Veritas Capital to Acquire Aeroflex
Aeroflex Incorporated (Nasdaq: ARXX) announced that, in light of the superior proposal received from Veritas Capital of $14.50 per share in cash, it has terminated the merger agreement with affiliates of General Atlantic and Francisco Partners and entered into a new merger agreement with subsidiaries of Veritas in a transaction valued at approximately $1.1 billion.
AMCC Unveils Cycle Accurate Simulator for nP3705 Packet Processor
Applied Micro Circuits Corp. [NASDAQ:AMCC], a global leader in embedded Power Architecture(TM) processing, optical transport and storage solutions, announced the availability of a Cycle Accurate Simulator (CAS) for the nP3705 packet processor. The CAS provides software developers with a virtual system prototyping solution that is generated from the nP3705 design files. This hardware-accurate model of the design provides customers with an early development platform that facilitates system debug and verification.
EDXACT Rolls Out JIVARO HD 4.0, COMANCHE 1.1
EDXACT SA announces that its JIVARO netlist reduction technology and its COMANCHE interconnection analysis tool both are released in new versions. In addition to numerous additional features, capacity increase, support of inductance and mutual inductance in large files in custom flows and a Graphical User Interface into the Cadence Analog Environment are the most predominant innovations.
AWR Announces Microwave Office, Visual System Simulator v2007
Applied Wave Research, Inc. (AWR(R)), a leading provider of high-frequency electronic design automation (EDA) tools, announced the 2007 versions of its flagship high-frequency software, the Microwave Office(R) design suite and its unique system simulation software, Visual System Simulator(TM) (VSS). These latest releases provide unique and innovative new software capabilities that help designers deliver next-generation communications products with a higher degree of confidence in less design cycle time.
Cascade Introduces Tesla Power Device Characterization System
Cascade Microtech announced its new Tesla power device characterization system. Tesla, unlike any other probing system, solves the on-wafer probing challenges for engineers and test technicians who need to characterize their power devices. The power semiconductor market is projected to grow from $25.8B in 2007 to $34.2B in 2009(1) fueled by the use of power devices in everything from industrial products to consumer electronics.
Brion Technologies Rolls Out Tachyon Lithography Aware Design
Brion Technologies, an ASML company, announced the availability of Tachyon(TM) Lithography Aware Design (LAD), an extension of the company’s Tachyon suite for optical proximity correction (OPC) verification and OPC application. Tachyon LAD gives designers of advanced integrated circuits (ICs) the ability to accurately assess how circuit designs will print on silicon under real-world production conditions.
OKI Develops Dedicated Short Range Communication Wireless Module
Oki Electric Industry Co., Ltd. (TOKYO:6703) announced it has succeeded in developing the world’s first ultra small DSRC (Dedicated Short Range Communication)(1) wireless module for embedding in mobile phones to be used for DSRC inter-vehicle communication systems. Using this module based on an OKI LSI, the company succeeded in trial production of the world’s first mobile phone, “Safety Mobile Phone” specifically designed to improve pedestrian safety. The Safety Mobile Phone notifies vehicles in the surrounding area of its location and retrieves the location information of vehicles in the surrounding area that are equipped with the DSRC inter-vehicle communication system. By making it possible to reduce the occurrence of vehicle-pedestrian accidents, the phone contributes to pedestrian safety.
QUALCOMM, Ubixon Team on MEMS Displays for Mobile Devices
QUALCOMM MEMS Technologies, Inc., a wholly owned subsidiary of QUALCOMM Incorporated (Nasdaq: QCOM), and Ubixon Co., Ltd., a developer of ubiquitous portable consumer devices, at the 2007 Society for Information Displays (SID) International Symposium, Seminar and Exhibition announced an agreement to integrate QUALCOMM’s Micro-Electro-Mechanical Systems (MEMS) displays into the next generation of Ubixon Bluetooth(R) stereo headset products.
OmniVision Announces 1.75-Micron OmniPixel3 Architecture
OmniVision Technologies, Inc. (Nasdaq: OVTI), a leading independent supplier of CMOS CameraChip(TM) image sensors for high-volume applications, announced the introduction of its new OmniPixel3(TM) architecture. Featuring its new 1.75 micron pixel, OmniVision’s third-generation pixel design is among the smallest currently available and will deliver sensors with higher resolution, enhanced performance and improved image quality, all in a smaller form factor.
