Automatic Model Generation for CoWare Platform Architect Webinar
Carbon Design Systems(TM) â€” the leading supplier of tools for the automatic creation, validation and deployment of virtual hardware models â€” will host a webinar on automatic model generation for the Platform Architect design environment from CoWare(R). Attendees will learn how to quickly develop hardware-accurate models, accelerate the execution of a virtual platform and concurrently debug real software against a model of the actual hardware implementation.
Dongbu HiTek Debuts ARM Physical IP for 130nm Low-Power Designs
Dongbu HiTek announced the immediate availability of ARM(R) low-power and speed-and-density optimized physical IP for designers developing CMOS chips processed at the 130-nanometer (nm) node. The licensed ARM Metro(TM) and SAGE-X(TM) standard libraries including Power Management Kits and memory compilers, announced in January 2007, support advanced chip solutions targeting battery-operated applications.
SUSS MicroTec Introduces iVista High-Resolution Digital Microscope
SUSS MicroTec AG (FWB:SMH) (GER:SMH), the premier supplier of wafer-level test systems for semiconductor devices, launched the iVista(TM) High-Resolution Digital Microscope. Its introduction follows the rapid changes to device design implemented by manufacturers in response to economic and technological drivers. These changes challenge all test engineers, who are now faced with small pads, high numbers of contact pads and extremely complex circuitry.
ISMI Reveals Strategy for 300mm, 450mm Wafers
A comprehensive strategy designed to enhance 300mm productivity while preparing the chip industry for 450mm wafers was revealed this week by technologists of the International SEMATECH Manufacturing Initiative (ISMI). In meetings with industry suppliers and journalists during SEMICON West, ISMI outlined plans to focus its existing 300mmPrime program on targeted productivity and cycle time improvements, and to initiate a 450mm program to drive down overall manufacturing costs. ISMI director Scott Kramer said the twin programs are designed for compatibility, with most cycle time improvements from 300mmPrime expected to be useful in 450 mm manufacturing.
RTC Group Finalizes Schedule for Portable Design Conference
The RTC Group has announced the final schedule for the Portable Design Conference & Exhibition, selecting 30 technical presentations out of nearly three times as many entries. Sponsored by Portable Design magazine and the RTC Group, the first annual Portable Design Conference & Exhibitionâ€”to be co-located with the ARM Developer’s Conferenceâ€”will focus on Consumer Electronics, Portable Power and Wireless Communications. To be held October 3-4, 2007 in the Santa Clara Convention Center, the newly expanded conference will consist of two keynotes, three tracks, six panels, eight plenary and 30 technical presentations. The Portable Design Conference and Exhibition will address every aspect of portable design, just as Portable Design magazine has for over 10 years.
ST, Intel Unveil Numonyx Flash Memory Company
Intel Corporation, STMicroelectronics and Francisco Partners unveiled the company name of “Numonyx(TM)” for the pending independent semiconductor company announced on May 22. Numonyx, being created from the key assets of businesses that last year generated approximately $3.6 billion in combined annual revenue, will focus on supplying non-volatile memory solutions for a variety of consumer and industrial devices including cellular phones, MP3 players, digital cameras, computers and other high-tech equipment.