Samsung Mass Produces 51nm 16Gb NAND Flash Memory
Samsung Electronics Co., Ltd., a leader in advanced semiconductor technology, announced that it has become the first to begin mass producing 16 gigabit (Gb) NAND flash, the highest capacity memory chip now available. The company said it will fabricate the devices in 51 nanometers (nm), the finest process technology to be used in memory mass production to date.
Advantest Creates Dynamic Test Handler for Memory Devices
Advantest Corporation (TSE: 6857)(NYSE: ATE), announced the launch of its new dynamic test handler, the M6241, for memory devices such as DDR2/3-SDRAM. It offers parallel test for up to 512 devices and boasts a throughput of 20,000 units per hour. Its compact design and new features, including an advanced heating mechanism to increase thermal stability, combine to offer significant cost reductions for volume production of today’s multi-purpose memory devices. Furthermore, with improved device transfer mechanisms, the M6241 slashes test process time and jam rates, enabling more efficient testing and greater yields.
National Semiconductor Debuts Sub-Nanosecond Comparator
National Semiconductor Corporation (NYSE: NSM), a leading supplier of high-performance analog signal-path products, introduced the LMH7322, a dual comparator that provides the industry’s lowest power (21 mA typical) with sub-nanosecond (700 ps) propagation delay. The LMH7322 joins the LMH7220 single comparator as part of a new family of single, dual and quad high-speed comparators that feature low-voltage differential signaling (LVDS) and reduced-swing positive emitter-coupled logic (RSPECL) outputs. National will begin sampling a quad comparator with similar specifications to the LMH7322 in fall 2007.
Agilent Rolls Out Low-Cost In-Circuit Test System for ODM
Agilent Technologies Inc. (NYSE:A) introduced a low-cost in-circuit test system for original design manufacturers who need “just enough test.” The new system provides a cost-effective means to achieve the highest confidence in testing high-volume digital consumer and personal computer motherboards.
Agilent Doubles Throughput with 3D X-Ray Inspection System
Agilent Technologies Inc. (NYSE:A) announced a breakthrough for in-line 3D X-ray inspection systems that detect printed circuit board assembly (PCBA) solder and manufacturing assembly defects. The Agilent Medalist x6000 AXI reduces customers’ manufacturing conversion costs without compromising defect-detection capability. It accomplishes this by more than doubling the throughput of market-leading 3D solutions while using full 3D capability to find defects.
IMEC Maintains Leadership Position in Nanoelectronics Research
During a recent General Assembly, the IMEC Board confirms that 2006 was an excellent year at all levels. IMEC was able to maintain its position as a leading nanoelectronics research institute and is constantly adapting to the changing semiconductor landscape to offer research programs the industry needs.
Leading Publications Honor Microchip Technology
Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, announced that it has been recognized by several electronics magazines and a prominent Arizona business publication for product and organizational leadership, along with recognition for strong employee contributions from a major charity.