News – 2007.06.05

IBM Introduces New Semiconductor Products
At the annual Design Automation Conference IBM (NYSE: IBM) announced new semiconductor products that leverage several IBM-generated chip technology breakthroughs. One of these offerings, IBM’s new Cu-45 High Performance Custom Chip (ASIC), represents the commercial introduction of Silicon On Insulator (SOI) technology — historically only used for high performance microprocessors — into communications, consumer and other major market segments. In addition, the Cu-45HP ASIC offering is the first commercial use of a new generation of embedded dynamic random access memory (eDRAM) implemented in Silicon-on-Insulator (SOI) technology — an innovation introduced February 2007 at the International Solid State Circuits Conference (ISSCC).

Luminary Micro Rolls Out 27 Stellaris Microcontrollers
Luminary Micro, creators of the awardwinning Stellaris(R) Cortex(TM)-M3-based microcontrollers(MCUs) introduced 27 new Stellaris microcontrollers (MCUs), bringing innovative networking capabilities for real-time applications in motion control, building and industrial automation, fire and security, remote sensing, instrumentation, point-of-sales, and deeply embedded connected systems.

Xilinx Announces CoolRunner-II Starter Kit for Hand-Held Devices
Xilinx, Inc. (Nasdaq: XLNX), the world’s leading supplier of programmable solutions, announced immediate availability of its low-cost CoolRunner(TM)-II CPLD starter kit — ideal for prototyping high volume, ultra low-power applications such as handheld devices, smartphones, motor control interface, and embedded CPLD applications. The kit enables users to quickly develop and test applications while reducing design time and risk by leveraging its modular board architecture approach with multiple boards designed to work together. The kit includes an evaluation board with eight expansion connectors; three modules including PS2, seven-segment display, and slide switch; ISE(TM) WebPack(TM) design software, and a vast array of reference designs to shrink development time. An optional peripheral module bundle consisting of A/D, D/A, motor control, stereo amplifier, serial port, and other modules expand the functionality.

Synplicity Introduces Confirma for ASIC-ASSP Verification
Synplicity Inc. (Nasdaq:SYNP), a leading supplier of software for the design and verification of semiconductors, unveiled the Confirma(TM) platform, a next generation, high-performance verification solution that dramatically improves the traditional ASIC and ASSP verification process. The Confirma platform brings together best-in-class hardware and software tools, creating a tightly integrated, hardware-assisted verification solution that helps customers address today and tomorrow’s ASIC and ASSP verification challenges. The Confirma platform includes Synplicity’s Certify(R) tool, the industry standard for multi-FPGA partitioning and implementation; as well as the company’s recently introduced Identify(R) Pro software with TotalRecall(TM) technology providing full visibility into the design under test; and, the HAPS (HARDI ASIC Prototyping System) FPGA-based prototyping hardware, the most flexible prototyping boards on the market today.

Advantech, Kontron Introduce COM Express Extension
Advantech and Kontron, the founders of the ETX(R) Industrial Group, unveiled the “COM Express(TM) Extension”, a document that offers optimized pin-outs for graphics and other core features for COM Express designs based on the PICMG COM.0 COM Express specification. In parallel with the launch of the COM Express Extension, Advantech and Kontron announced the transformation of the ETX Industrial Group (ETX-IG) to become the COM Industrial Group (COM-IG), in order to extend the groups focus on the needs of all computer-on-module solutions including ETX and COM Express.

XGI, Kontron Publish UGM Embedded Graphics Module Specifications
At the Computex Trade Fair in Taiwan, XGI and Kontron officially published the complete “Universal Graphics Module” design specification. The new UGM standard is an economical option for high-end embedded graphics requiring a short time to market. This is made possible by the use of interchangeable and scalable standard modules. Until now, these advantages were only available from Computer-On-Modules but the UGM standard makes them available to high-end embedded graphics applications as well.

Tangent Introduces Fanless Rugged Mini PC for Harsh Environments
Tangent Inc., a leading provider of technology solutions for healthcare, education, industrial and government markets, has developed an industrial strength mobile computing solution, called the Rugged Mini Fanless, for use on factory floors, in the field, mounted to carts or vehicles, or in other harsh environments.

