News – 2007.07.03

iSuppli’s Teardown Analysis of Apple iPhone
In terms of cost, iSuppli Corp.’s teardown analysis of Apple Inc.’s iPhone offered few surprises, with its Bill-of-Materials (BoM) closely conforming with our preliminary functional estimate issued in January. However, in terms of suppliers, the iPhone is packed with surprises, with newcomers Infineon Technologies AG, National Semiconductor Corp. and Balda providing key components in the product — along with established component makers like Samsung Electronics Co. Ltd. — according to iSuppli’s Teardown Analysis service.

Q Talk to Integrate HushAlert! into CSR BlueCore5-Multimedia Platform
CSR (LSE:CSR) has announced that Q Talk has joined its eXtension Partner Programme, to integrate its HushAlert! into CSR’s latest BlueCore5-Multimedia platform. Q Talk’s HushAlert! has been designed to address the specific user problem of speaking too loudly on mobile phones when in close proximity with other people. Users will be given the ability to control the level of their speech, enabling them to make calls in situations that they may not have felt comfortable in before, as well as keeping annoyance associated with this issue at a minimum.

UMA Connects 65 Million Fixed-Mobile Convergence Subscribers
Not that long ago, many market-watchers thought that Unlicensed Mobile Access (UMA) had run its course as a means of bridging cellular and Wi-Fi networks. However, because of the delays in the growth and development of viable competing solutions (SIP, or VCC), the opposite is true: UMA services, devices, and subscribers are still growing, and subscriber numbers should reach 65 million by 2012.

Wipro-NewLogic Unveils Bluetooth 2.0+EDR Baseband RTL, Software Stack
Wipro-NewLogic, the semiconductor IP business unit of Wipro Technologies (NYSE:WIT), announced the release of its Bluetooth 2.0+EDR baseband RTL and software stack. This low-power and flexible Bluetooth 2.0+EDR architecture is upgradeable to Bluetooth 2.1+EDR by software and builds up on the company’s silicon-proven and fully certified Bluetooth 1.2 solution. Combined with the Wipro-NewLogic Bluetooth 2.0+EDR radio IP, it offers customers a range of system configurations and can be integrated into any application, host or baseband chips, in the mobile, automotive and consumer markets.

ABI Research Femtocell Survey Ranks Ubiquisys First
Ubiquisys Ltd, the leading developer of intelligent femto access points for the residential market, has been named number one femtocell vendor in an independent study by ABI Research. Ubiquisys has recently gained significant traction in the sector with major announcements that include a deal to provide the 3G femtocell technology for NETGEAR’s forthcoming home gateway, which will also incorporate Wi-Fi and a DSL modem.

AXIOMTEK Rolls Out SBC81203 PICMG 1.0 Single Board Computer
AXIOMTEK, an Associate Member of the Intel(R) Communications Alliance (ICA), a community of communications and embedded developers and solution providers, has released its new PICMG 1.0 Single Board Computer, the SBC81203. This full-size SBC supports LGA775 socket Intel(R) Core(TM)2 Duo, Pentium(R) D, Pentium(R) 4, and Celeron(R) D processors with 533/800/1066MHz front side bus and features the Intel(R) 945G+ICH7R express chipset to fit the multiple computing system applications for today’s demanding pace, such as DSA (Digital Signage Appliance), DVR (Digital Video Recorder), gaming machine and more.

KLA-Tencor Improves 45nm Defect Review, Classification System
KLA-Tencor (NASDAQ:KLAC) introduced the eDR-5200, a new generation wafer defect review and classification system that leverages advances in resolution and defect re-detection sensitivity, along with unique connectivity with KLA-Tencor inspection systems, to enable better review performance, faster yield learning and higher productivity from both systems. The seamless integration of KLA-Tencor inspection tools and the eDR-5200 enables fabs at the 45nm node and beyond to produce a greater number of higher quality defect Paretos per hour, allowing engineers to take rapid, accurate corrective action to protect their yield.

picoChip Approves Systems4Silicon for picoArray Multi-Core DSP
picoChip announced that it has added Systems4Silicon as an approved design center for its picoArray(TM) multi-core DSP. Systems4Silicon has a highly experienced team, capable of supporting customers with PHY, MIMO, PA linearization and RF design issues for advanced air interfaces applications, and already has considerable real-world experience with picoChip technology.