News – 2007.02.27 – Late Edition

Ansoft, SAMSUNG Unveil Multilayer Ceramic Chip Capacitor Models
Ansoft Corporation (NASDAQ:ANST) and SAMSUNG (Samsung Electro-Mechanics Co. Ltd.) announced the release of a new model library of SAMSUNG’s high-density, miniaturized surface-mount Multilayer Ceramic Chip Capacitors (MLCC). MLCCs are used for decoupling and temperature compensation in applications where PC board space is limited. They are ideal for new wireless and portable product designs, including notebook computers, mobile phones, PDAs, camcorders, VCRs, telecommunications and test equipment. The new MLCC library allows engineers using Nexxim(R) and Ansoft Designer(R) to simulate advanced PCB and hybrid IC designs.

Converged Mobile Devices Grow by 42%
The worldwide market for converged mobile devices pushed past the 20 million unit mark during the fourth quarter of 2006, and past the 80 million unit mark for the year. According to IDC’s Worldwide Mobile Phone Tracker, vendors shipped a total of 23.5 million devices during the fourth quarter of 2006, 33.5% more than the same quarter a year ago. For 2006, vendors shipped 80.5 million devices, 42.0% more than what they shipped in 2005.

TI Announces 24-bit, 96-kHz Digital Audio Interface Receiver
Texas Instruments Incorporated (TI) (NYSE: TXN) introduced a 24-bit, 96-kHz digital audio interface receiver that provides the industry’s best jitter performance as low as 50 ps RMS, which is four times better than the nearest stand-alone receiver. This highly-integrated device reduces the number of external components required and enhances sound quality in applications such as AV/DVD receivers and amplifiers, automotive audio systems, digital televisions, musical instruments, recording systems and high-performance PC audio interfaces.

National Instruments Releases New PXI RF Switches
National Instruments (Nasdaq:NATI) has doubled its PXI RF switch offering for 50 and 75 ohm RF applications with the release of 11 new RF switches. The new modules include 4×1, terminated 4×1, dual 4×1 and 8×1 multiplexers as well as quad (4) SPDT and dual-terminated SPDT general-purpose configurations. With these new products, engineers have more choices to optimize their RF switch networks around price performance and improved signal integrity.

Aero Simulation Upgrades Navy with Quantum3D Models
Quantum3D, Inc., a leading provider of Commercial Off-the-Shelf (COTS), open architecture, realtime 3-Dimensional (3D) visual computing solutions, announced that Aero Simulation, Inc. (ASI), selected Quantum3D IDX 3000 and Facets Models and related database environments as part of the Navy’s upgrade to the Landing Signal Officer Trainer (LSOT).

VaST Names New Engineering VP
VaST Systems, the technology leader in embedded design, announced that Colin Lythall, Director of VaST’s Sydney R&D Operation, has been named Corporate Vice President of Engineering.