News – 2007.02.15

Adeneo Rolls Out Windows Embedded CE 6.0 BSP
Adeneo, a Microsoft Windows Embedded Gold partner with facilities in Europe and in the USA, released to market during the Embedded World Fair at Nuremberg, the official Microsoft Windows Embedded CE 6.0 BSPs for all the 3 ARM9 based chips from Atmel: AT91SAM9260, AT91SAM9261 and AT91SAM9263. These BSPs, fully compliant with Atmel’s EK development kits, implement most of the features of each chip, and are the key starting points for OEMs developing smart Windows Embedded CE based devices. Also, the coverage of the complete SAM926x family ensures OEM to have a solution for any type of device, from very low cost communication devices up to multimedia products requiring high graphical performance.

Ardence Streams to Microsoft Windows Embedded for Point of Service
Ardence, a Citrix company and a leader in developing software platforms for the on-demand world, announced that the Device Edition of the Ardence Software-Streaming Platform meets stringent compliance requirements for interoperability with the Microsoft Windows Embedded for Point of Service (WePOS) platform.

Concurrent SBC Features Dual-Core Intel Xeon ULV Processors
Concurrent Technologies announces the release of their latest dual processor 6U CompactPCI(R) single board computer – the PP 421/23x which features two 1.66 GHz Dual-Core Intel(R) Xeon(R) ULV processors. The board is ideal for CPU intensive processing applications whereby the four processor cores can access up to 8 Gbytes on board DDR2 ECC dual channel SDRAM, whilst maintaining a single slot solution. This combination of high performance data processing and a range of I/O interfaces ensures that the PP 421/23x has one of the highest specifications available today and is therefore an ideal choice for intensive data processing applications within the telecommunications, defence, security, telemetry, scientific and aerospace markets.

Design and Verification Conference
The Design and Verification Conference (DVCon), sponsored by Accellera, will be held next week. DVCon will not only focus on front-end design, but will include physical implementation as well. Physical verification goes hand-in-hand with DFM, which will be a topic of great interest at the conference. The conference offers a rich technical program and exhibit space is filled to capacity.

Telelogic Automates Model-Based Testing with UML 2.0
Telelogic (Nordic Exchange/MidCap/TLOG ), announced an automated model-based testing solution for the embedded/real-time market that fully supports the Unified Modeling Language(TM) (UML(R)) 2.0 testing profile.

Kontron Launches Intel Dual Core AMC Module
Kontron introduced to the community of wireless and IMS infrastructure system designers at 3GSM World Congress the market’s first Mid-Size Advanced Mezzanine Card (AMC) designed with Intel(R) multi-core processor technology, generating a proliferation of new design options for compute-intensive applications.

Kontron 3U CPCI Boards Support Intel 64-bit Technology
Kontron announced it is introducing Intel(R) 64-bit technology to the embedded market with the unveiling of its existing Kontron CP307 3U CompactPCI board now designed with Intel’s latest Core(TM) 2 Duo processors. Integrated with the Intel(R) Mobile 945GM Express chipset and ICH7-R Southbridge, the Kontron CP307 now achieves unprecedented performance-per-watt values in a 3U form factor in comparison to its existing processor options with Intel’s Core(TM) Duo CPUs. The Intel Core 2 Duo processor elevates the board’s feature-set with double the amount of L2 cache (4 Mbytes), a much improved internal architecture, plus support for 64-bit connectivity without increasing power dissipation.

Kontron Introduces Three Embedded Motherboards
In addition to the Intel(R) Core(TM) Duo and Intel Core Solo processor family, Kontron has launched a family of embedded motherboards that supports the new Intel(R) Core(TM) 2 Duo Processor T7400. This new 2 x 2.16 GHz processor delivers 64-bit technology and 4MB shared L2 cache that can be dynamically assigned to each of the cores. The new product family consists of three basic products in different form factors: ATX, Flex-ATX and Mini-ITX.

Kontron ETX-CD Computer-On-Modules
Kontron led the charge to revise standards for Computer-On-Modules and introduces at the Embedded World 2007 the processing power of the Intel(R) Core(TM) 2 Duo processor accessible on a 100 percent pin-to-pin compatible ETX 3.0 module. Built around the Intel Core 2 Duo processor, the Kontron ETX-CD is the high-end COM for embedded designs requiring PCI, ISA, SATA and USB 2.0 as well as all standard ETX interfaces.

Kontron ETXexpress-CD COM Supports Intel Core 2 Duo Processor
Kontron announced at Embedded World 2007 the update of the Kontron ETXexpress-CD Computer-On-Module to now support the new Intel(R) Core(TM) 2 Duo processor. Built around the energy-efficient Intel processor, the COM Express compliant Kontron ETXexpress-CD is an improved fit for the multitude of small embedded applications that are temperature and power sensitive.

Kontron Unveils 9 Embedded Platforms with Intel Core 2 Duo
Timed to launch with the Intel(R) Embedded Roadmap, Kontron debuted its latest wave of technology for Intel(R) Core(TM)2 Duo processors. With an impressive nine different embedded platforms available between now and the end of the first quarter, Kontron will offer the latest board technology across a variety of form factors with Intel’s new multi-core architecture.