Silicon Motion Acquires Future Communications IC
Silicon Motion Technology Corporation (Nasdaq: SIMO), a leading fabless semiconductor company that designs, develops, and markets universally compatible, high-performance, low-power semiconductor solutions for the multimedia consumer electronics market, announced that it has entered into a definitive agreement to acquire Future Communications IC, Inc., (“FCI”) a leading designer of radio frequency integrated circuits (RF ICs) for mobile television and wireless communications based in Seoul, South Korea.
ABI Research Reports on Femtocell Access Points
Femtocell vendors are faced with a difficult task: they must drive costs down while meeting carrier-driven requirements for products, in a market where there are no firm ideas about what a femtocell is, and what a femtocell system needs to support. As a result, manufacturers will look to add multimode functionality in order to reach a point where economies of scale can contribute to lowering costs.
Atmel Rolls Out Photo Detector IC
Atmel(R) Corporation (Nasdaq: ATML) announced the availability of its new photo detector IC (PDIC) for use in the optical pick-up units (OPUs) of DVD and CD drives. The new ATR0874 is the industry’s smallest PDIC device, measuring only 4 mm x 3.5 mm and is a perfect fit for the slim drives found in most laptops. The new ATR0874 is the first member of a new family of PDIC devices which complements Atmel’s current broad product range of Laser Diode Drivers (LDD) and Automatic Power Controllers (APC).
Siano’s Mobile Digital TV Receiver Powers Intel MID Platforms
Siano Mobile Silicon, a leading supplier of semiconductor solutions for Mobile Digital TV (MDTV), announced that Siano’s SMS1000 multi-standard receiver chip will power Intel MID platforms, unveiled in a demonstration at Intel’s Developer Forum (IDF) event in Beijing. The MID (Mobile Internet Device) product category delivers entertainment, communication and navigation usages enhanced by a rich Internet experience to consumers in small, ultra-mobile devices.
ADLINK Unveils Industrial microATX Motherboard with Intel Core 2 Duo
ADLINK Technology Inc. introduces a new industrial microATX motherboard supporting the Intel(R) Core(TM)2 Duo processor which improves performance and lowers power consumption up to 40%. The on-board LGA 775 socket supports the higher clock speeds of the Intel(R) Core(TM)2 Duo processor.
Excel Software Adds C# Models, Code Generation to WinA&D 5.1
Excel Software began shipping WinA&D 5.1 for system analysis, requirements management, software models, code generation, reengineering and project reports. This major upgrade adds C# modeling and code generation plus enhancements for requirements management, diagram generation and editing.
DAC Offers Scholarships to Engineers between Jobs
The Design Automation Conference (DAC), the electronic design automation (EDA) industry’s premier event, to be held June 4 – 8, 2007, at the San Diego Convention Center in San Diego, announced it will offer the “Scholarship for DAC Alumni Between Employment” program again this year. The scholarship program was introduced in 2004 to help engineers between jobs, and therefore lacking corporate support, to attend the conference. DAC is accepting applications for these scholarships via a confidential online questionnaire on the DAC Web site until Monday, May 7. As many as 15 qualified engineers will receive the scholarships and recipients will be notified on May 21.