News – 2007.02.26 – Late Edition

Xilinx Introduces Spartan-3AN 90nm Non-Volatile FPGA
Xilinx, Inc. (NASDAQ: XLNX) announced the Spartan(TM)-3AN FPGA platform, an expansion of its multi-platform strategy, and the industry’s most advanced non-volatile Field Programmable Gate Array (FPGA) solution. Built on its proven 90nm Spartan-3 Generation low-cost FPGA fabric, the new platform combines the performance and functionality advantages of SRAM-based technology with reliable non-volatile flash technology in a single-chip solution. With the industry’s largest user flash memory and enhanced security capabilities, this new platform is optimized specifically for non-volatile applications where higher system integration or security is critical. With up to 1,000X more on-chip user flash as compared to its nearest competitor, the Spartan-3AN platform offers unprecedented system flexibility, significantly outperforming competing non-volatile FPGAs.

Xilinx Ramps Up Spartan-3A FPGAs
Xilinx, Inc. (NASDAQ: XLNX), the world’s leading programmable logic device (PLD) provider, announced volume production of its 90nm I/O optimized Spartan(TM)-3A platform. This includes both the 3S700A and 3S1400A devices with the balance of the platform to follow within the second quarter of this calendar year.

Toumaz Rolls Out Sensium for Wireless Health Monitoring
Toumaz Technology Limited announces that it has achieved a major commercial milestone with the delivery and successful testing of its integrated Sensium (TM) platform, a new ultra-low power wireless infrastructure system for health and lifestyle monitoring applications. The highly integrated Sensium chip, which taped-out on Infineon’s advanced 130 nanometre RF CMOS process in November 2006 less than 18 months after initial specification, has met all the targeted accuracy and performance parameters in initial functional testing.

SPYRUS Debuts Rosetta Micro Hardware Security Module
SPYRUS, Inc., an innovator in portable, high assurance security products, announced the Rosetta Micro, the first micro-sized, low-cost embeddable Hardware Security Module (HSM) for highly secure authentication and encryption for embedded devices. The rapid growth of capabilities in consumer electronic devices, such as PDAs or smart phones, has created a challenge to IT professionals implementing data containment and other security functions in these converged data and communications platforms. The Rosetta Micro uniquely solves this challenge.

NXP Unveils ULPI Hi-Speed USB Transceivers for Mobile Phones
Underscoring its venerable reputation in high-quality connectivity solutions, NXP Semiconductors, the independent company founded by Philips, announced availability of its new generation UTMI+ Low-Pin Interface (ULPI) Hi-Speed USB transceivers, developed specifically for mobile phone designs. With the smallest transceiver in the family measuring in at 2.2 x 2.25 x 0.6 mm, in a 0.4 mm ball pitch, NXP’s transceiver solutions are the smallest in the market and address the specific needs of today’s ultra-slim handset designs and other sleek portable devices. In addition, as the actual USB usage in mobile phones is low compared to overall talk and standby time, NXP’s transceivers avoid battery drain by consuming only 0.5 µA in power-down mode.

Cypress PSoC Express 2.2 Design Tool Supports CapSense
Cypress Semiconductor Corp. (NYSE:CY), introduced Version 2.2 of PSoC Express(TM), the innovative development tool for PSoC(R) (Programmable System on Chip(TM)) mixed-signal arrays that dramatically simplifies embedded design. The new release supports Cypress’s CapSense capacitive sensing solution that provides the industry’s most elegant and flexible replacement for mechanical buttons and sliders. It also supports Cypress’s WirelessUSB(TM) LP 2.4GHz wireless radio on a chip with best-in-class interference immunity.

Tundra Ramps up Tsi350 PCI-to-PCI Bridge
Tundra Semiconductor Corporation (TSX:TUN), the leader in System Interconnect, is now in full production of its low power, asynchronous PCI-to-PCI bridge. The Tundra Tsi350(TM) offers communications and network equipment customers a competitive high quality bridge solution with low power consumption.

VDC Reveals Embedded Board Vendor Award Winners
Venture Development Corporation has completed its year 2006 “Platinum and Gold” embedded board vendor rating awards, recognizing the top vendors of merchant computer boards among users. The awards are done as part of VDC’s annual Global Market Analysis of Merchant Computer Boards for Embedded/Real-time Applications, a research report that focuses on the core embedded markets for slot single board computers, embedded motherboards, mezzanine cards, computer-on-modules (COMs), and PC/104 stackables.