X-Fest Seminars for FPGA, DSP, Embedded Systems
Avnet Electronics Marketing (NYSE:AVT) and Xilinx, Inc. (NASDAQ:XLNX) kicked off the Americas leg of its 90-city global seminar series tour in Salt Lake City. X-Fest, a series of technical seminars offering practical, how-to training around system level design for FPGA, DSP and embedded systems designers, runs worldwide through July 13 in locations throughout Europe, Asia, Japan and North America.
Fujitsu Debuts LSI Chip for Car Navigation, Digital Dashboards
Fujitsu Limited announced the development and release of a new large-scaled integrated (LSI) chip for in-car automotive systems, such as navigation and digital dashboards. The new System-on-Chip (SoC), the MB86R01, integrates various functions on a single chip, such as ARM(TM) core, 2D and 3D graphic capabilities, in-car networking features, and support for various media interfaces. The chip includes an embedded graphic-display controller from Fujitsu, of which over 12 million units have been shipped, for in-car automotive applications. This will enable low-cost, compact, in-car systems that feature high-resolution graphics, while continuing to leverage existing software resources.
PMC-Sierra Unveils GPON ONT Reference Design
PMC-Sierra, Inc. (Nasdaq:PMCS) has announced the availability of the PAS65311 GPON ONT Reference Design. The solution features PMC-Sierra’s GigaPASS(TM) architecture, the only ONT solution already deployed in millions of PON devices. It includes a fully featured ITU-T G.984 GPON MAC, an advanced classification engine, robust QoS queuing, advanced VLAN bridging and manipulation, and IPTV filtering, all performed at line-rate speeds for all packet sizes. The solution has already proven interoperability with most existing GPON OLT designs.
SYSGO, AMD Combine Virtualization and Multi-Core Technology
SYSGO, the global supplier of highly reliable device software, and AMD (NYSE: AMD) have formed a cooperative venture to exploit AMD multi-core technology in conjunction with SYSGO’s PikeOS paravirtualization real-time operating system. AMD and SYSGO aim to provide a unique combination of multi-core technology, hardware virtualization, and software virtualization for the embedded industry. The first result of this partnership demonstrates the cooperative execution of Windows Embedded XP and a real-time application in clearly separated partitions.
NEC Introduces 3.5-Inch System-on-Glass LCD Module
NEC LCD Technologies, Ltd. has begun sample shipment of a new 3.5-inch (8.9-centimeters-diagonal) video graphic array (VGA), low temperature poly-silicon (LTPS) thin-film-transistor (TFT) liquid crystal display (LCD) module, part number NL4864HL11-01B. The new LCD module is highly suited to installation in a wide variety of portable devices such as personal digital assistants (PDAs) and personal navigation devices (PNDs) as it enables a high level of visibility in indoor/outdoor environments with high ambient light.
VaST Signs Ecosystem Partner Agreement with IBM, Joins Power.org
VaST Systems, the technology leader in embedded design, announced that it has joined Power.org and signed an Ecosystem Partner Agreement with IBM. Power.org is an open community of companies that advance Power Architecture technology. Boasting membership that includes AMCC, Broadcom, Ericsson, Freescale, IBM, Lauterbach, Sony, Wind River, and many more, Power.org is a rapidly growing body of innovators who develop tools, software, and board-level digital products.
NI Rolls Out Sound and Vibration Measurement Suite 5.0
National Instruments (Nasdaq:NATI) announced the release of the NI Sound and Vibration Measurement Suite Version 5.0, the new interactive sound and vibration analysis software that includes the NI Sound and Vibration Assistant. The Sound and Vibration Measurement Suite 5.0 is the most comprehensive National Instruments collection of analysis and signal processing tools for noise, vibration, harshness (NVH); machine condition monitoring; and audio test applications.
MOSAID Announces Working Silicon PLLs for 65nm Process
MOSAID Technologies Incorporated (TSX: MSD), a leading provider of high-performance, flexible semiconductor intellectual property (IP), announced working silicon for its PLLs at the 65nm CMOS process node. MOSAID’s PLLs were fabricated in both standard logic and low-power 65nm process nodes at a leading foundry.
Synopsys’ Designware Verification IP Sets Standard for OCP-IP
Synopsys, Inc. (Nasdaq:SNPS), a world leader in semiconductor design software, and Open Core Protocol International Partnership (OCP-IP), an independent non-profit semiconductor industry consortium, announced that they are collaborating to provide Synopsys’ DesignWare(R) Verification IP (VIP) as part of OCP-IP’s CoreCreator verification toolset. DesignWare VIP for OCP, part of Synopsys’ portfolio of standards-based verification IP, will become the OCP-IP endorsed verification IP solution and will replace the OCP Bus Functional Models (BFM) currently provided with OCP’s CoreCreator tool. The new, combined solution, which includes DesignWare VIP and CoreCreator’s performance analysis, protocol checking, and transaction disassembly, gives OCP-IP members a common verification toolset, enabling maximum consistency and interoperability across OCP implementations. The collaboration also further expands OCP-IP’s robust thriving infrastructure.
