News – 2007.07.16 – Late Edition

Semiconductor Equipment Sales to Reach $40.9 Billion
The leading manufacturers of semiconductor equipment expect 2007 to be the second largest year ever for sales of new semiconductor equipment according to the mid-year edition of the SEMI Capital Equipment Consensus Forecast, released by SEMI at the annual SEMICON West exposition.

MEMS Market to Grow to $72 Billion by 2011
The market for micro-electromechanical systems (MEMS), which includes products such as automobile airbag systems, display systems and inkjet cartridges totaled $40 billion in 2006, and is expected to top $72 billion by 2011, according to Global MEMS/Microsystems Markets and Opportunities, a comprehensive new market research report from SEMI and Yole Developpement.

Teseda Launches SecureXY Powerful Yield-Enhancement Tool
Teseda Corporation, a leading provider of comprehensive scan-based diagnostic and debug solutions for high yield silicon production, is now shipping the SecureXY product. SecureXY, a powerful yield-enhancement tool, enables the sharing and analysis of pertinent failure information in the physical domain without compromising the design IP.

Simtek Unveils Extended Temperature Plastic Packaged nvSRAM
Simtek Corporation (NASDAQ:SMTK), the inventor, pioneer, and world’s leading supplier of nonvolatile static random access memory (nvSRAM) integrated circuits, introduced a new “extended temp” nvSRAM product in a low-cost plastic package to support the needs of its growing customer base in the industrial, automotive and military markets. The STK14C88-NF35U is a 256K bit (32K x 8) nvSRAM IC packaged in a plastic 32-pin surface mount package. It is available for initial orders in July.

Atmel Rolls Out ATA6622/24/26 LIN System Basis Chips
Atmel(R) Corporation (Nasdaq: ATML) announced the availability of its ATA6622, ATA6624 and ATA6626 LIN system basis chips (SBCs) which comply with the LIN2.0 standard. Compared to stand-alone LIN transceivers, system basis chips such as the ATA6622/24/26 are highly integrated and include a voltage regulator plus a watchdog. These new SBC devices are designed with Atmel’s high-voltage BCD-on-SOI (SMARTIS[TM]) process and are optimized for operations up to 40V for applications in harsh environments. Due to the advantages of SOI technology, Atmel’s new LIN devices set new benchmarks regarding EMI performance. The ESD protection is more than 8 kV (best in class) and ensures robust electronic units in the automotive harsh environment. Applications include automotive comfort applications such as door modules, seat control or intelligent sensors, and powertrain applications such as engine control systems.

DSM Computer Introduces 96M4261o Industrial Slot CPU
With the “96M4261o” industrial slot CPU, DSM Computer offers a board that unites the Intel(R) Core[TM] 2 Duo processor (775 socket) with the PICMG 1.0 standard bus. This allows the current Intel(R) processor also to be used on proven backplanes and systems. Based on the Intel(R) Q965 chip set, the “96M4261o” slot CPU card offers maximum computer power coupled with a low power consumption. The two cores have extremely fast access over a 1066/800/533 MHz front-side bus to the main memory designed from two DDR2 modules with a maximum capacity of 4 GB.

Eight New Members Join International Imaging Industry Association
The International Imaging Industry Association (I3A), the leading global association for the imaging industry, announced the addition of eight new corporate members. These companies, which have joined the organization over the last few months, represent a range of industry sectors and regions, demonstrating I3A’s international appeal and broad expertise in all segments of the imaging industry.