iRobot, Lockheed Martin to Develop FCS Centralized Controller
iRobot Corp. (NASDAQ: IRBT) announced it has been selected by Lockheed Martin (NYSE: LMT), the provider of the Centralized Controller Device for the U.S. Army’s Future Combat Systems (FCS) program, to be a key supplier of design and development for the project’s controls and display through its estimated delivery in 2015. Managed by the Lead Systems Integrator team of Boeing and partner Science Applications International Corporation (SAIC), the FCS development contract represents the Army’s premier modernization program, comprising a family of sensors, air systems, and both manned and unmanned ground systems, all of which are networked to provide soldiers with enhanced situational awareness and survivability.
OmniVision Technologies Unveils 3-megapixel CameraChip Sensor
OmniVision Technologies, Inc. (Nasdaq: OVTI), a leading independent supplier of CMOS image sensors for high-volume applications, launched the OV3640, the first fully integrated 3-megapixel CameraChip(TM) sensor in a 1/4-inch format. Based on the new 1.75-micron OmniPixel3(TM) architecture, the OV3640 is small enough to fit the standard 8 x 8 mm sockets used in 2-megapixel camera phones, making it an ideal drop-in upgrade for existing handset designs.
TI Introduces Buck Controller for LCD TV,IP Set-Top Box
Texas Instruments Incorporated (TI) (NYSE: TXN) introduced a flexible, synchronous buck controller that simplifies power management design of LCD TVs and IP set-top boxes that use digital signal processors (DSPs) and FPGAs. TI’s new TPS40195 high-performance controller provides several features to enhance the power performance of a 4.5 V to 20 V system. For instance, the device uses the input voltage available for power conversion as its bias supply, eliminating the need for additional voltages to power the integrated circuit. The TPS40195, which comes in a 16-pin TSSOP package, also can switch 180 degrees out of phase when the bi-directional synchronization pin is used as an output to other buck controllers. This reduces bulk capacitance and saves board space and cost when using 5 V and 12 V power supplies. In addition, the TPS40195 lowers electromagnetic interference (EMI) when the pin is used as an input connected to a master clock.
ADLINK Rolls Out PICMG 1.3 Quad-Core Single Board Computer
ADLINK Technology Inc. announces the NuPRO-965, an SHB Express (PICMG 1.3) system host board supporting the powerful combination of the Intel(R) Core(TM)2 Quad / Core(TM)2 Duo family of processors and the Q965 chipset for improved system manageability, graphics, and stability. The NuPRO-965 also supports the Intel(R) Pentium(R) D, Intel(R) Pentium (R) 4, and Intel(R) Celeron(R) D processors on a front side bus up to 1066 MHz to support a wide range of performance requirements. This performance is further enhanced by backplanes that allow 10 Gb/s of bandwidth to and from the system host board to eliminate data bottlenecks between the I/O cards and memory. The four DIMM slots support up to 8 GB of dual channel DDR2-800 RAM with a peak transfer rate at 12.8 GB/s.
Elma Introduces MicroBox 1U MicroTCA Deployable Solution
Elma Electronic Inc., a global manufacturer of electronic packaging products, has announced a new 1U MicroTCA solution called MicroBox(TM). Created in cooperation with the company MicroBlade(TM), an early developer of MicroTCA infrastructure products, the MicroBox features right-sized performance with advanced cooling and module options. MicroBox and MicroTCA are expected to see rapid acceptance in Communications, Medical, Mil/Aero, Industrial, Networking, and Commercial applications.
Lenovo Mobile Adopts TI LoCosto Single-Chip Platform for Handsets
Texas Instruments Incorporated (NYSE: TXN) (TI) announced the selection of its “LoCosto” single-chip platform for a new family of low-cost, multimedia-rich handsets from Lenovo Mobile, China’s leading handset manufacturer. Lenovo is leveraging TI’s scalable “LoCosto” solution to deliver low-cost handsets with exceptional performance and leading-edge features at a competitive, entry-level price. The i323 handset, the second in this series, is available to China consumers now, followed by the i515 available in June. The i366 handset is also available today.
Mauna Kea Selects DapTechnology FireLink IEEE 1394b Link Layer IP Core
DapTechnology, a world-leading supplier of advanced IEEE 1394 protocol analyzers & solutions to the aerospace, defense, industrial, automotive and consumer electronics markets announced that Mauna Kea Technologies, based in Paris (France) has selected the DapTechnology FireLink 1394b Link Layer IP Core and is currently integrating this technology as a key component of their CellVisio(R) molecular imaging product line. The FireLink IEEE 1394b Link Layer IP Core, which is currently available for Xilinx and Altera FPGA devices, is implemented in industry-standard VHDL code and targeted at applications requiring up to 800 Mbits/Sec of bandwidth and embedded designs requiring a general purpose Link Layer Controller.