OMG Reveals Real-time and Embedded Systems Workshop Program
The Object Management Group(TM) (OMG(TM)), announced the program for its Real-time and Embedded Systems Workshop, to be held July 9-12, 2007 in Arlington, VA, USA. The workshop is co-sponsored by PrismTech, Vanderbilt University and Sparx Systems.
Honeywell Creates Microelectronics for Military, Space Systems
Honeywell (NYSE: HON) announced that it has developed a new line of sophisticated electronic components designed specifically to meet the stringent reliability requirements for computers operating in technically advanced military and commercial aerospace conditions. Honeywell’s microelectronics product offering includes next-generation integrated circuits manufactured to withstand the shock, vibration and extreme radiation conditions that occur in space and other military environments. The components are developed using the company’s radiation-hardened, silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) technology.
HP Licenses Nanoimprint Lithography to Nanolithosolutions
HP (NYSE:HPQ) announced that it is beginning to reap returns from its 10-year investment in nanoscale electronics with the licensing of technology that could enable the fabrication of semiconductor chips significantly more powerful than those available today. The technology involves a process called nanoimprint lithography (NIL) â€“ a method of literally stamping out patterns of wires less than 50 atoms wide on a substrate. HP Labs researchers have created patented NIL technology, which has enabled the fabrication of laboratory prototype circuits with wire widths of 15 nanometers â€“ about one-third the dimension of the features in the most advanced circuits that will be commercially available this year.
Zarlink Creates Implantable Transceiver Chip for Medical Monitoring
Zarlink Semiconductor Inc. (NYSE/TSX:ZL) introduced the ZL(TM)70101 transceiver chip, an ultra low-power RF system-on-a-chip solution for use in both implanted medical devices and monitoring base stations. Building on Zarlink’s MICS technology platform, the ZL70101 transceiver chip delivers high data rates, low power consumption and unique wake-up circuitry. Using Zarlink’s MICS technology, medical device manufacturers can design in-body communication systems that will improve patient care, lower healthcare costs, and support new monitoring, diagnostic and therapeutic applications.
ST Samples IP for 65nm Multi-Standard Hard Disk Drive Physical Layer
STMicroelectronics (NYSE: STM) revealed the industry’s first successful fabrication of the next-generation 65nm serial-interface MIPHY (Multi Interface PHY) Physical Layer interface IP (Intellectual Property). ST designed the macro-cell to be integrated with other functions into low power System-on-Chip (SoC) devices supporting both 3 Gbps and 6 Gbps Serial ATA (SATA) hard disk drives (HDDs) for mobile and desktop computing applications.
ADI Engineering Unveils Pronghorn SBC-210 Wireless Router Board
ADI Engineering, Inc., a leading provider of wireless router boards and turnkey wireless mesh equipment, announced immediate availability of a new version of its popular Pronghorn SBC wireless router board. ADI’s Pronghorn SBC-210 fills the void created by the discontinued WRAP board while providing substantial improvements in throughput, high power radio support and standards compliance.
Pulse Debuts Extended Temperature Multi-Port Transformer Modules
Pulse, a Technitrol Company (NYSE: TNL), a worldwide leader in electronic component and subassembly design and manufacturing, introduces a dual-port and the first quad-port extended-temperature gigabit discrete isolation transformer modules. With an operating temperature range of minus 40 to plus 85 degrees Celsius, these modules are well-suited for industrial and ruggedized Ethernet and military computer, telecommunications, and networking applications.
ADLINK Announces 5U 5-slot AdvancedTCA Chassis with Shelf Manager
ADLINK Technology introduces the aTCA-8505, an AdvancedTCA chassis with shelf manager and dual hot-swappable I2C controlled fan trays. The aTCA-8505 also features a push-pull design for a right-to-left transverse of air flow and a more efficient cooling system. In order to accelerate the transition speed within the blades, the chassis backplane supports a full-mesh transition module. All these features make the aTCA-8505 an ideal solution for network security appliance providers who demand high performance and remote control functionality.
Berkeley Analog FastSPICE Reduces Verification Time for LG Electronics
Berkeley Design Automation, Inc., provider of Precision Circuit Analysis(TM) technology for advanced analog and RF integrated circuits, announced that LG Electronics, Inc., a global leader and technology innovator in consumer electronics, home appliances, and mobile communications, has adopted the company’s Analog FastSPICE(TM) circuit simulator. Analog FastSPICE enables LG Electronics’ designers to verify their nanometer-scale analog circuits in a fraction of the time required by traditional SPICE tools.