Fulcrum, Solarflare Create 10GBASE-T Switch Reference Design
Fulcrum Microsystems(R) and Solarflare(R) Communications announced they have collaborated on a new 10GBASE-T switch reference design that is the highest density, most cost-effective 10G Ethernet switch on the market today. The two companies are demonstrating this switch at Interop(R) Las Vegas in Solarflare Communications’ booth #1774.
eSOL Releases PrCONNECT-Pro High-Speed TCP/IP Protocol Stack
eSOL Co., Ltd. announced the release of their “PrCONNECT/Pro” TCP/IP protocol stack for embedded systems with BSD socket interface. The PrCONNECT/Pro is ideal for full-scale networking equipment, as well as handheld information terminals, including multimedia devices since its performance is over 74Mbps and has a rich set of security, routing, and other protocols.
TurboTools Design Software Integrates with Autodesk Inventor
TurboTools(TM) Corporation, a leading provider of HES(TM) and Systems Design Productivity Solutions announced the availability of an integration link with Autodesk Inventor 2008, the world’s best-selling 3D mechanical design software. The company also announces that CablEquity(TM) 2007 has been certified for Autodesk Inventor 2008 under the Autodesk Inventor Certified Applications Program. Certification is granted only after a product has been thoroughly tested internally by Autodesk staff. Certified applications meet certain implementation guidelines and demonstrate the highest levels of robustness, quality, and interoperability with Autodesk Inventor software. CablEquity is a patented universal Productivity Solution, automating design and documentation cable and harness assemblies, schematics and BOMs of Hardware Electrical Systems.
MobiForms Rolls Out Latest Mobile Development Tool
Following the global success of earlier versions of the MobiForms mobile development tool, version 3.12 has now been released. Version 3.12 is now fully certified with Windows Mobile. New features include timers, SMTP email and commands that dynamically change object attributes at runtime like font colours and sizes. The Deployment Wizard has been extended to include more device and operating environment combinations.
Lingoport Rolls Out Globalyzer 2.4 for Faster Globalization
Lingoport, Inc., a leading developer of globalization software and services, announced the release of Globalyzer(TM) 2.4 to help companies more quickly and accurately make their software world-ready for international markets. Lingoport developed a new detection engine for Globalyzer 2.4 that helps find embedded HTML strings with greater accuracy and speed. This is significant because embedded strings will inhibit localization or translation of software.
Synplicity to Demonstrate ASIC, ASSP Verification at DAC
Synplicity, Inc. (Nasdaq:SYNP), a leading supplier of software for the design and verification of semiconductors, will underscore the company’s commitment to the fast growing, high-performance ASIC/ASSP verification and FPGA-based prototyping market at this year’s Design Automation Conference (DAC) in San Diego, June 4 through June 8.
Mentor Graphics to Moderate DAC Automotive Panel
Mentor Graphics Corporation (Nasdaq:MENT) announced that Walden C. Rhines, the company chairman and CEO, will moderate the panel “Electronics: the New Differential in the Automotive Industry” on Wednesday, June 6, 2007, at the Design Automation Conference (DAC) in San Diego, CA. The conference runs from June 4 – 8.
UDT Europe Features Internationally Renowned Speakers
The 20th annual Undersea Defence Technology Europe conference and exhibition (UDT), is set to be the most influential yet, with an unprecedented line up of speakers cementing the show’s reputation as the must attend event in the international defence calendar. The event will take place at La Mostra d’Oltremare in Naples, Italy, from the 5th – 7th June 2007.
e-con Systems Receives Order for Freescale i.MX31-based Board Design
e-con Systems, a leading design services company based out of chennai, India announced that it has grabbed an order for board design based on Freescale’s i.MX31 processor running Linux 2.6.18. The project involves design and development of board running on i.MX 31 processor at 532 Mhz. supporting peripherals like Wi-Fi, Ethernet with a considerably long battery back up.