News – 2007.03.26

Intel to Build 300mm Wafer Fab for $2.5 Billion in China
Intel Corporation announced plans to build a 300-millimeter (mm) wafer fabrication facility (fab) in the coastal Northeast China city of Dalian in Liaoning Province. The $2.5 billion investment for the factory designated Fab 68 will become Intel’s first wafer fab in Asia and adds significant investment to Intel’s existing operations in China.

Atmel Offers Linux AVR Network Gateway Kit for $69
Atmel(R) Corporation (Nasdaq: ATML), introduced a low-cost AVR(R)32 Network Gateway design kit based on its 32-bit AT32AP7000 application processor. The AVR32 32-bit architecture, introduced in 2006, is optimized to achieve more processing per MHz and is especially suited for compute intensive algorithms.

Xilinx Rolls Out Embedded Development Kit 9.1i
Xilinx, Inc. (NASDAQ: XLNX) announced the release of version 9.1i of the Xilinx Embedded Development Kit (EDK) with the award-winning Xilinx Platform Studio embedded tool suite, providing full-access processing support for the company’s newest 65-nanometer (nm) Virtex(TM)-5 SXT, LX and LXT FPGAs, as well as early access for the new Spartan(TM)-3A and Spartan-3AN devices. EDK 9.1i also includes a newly enhanced version of the MicroBlaze(TM) soft processing core and advancements in the tool suite that enable software and hardware engineers to more easily configure an integrated embedded design on all Xilinx platform FPGAs.

QUALCOMM QSC Chips Enable Lower Prices for Handsets
QUALCOMM Incorporated (Nasdaq: QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, announced the success of entry-level handset launches around the world based on QUALCOMM technology. QUALCOMM’s Single Chip(TM) (QSC(TM)) products are enabling handsets that lower price barriers and deliver cost-competitive wireless connectivity to markets such as China and India. The continuing expansion of the QSC family will enable lower-cost, full-featured devices to wireless users around the world.

Cadence Unveils Global Route Environment Technology for PCB Design
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, announced the Global Route Environment technology for Cadence(R) Allegro(R) PCB design. This revolutionary technology combines a graphical interconnect flow-planning architecture and a hierarchically-aware global routing engine to provide PCB designers with an automated, intelligent planning and routing environment. As the first solution of its kind to bring intelligent automation where no automation was previously available, Global Route Environment technology represents a significant leap forward and establishes a new PCB design paradigm.

Mentor Graphics Launches Integrated USB Subsystem IP
Mentor Graphics Corporation (Nasdaq:MENT) announced a technology launch of subsystem intellectual property (IP), beginning with the industry’s first USB subsystem solution from a single-source EDA provider. Mentor Graphics is the only EDA company that develops its own digital controller, hardware PHY (physical layer), and embedded software IP to deliver an integrated and verified IP solution for today’s complex electronics designs. The end result is faster design creation, improved overall product quality, and faster time-to-market, with particular benefit for the high-demand consumer electronics market.

Microchip Unveils Single-Cell Li-Ion/Li-Polymer Chargers
Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller and analog semiconductors, announced the MCP73811 and MCP73812 (MCP7381X) Li-Ion/Li-Polymer charge-management controllers. These simple, single-cell devices provide fully integrated charge-management functions, and selectable or programmable charge currents up to 500 mA in a 5-pin SOT-23 package. They are USB compatible and come with integrated current sense, pass transistor and reverse battery protection onboard to enable smaller, more cost-effective designs.

Mellanox Introduces ConnectX IB InfiniBand I/O Adapters
Mellanox(TM) Technologies, Ltd. (NASDAQ: MLNX), a leading supplier of semiconductor-based high-performance interconnect products, announced the availability of the industry’s only 10 and 20Gb/s InfiniBand I/O adapters that deliver ultra-low 1 microsecond (µs) application latencies. The ConnectX IB fourth-generation InfiniBand Host Channel Adapters (HCAs) provide unparalleled I/O connectivity performance for servers, storage, and embedded systems optimized for high throughput and latency-sensitive clusters, grids and virtualized environments.

