAK 765VL2 becomes the first PICMG 1.0 SBC to support Intel Core 2 Duo processor up to 1033 MHz Front Side Bus and to provide backward support of ISA peripherals.
NEXCOM Launches x86 NICE 3300 Fanless Transport PC for Vehicles
Technology in the transportation Industry has progressed from microcontroller to ARM based CPU platforms. These technologies are sufficient to perform basic tasks such as fleet management (vehicle tracking, trip recording), vehicle monitoring (speed, tire pressure), and fee collection, but are not suited for more sophisticated transport applications, such as infotainment, Internet connection and complex data processing.
Aeroflex Creates Entry-Level 6113 Digital Radio Test Set
Aeroflex has launched an entry-level version of its well-proven and highly successful 6113 Digital Radio Test Set for testing mobile basestations, targeted primarily at emerging markets including Africa, South America and Eastern Europe. The entry-level version is being offered in an EDGE configuration, with one A-bis interface for full basestation control and BER measurements, encryption, support for two of the four GSM frequency bands and software support. The entry-level Aeroflex 6113 can be upgraded to a full system, if required.
IBASE Rolls Out MB900 Micro ATX Board with Intel 945G Dual Core
IBASE Technology, a leader in the design and manufacture of industrial motherboards and single board computers unveils the MB900, an LGA775 Pentium(R) D platform integrating the Intel(R) 945G Express Chipset that delivers outstanding performance through high-bandwidth interfaces such as dual-channel DDR2 and 1066/800MHz system bus. The MB900 Micro ATX board is suitable for use in medical, industrial automation, gaming systems and other applications demanding reliability, performance and long life requirements.
DSPCon Unveils Data Acquisition, Analysis, Signal Processing Training
DSPCon, Inc., a leading, global supplier of dynamic data acquisition, analysis, archiving and recording solutions for high-value military, aerospace and rotating machinery applications, has launched a new suite of training courses specifically designed to cover all aspects of dynamic data acquisition, data analysis, signal processing and Piranha III operation. The new courses provide in-depth information for professionals who are looking to expand their knowledge of dynamic data acquisition technologies or who work on DSPCon systems in either a primary or a supporting role.
Carbon Design Announces Tenison Migration Program for VTOC Products
Carbon Design Systems, the leading supplier of tools for the automatic creation, validation and deployment of virtual hardware models, announced a program to offer customers of Tenison Design Automation’s VTOC products an easy migration path to Carbon’s family of model generation solutions.
ST Unveils 1-Mbit Serial EEPROM with SPI Bus in SO8 Narrow Package
STMicroelectronics (NYSE: STM), a world leader in serial non-volatile memory ICs, announced a new 1-Mbit serial EEPROM with SPI bus (serial peripheral interface) in the tiny SO8N package with 150-mil (3.8mm) body width â€“ the first SPI serial EEPROM in the market to squeeze this high memory density into such a small package. Also offered in the wider SO8W, the new M95M01 is intended for the storage of fast-changing parameter data in consumer electronics products such as digital TVs (DTV) DVD players and gaming, as well as in medical equipment, industrial, car infotainment and computer peripherals. STâ€™s SPI EEPROM family now offers 1-Kbit to 1-Mbit devices â€“ the broadest portfolio on the market.
TOPEX Eones Equipment Enables SS7 Interconnection for ONO
TOPEX, a leading telecom equipment manufacturer and NGN solution provider confirms that its customer Alea, an operator based in Spain is using TOPEX Eones equipment for SS7 interconnection with Spanish operator ONO. TOPEX signalling gateway, Eones has provided full interoperability with Lucent-5SS used by ONO system.