Demand Increases for System-in-Package (SiP) Technology
System-in-package (SiP) technology is emerging as a potential alternative to system-on-chip (SoC) technology in the semiconductor packaging industry. SiP technology attracts considerable interest because of the significantly higher flexibility it offers a design house. This flexibility allows designers to combine multiple semiconductor technologies and reuse intellectual property (IP) from numerous sources. Therefore, designers are able to overcome integration difficulties without affecting any of the individual chip technologies.
ip.access Publishes 3G Home Femtocells White Paper
The use of low power “femtocells” in the home is set to drive the use of 3G voice and high-speed data services by mobile phone users and deliver increased fixed-mobile substitution (FMS) for operators, according to a new whitepaper published by a leading developer of femtocells.
Aonix Frees Ameos UML Modeling to Open Source Community
Aonix(R), a provider of solutions for mission-critical applications development, announced that it is contributing its powerful Ameos modeling technology to the open source community. Ameos, based on the pioneering Software through Pictures modeling tool family, offers UML profiles to generate C/C++, Ada, Java, CORBA, COM, and EJB. Under the new open source policy, Ameos is available under terms based on the GNU Lesser General Public License (LGPL) as OpenAmeos. This open source strategy for Ameos allows Aonix to focus marketing resources on its expanding PERC technologies for real-time Java developers, while providing the tools to ensure long-term value to Ameos users.
Xilinx Announces TD-SCDMA Digital Front-End Reference Design
Xilinx, Inc. (Nasdaq: XLNX), the leading FPGA supplier to the wireless infrastructure market, in partnership with the leading radio algorithm developer, Multiple Access Communications (MAC) Ltd, announced the immediate availability of a TD-SCDMA Digital Front End (DFE) reference design solution based on the Xilinx System Generator for DSP tool. The new reference design solution significantly reduces the development time required for the complex digital algorithms found in TD-SCDMA DFE radio applications. Consisting of example reference designs, full-speed working demo and complete IP library that include optimised System Generator IP Blocks for digital up conversion (DUC) and digital down conversion (DDC) functions, the TD-SCDMA DFE reference design solution enables users to construct 3GPP-compliant DFE designs for a wide variety of base station configurations.
ST Rolls Out QST Capacitive Touch Sensors
STMicroelectronics (NYSE: STM), announced the launch of the QST108, the first IC in a family of capacitive touch sense products that will enable contemporary and innovative user interfaces for many markets. QST family products are all-digital standard products based on proven, patented technology recently licensed from Quantum Research Group. ST is the first semiconductor company to license QProx(TM) technology from Quantum.
QuickLogic Introduces Compact Flash Host Controller
QuickLogic(R) Corporation (NASDAQ: QUIK), the leader in lowest power programmable solutions, announced an addition to its integrated programmable connectivity solution portfolio targeting mobile devices. The company has released a full Compact Flash host controller to provide designers with simple access to this common memory technology.
QUALCOMM, VIA Telecom Support BREW Client Software on CDMA2000 Chipsets
QUALCOMM Incorporated (Nasdaq: QCOM), a leading developer and innovator of advanced wireless technologies and mobile data solutions, and VIA Telecom Inc., a privately held fabless semiconductor company and developer of CDMA chipsets, announced a licensing agreement to integrate QUALCOMM’s BREW(R) Client software onto VIA Telecom’s line of CDMA2000(R) application-specific integrated circuits (ASICs). Under the terms of the worldwide agreement, QUALCOMM has granted VIA Telecom rights to incorporate the BREW software layer into the CDMA2000 chipsets that it sells to its wireless device manufacturer customers.
OKI Samples Smallest 16bit Audio CODEC LSI
Oki Electric Industry Co., Ltd. (TOKYO:6703) unveiled samples of its “ML2612 Family (ML2612/ML2614/ML2616),” the world’s smallest 16bit audio CODEC LSI that are ideal for recording and playback applications in portable devices. Using OKI’s W-CSP(1) technology, the company succeeded in reducing the device size to 2.0mmx2.5mm for the ML2614/ML2616, the world’s smallest package of its kind. Volume production is expected to start from September 2007.
FIME Certifies Atmel Secure Microcontroller for ePassport
Atmel(R) Corporation (Nasdaq: ATML), announced that FIME, an external and independent third party laboratory, has certified that Atmel’s AT90SC12872RCFT secure microcontroller is compliant with ICAO (International Civil Aviation Organization) and ISO 14443 specifications (contactless interface for smart card). The FIME report is available from Atmel upon request.
ICCAD Announces Keynote Speakers for 2007 Conference
The International Conference on Computer-Aided Design (ICCAD), the Electronic Design Automation (EDA) industry’s premier technical conference in design, announced the two keynote speakers for the 2007 conference to be held on November 5-8 at the Doubletree Hotel in San Jose. The full technical program will be available online by the end of August, 2007.
Design Automation Conference Announces Best Paper Award Winners
The 44th Design Automation Conference (DAC), the electronic design automation (EDA) industry’s prestigious annual forum, awarded Best Paper honors to two noteworthy technical papers presented at this year’s conference. “Interdependent Latch Setup/Hold Time Characterization via Euler-Newton Curve Tracing on State-Transition Equations,” provides a breakthrough solution to a longstanding problem with timing closure. “Period Optimization for Hard Real-time Distributed Automotive Systems,” presents a new solution to the mapping problem for distributed automotive systems. The Best Paper awards were announced at DAC on June 8 before the Thursday keynote.