TI Debuts NaviLink 5.0 Single-Chip GPS for Mobile Phones
Texas Instruments Incorporated (TI) {NYSE: TXN} announced a new single-chip device that is expected to drive GPS applications into mainstream mobile phones. Built on TI’s innovative DRP(TM) single-chip technology, the NaviLink(TM) 5.0 solution has a footprint of 25mm2, delivering high performance with the industry’s smallest solution size and lowest bill of materials, making GPS more affordable to accelerate adoption in mobile phones. The new NaviLink 5.0 GPS receiver architecture provides fast “time to first fix” (TTFF) in weak signal conditions typical in metropolitan areas and deep indoor environments. With GPS available in more handsets, operators can broadly deploy location-based services consumers have come to expect, such as rich 3D mapping and navigation applications.

Magma, STARC Announce FineSim SPICE Support for HiSIM Model
Magma(R) Design Automation Inc. (Nasdaq:LAVA), a provider of semiconductor design software, and the Semiconductor Technology Academic Research Center (STARC), a research consortium co-founded by 11 major Japanese semiconductor companies, announced FineSim(TM) SPICE support for the HiSIM model. STARC leveraged the FineSim SPICE proprietary Native Parallel Technology(TM) to implement the model, achieving 20x faster circuit simulation on STARC’s 90-nanometer (nm) Star Shuttle analog intellectual property (IP) and nearly exact correlation to silicon.

Calypto Reduces Power Consumption by 60% with PowerPro CG
Calypto(TM) Design Systems Inc., the leader in sequential analysis technology, announced the immediate availability of PowerPro(TM) CG, which has reduced power by up to 60% on initial customer designs with no impact on functionality, area or performance.

Actel to Showcase Flash FPGAs at Embedded Systems Conference
Actel Corporation will highlight its transformation of “hot ideas” into “cool” flash-based field programmable gate array (FPGA) solutions through booth demonstrations and training sessions at the 2007 Embedded Systems Conference (ESC), running Tuesday thru Thursday, April 2-5, at the McEnery Convention Center in San Jose, booth #632.

Micrium Supports Atmel’s AT91SAM7, AT91SAM9 Microcontrollers
Atmel(R) Corporation (Nasdaq: ATML), a global leader in the development and fabrication of advanced semiconductor solutions, and Micrium, a leading provider of high- quality embedded software components, announced that Micrium now supports Atmel’s full line of AT91SAM7 and AT91SAM9 ARM(R)-based microcontrollers. Included are Micrium’s real-time operating system (RTOS), TCP/IP stack, file system and embedded GUI and USB applications.

Aeroflex Launches TETRALOG Protocol Analyzer
Aeroflex has announced the enhancement of the TETRA test functionality available for the Aeroflex 3900 TETRA Digital Radio Test Set with the launch of TETRALOG Protocol Analyzer, a PC-based protocol capture and analysis application that enables capture and detailed analysis of mobile protocol transactions.

DVS Digital Video Systems Showcases Hydra OEM JPEG2000 Board
DVS presents its well-known OEM products in a different light. Renowned manufacturers of digital video systems and OEM customers of DVS exhibit their own products with their integrated DVS I/O boards at the DVS booth SL2608. Another highlight in the field of OEM: Hydra, the new JPEG2000 board offers customers decompression of JPEG2000 in SD, HD and 2K in real time.

Bookham Introduces 980nm Pump Laser Module
Bookham, Inc. (Nasdaq: BKHM), a leading provider of optical components, modules and subsystems, announced the launch of what is believed to be the world’s most powerful 980nm pump laser module. The module, which delivers a ‘kink-free’ power output of 750mW, is being unveiled at OFC/NFOEC 2007.