Mentor Receives High-Speed, On-The-Go Certification for Nucleus USB
Mentor Graphics Corporation (NASDAQ: MENT) announced the Nucleus(R) USB software has received high-speed, on-the-go (OTG) certification by the USB Implementers Forum, Inc. (USB-IF). Obtaining the most stringent of certifications, the Nucleus USB solution is now USB-IF compliant at high-speed, full-speed, OTG, or function derivations, allowing developers to easily facilitate certification of their own Nucleus USB-based applications.
TSMC Selects Virage Logic as 45nm Early Development IP Partner
Virage Logic Corp. (NASDAQ:VIRL), the semiconductor industry’s trusted IP partner and pioneer in Silicon Aware IP(TM), and TSMC (TSE:2330)(NYSE:TSM), the world’s largest semiconductor foundry, announced that TSMC has decided to work with Virage Logic as an early development IP partner at its 45-nanometer (nm) process technology node. Building on the companies’ relationship that spans the 250nm to 65nm nodes, this agreement involves the development and silicon validation of Virage Logic’s Area, Speed and Power (ASAP) Memory(TM), Self-Test and Repair (STAR) Memory and ASAP Logic(TM) product families for TSMC’s 45nm General Purpose and Low Power process technologies. The agreement also expands the companies’ 65nm agreement (announced in May 2005) to include all 65nm process variants.
MathWorks to Discuss Model-Based Design at DATE
Experts from The MathWorks will discuss the use of Model-Based Design and embedded systems within the electronic system industry through tutorials and workshops at Design, Automation, and Test in Europe (DATE) Conference 2007, Nice, France, April 16-20, 2007.
RapidIO Products Continue to Grow
Following a surge of development activity and new product announcements, the RapidIO Trade Association announced that it has surpassed 100 RapidIO-based products on the market and is nearing 55,000 downloads of the RapidIO Serial Specification since 2003. In addition, three new companies, BittWare, Embedded Planet, and HiSilicon Technologies, have joined the RapidIO Trade Association as they bring RapidIO solutions to the marketplace.
Xilinx Demonstrates Programmable Broadcast Solutions at NAB
Xilinx, Inc. (Nasdaq: XLNX) announced that its industry-leading programmable logic solutions for enabling broadcast applications, will be showcased at the National Association of Broadcasters (NAB) Conference, April 16-19, 2007 in Las Vegas. Xilinx will conduct live demonstrations of its solutions including connectivity, video over IP, and advanced video development platform. Private demonstrations of Xilinx solutions are available to members of the media upon request by contacting the Xilinx public relations department.
Altera Showcases Programmable Solutions at NAB2007
Altera Corporation (NASDAQ: ALTR) and its high-definition (HD) video partners will showcase a broad portfolio of industry-first programmable solutions, including a 3-Gbps serial digital interface (SDI) for use in broadcast system designs, at the upcoming National Association of Broadcasters (NAB2007) show in Las Vegas.
Temento Rolls Out DiaLite Platform Edition Revision 4.7
Temento Systems announced some major innovations around its new release of DiaLite(TM) Platform Edition. Most of the applications developed today embed synthesisable processors into FPGAs that can be quickly customized, integrated, prototyped and then moved into production. During the debugging phase, these complex Systems on Chip (SoC) bring challenging problems and one of the challenges is the analysis of the information at the embedded bus level. Because visibility cannot be addressed by traditional test methods, Temento Systems has launched a new line of instrumentation IP specifically focussed on the debugging of embedded systems with the introduction of a Bus Trace Analyzer for AMBA and ARM processor-based SoC’s.
Strategic Test Rolls Out Windows Vista Drivers
Strategic Test Corporation has announced Windows Vista 64-bit and 32-bit drivers for their range of Digitizer, AWG, fast Digital I/O and Digital Pattern Generator cards. The drivers are compatible with all of the 150 PCI, PXI and CompactPCI cards in the UltraFast(TM) series. The Windows Vista drivers are supplied at no cost and can be downloaded by existing customers from the company website. The same simple programming concept found in the other Windows and Linux drivers has been employed, allowing customers to upgrade their OS without modifying their application code.
Progate Selects MoSys’ 1T-SRAM for SoC
MoSys, Inc. (Nasdaq: MOSY), the leading provider of high-density system-on- chip (SoC) embedded memory intellectual property (IP) solutions, and Progate Group Corporation, Taiwan’s first ASIC design turnkey service provider, announced that their latest joint customer will begin production of a new generation CMOS chip that will enhance the real-time conference calling capabilities of mobile phones.