RapidIO Design Summit to take Place in Europe, North America, Asia
The RapidIO Trade Association announced its Fall 2007 Global RapidIO Design Summit schedule, with events slated for Europe, North America and Asia. These highly anticipated events provide engineering managers, system architects, and embedded product developers with practical information on RapidIO technology and products they can utilize now in their production products.

Luminary Micro, IAR Pair Stellaris Kits, Embedded Workbench KickStart
Luminary Micro, creators of the awardwinning Stellaris(R) Cortex(TM)-M3-based microcontrollers, and IAR Systems, a world-leading provider of embedded tools, announced the immediate availability of two Stellaris Evaluation Kits paired with the IAR Embedded Workbench KickStart Edition software development tools.

Sonics Rolls Out SonicsStudio 4.6 with SystemC-Only Support
Sonics Inc., a premier supplier of system-on-chip (SoC) SMART Interconnect solutions, announced the general availability of SonicsStudio version 4.6, which adds significant capabilities to support ESL design using the SystemC language. This enhanced version of SonicsStudio is a key component of a complete ESL strategy, which Sonics and its partners have developed to ensure more productive and efficient use of SystemC modeling activities.

Knowles Acoustics, Akustica Agree to Cross License Patents
Knowles Acoustics and Akustica, Inc. announced that the companies agreed to enter into a cross-licensing arrangement which reinforces the strength of each company’s respective patent portfolios. Knowles Acoustics and Akustica are the leading companies for silicon MEMS microphone design, manufacturing, and sales. Both company’s innovations are tightly protected by several MEMS microphone processing and packaging patents. Terms of the agreement are confidential; however, there will be no restrictions on sales of products from either company.

ThreadX, NetX Support Stellaris LM3S6000, LM3S2000 Microcontrollers
Express Logic, Inc., the worldwide leader in royalty-free real-time operating systems (RTOS), announced that Express Logic’s ThreadX(R) RTOS and NetX(TM) TCP/IP networking stack now support Luminary Micro’s new Ethernet-enabled (LM3S6000 series) Stellaris family of ARM(R) Cortex(TM)-M3 microcontrollers. ThreadX also supports Luminary Micro’s new CAN-enabled (LM3S2000 series) Stellaris family of ARM Cortex-M3 microcontrollers. ThreadX and NetX for the new Stellaris devices are designed for use with the ARM/Keil RealView(R) IDE from ARM.

Corvalent Support QNX Neutrino RTOS
Corvalent, a pioneer in the design and manufacture of long-life Intel(R)- processor-based systems and single board computers for vertical market applications, and QNX Software Systems, a leading provider of operating system technology for the embedded and realtime computing market, have formed an alliance to enable Corvalent to include QNX(R) Neutrino(R) Real Time Operating System (RTOS) based software support for Corvalent’s Global OEM customers.

Target Compiler Improves Chess-Checkers Tools for SoC Design
Target Compiler Technologies, the leader in EDA tools for the design and programming of ASIPs (application-specific instruction-set processors), announced several new improvements of its Chess/Checkers tool suite geared to the design of ultra-low power SoCs. Key to the innovation is multi-faceted support for parallelism as well as RTL-level optimizations common only in the most advanced design flows. The new tool capabilities will be demonstrated at the 44th Design Automation Conference in San Diego.

Wonde Proud to Integrate NemeriX technology into Next Gen GPS Devices
NemeriX, a leading fabless semiconductor company specialising in ultra low power semiconductors and solutions for GPS and location-based service devices, announced that Taiwan-based OEM Wonde Proud Technology has selected NemeriX for its new generation of GPS personal navigation devices.

Gracenote Joins QNX’s OEM Innovations Lab Program
Gracenote(R), a global leader in technology and services that are an integral part of the digital media economy, announced it has agreed to participate in QNX’s OEM Innovations Lab (OIL) program by offering members its entire device product suite to be used for in-car entertainment evaluation, prototyping and planning purposes. QNX Software Systems is the leading operating system (OS) provider for the in-car infotainment market.