The Medalist i3070 in-circuit test system, by Agilent Technologies Inc. (NYSE:A), is a test system for printed circuit board assembly. Advanced algorithms provide analog test throughput increase by up to 50% compared with legacy Agilent Medalist 3070 systems. Simple graphical user interfaces are designed to maximize ease-of-use for operators in the fast-paced high-volume manufacturing environment.
The Agilent Medalist i3070 includes another industry first — VTEP v2.0 vectorless test technology that incorporates the new Network Parameter Measurement technology targeted at defect detection on power and ground pins for connectors.
Power and ground pins have long been considered off limits to vectorless test because, by design, the power or ground pins are tied together, making an opening in a pin virtually undetectable in any of the currently available vectorless test solutions in the market. Agilent’s VTEP v2.0 is the innovative solution to overcome this test limitation.
Both the new Medalist i3070 and VTEP v2.0 capabilities can be enabled on existing Medalist ICT systems with a simple software upgrade. Concurrently, to further protect the investment of existing Agilent Medalist 3070 and i5000 users, the new Medalist i3070 provides a high degree of compatibility with the legacy Agilent ICT systems, making it effortless for end-users to transport across systems with the same configuration.
More info: Agilent Medalist ICT