Power Management Design Seminars Coming Soon to a City Near You
National Semiconductor Corporation (NYSE: NSM) announced that its power management experts will go on tour to discuss design fundamentals and techniques as well as application examples associated with the latest high-performance power management products.
Agilent Creates Optical Receiver Stress Tests
Agilent Technologies Inc. (NYSE: A) introduced a complete optical receiver stress test solution. The Agilent N4917A optical receiver stress test set provides repeatable conformance and characterization test results. Design and test engineers in the communications and storage industry can now accurately characterize and verify standard conformance of receive optical sub assemblies and transceiver modules operating up to 12.5 Gb/s.
E-flite Blade CX2 Helicopter Flies with Cypress’s PSoC
Cypress Semiconductor Corp. (NYSE:CY) announced that Horizon Hobby, a leader in remote control products, has employed Cypress’s PSoC(R) (Programmable System-on-Chip(TM)) mixed-signal array in the popular new E-flite(TM) Blade CX2 radio control (RC) helicopter. The new helicopter also employs Cypress’s WirelessUSB(TM) LP radio-on-a-chip for industry-leading interference immunity that protects its radio control signals from being disrupted by other 2.4-GHz signals and other aircraft.
Silicon Lab Develops First Any-Rate Clock Multiplier
Silicon Laboratories Inc. (Nasdaq:SLAB), a leader in high-performance, analog-intensive, mixed-signal ICs, announced the industry’s first jitter-attenuating clock multiplier IC that generates any output frequency from any input frequency with 0.3 picosecond jitter performance. The Si53xx Any-Rate Precision Clocks product family features nine devices leveraging Silicon Laboratories’ proven DSPLL(R) technology to offer the industry’s broadest portfolio of reconfigurable, frequency-agile precision clock sources. The Si53xx any-rate capability addresses a wide range of high-performance applications including next-generation networking, telecommunications, wireless base stations, test and measurement, HDTV video and high-speed data acquisition.
Virtutech to Share Virtualized Software Development Techniques
Virtutech, Inc., the leading provider of virtualized software development solutions for advanced electronic systems, will present two sessions on techniques to test and debug software with virtualized software development at the Multicore Expo, the only conference dedicated to delivering real developer solutions for multicore and multiprocessing designs. Additionally, Virtutech Simics technology will be showcased at Virtutech booth number 47.
Marvell Supports 802.11n Draft 2.0 Specs with TopDog WLAN
Marvell (NASDAQ: MRVL), the leader in storage, communications, and consumer silicon solutions, announced that the Company’s TopDog(TM) WLAN solutions support the new IEEE 802.11n Draft 2.0 specification as approved during the latest round of balloting by the IEEE 802.11 Working Group. This ratification is proof of the increasing maturity of 802.11n technology and its growing momentum toward international standardization.
AMCC Launches SONET / SDH / 10GE PHY Chips
Applied Micro Circuits Corporation (NASDAQ: AMCC) announced three new families of PHY products at the opening of the annual OFC/NFOEC Conference in Anaheim. All devices offer enhanced feature sets, reduced power dissipation, smaller foot prints and significant cost reductions. These products will be deployed in legacy networks as well as in new architectures where 10 Gigabit Ethernet convergence is taking place.
STARC Selects Altos’ Characterization Tools for STARCAD-CEL Methodology
Altos Design Automation Inc. announced its characterization products Liberate and Variety have been adopted by STARC, the Japanese Semiconductor Technology Academic Research Center. STARC is developing a manufacturing-aware design methodology named STARCAD-CEL that addresses the challenges of very advanced process technologies including 65nm, 45nm and 32nm.
TI’s RFID Tags Power Authentication, Tracking, Retail Supply Chain
Ten inlay manufacturers have chosen radio frequency identification (RFID) silicon from Texas Instruments Incorporated (NYSE: TXN) (TI) to power a range of new tags designed for retail supply chain, asset tracking and authentication applications. Representing established corporations and newer RFID inlay providers based in North America, Europe and Asia, the companies are using TI’s EPC Generation 2 (Gen 2) Ultra-High Frequency (UHF) silicon in strap and wafer forms, and its High- Frequency (HF) ISO/IEC 15693 silicon. TI’s strength in semiconductor manufacturing and its RF expertise are enabling customers to bring products to market quickly, and capitalize on new RFID tag applications such as Gen 2 strap on label and authentication of brand goods.
QUALCOMM Introduces EV-DO Rev. A Mobile Broadband Solution
QUALCOMM Incorporated (Nasdaq: QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA ) and other advanced wireless technologies, introduced the expansion of the QUALCOMM Single-Chip(TM) (QSC(TM)) family to drive down the cost of mobile broadband. The new QSC6085(TM) solution for CDMA2000(R) 1xEV-DO Rev. A will deliver more than ten times the speed of EV-DO Rel. 0 – up to 1.8 Mbps on the reverse link and 3.1 Mbps on the forward link – to support advanced capabilities, rich services, location awareness and the significant growth of user-generated content. The QSC6085 has met with strong support from network operators such as China Unicom, as well as device manufacturers such as SANYO.
Tower Semiconductor Licenses Virage Logic’s NOVeA NVM Modules
Virage Logic Corp. (NASDAQ:VIRL), the semiconductor industry’s trusted IP partner and pioneer in Silicon Aware IP(TM), and Tower Semiconductor, Ltd. (NASDAQ:TSEM) (TASE:TSEM), an independent specialty foundry, announced at the RFID World Conference in Dallas, that the two companies have signed a license agreement that allows Virage Logic’s NOVeA(R) non-volatile memory (NVM) modules for radio frequency Identification (RFID) and mixed-signal applications to be manufactured at Tower.
Bookham DWDM SFP Transceiver Output Power Doubles
Bookham, Inc. (Nasdaq: BKHM), a leading provider of optical components, modules and subsystems, is giving a live demonstration of its new, high power DWDM SFP transceiver at OFC/NFOEC 2007. The transceiver doubles the output power of the standard Bookham DWDM SFP, extending the unamplified reach by 33%.
Barric Sponsors Embedded Masterclass Event
UK contract electronics manufacturer, Barric, has agreed to help sponsor the Cambridge Embedded Masterclass that will take place on the 3rd May. The Embedded Masterclass is an opportunity for electronic engineers to catch up with the latest events in microprocessor technology and the tools and software that are required to develop hi-tech products.