NEC, Telegent Create Mobile TV Technology for Wireless Devices
NEC Electronics Corporation, a recognized system solutions provider for the mobile handset, PC peripherals, automotive and digital consumer markets, and Telegent Systems, Inc., a leader in advanced RF and digital signal processing technologies for Mobile TV in cellular phones and other portable media devices, announced that the companies will be showing a Mobile TV over-the-air technology demonstration at 3GSM in Barcelona, Spain (Exhibit Hall 8, NEC booth #8.A125, Exhibit Hall 2, Telegent Systems’ booth #2.1C59).
EDA Tech Forum Coming Soon to a City Near You
EDA Tech Forum, a key technical and networking resource for the electronics engineering community, announced its 2007 worldwide event series. With 18 free one-day conferences scheduled for North America, Europe, Japan, and the Pacific Rim, the EDA Tech Forum will deliver a wealth of technical information to help electronics engineers tackle today’s toughest design challenges.
Mentor Connects Developers to SPI Bus with Nucleus SPI Software
Mentor Graphics Corporation (NASDAQ: MENT) announced that the Nucleus(r) Serial Peripheral Interface (SPI) software is now available for embedded systems developers requiring access to on-board peripherals connected via the SPI bus. Device manufacturers are always looking for ways to lower costs, and the SPI (pronounced “spy”) bus meets the connection needs of many embedded devices at a lower cost than competing technologies.
Winwap Ports WAP Browser, MMS Client to RV Tec GSM, WiFi Devices
Winwap Technologies Oy, specialists in providing mobile Internet browsers (WAP) and multimedia messaging (MMS) software, and RV Technology Limited, wireless specialists focusing on the development and design of wireless handheld terminals, announce the availability of Winwap’s WAP Browser and MMS Client for wireless devices designed by RV Technology Limited.
Vector Fields Unveils Electromagnetic Design Tool for Coaxial Devices
Vector Fields announces a novel electromagnetic design tool for coaxial devices such as connectors and attenuators. By providing two-dimensional electromagnetic simulation only, which is ideal for radially-symmetric RF components, the new tool eliminates fundamental barriers that have held back the adoption of CAE in this sector: the very high cost of conventional 3D electromagnetic software, and the long simulation times involved.
Emerson Introduces EMC6000 Full-Featured Production MicroTCA Systems
Emerson Network Power’s (NYSE: EMR) new Embedded Computing business, formerly Artesyn Communication Products, announced its first production MicroTCA system, the EMC6000 series. Available in 12- and 24-slot versions, the EMC6000 Series features a high-speed switched fabric, an innovative air flow design that enhances cooling and reliability, and platform management software that greatly simplifies and speeds initial system bring up and configuration.
Tensilica Audio and Video Processors Power Mobile Phones at 3GSM
Tensilica(R), Inc. will be showcasing mobile phones incorporating its audio and video processors at its booth at the 3GSM World Congress (Hall 2, Level 1, Booth 2.1A67) in Barcelona, Spain, February 12-15, 2007. Tensilica is the leading IP (intellectual property) supplier for mobile multimedia (audio and video) processor cores with its HiFi 2 Audio Engine, its Xtensa(R) configurable processors, and its Diamond Standard VDO (video) family. Tensilica will showcase phones from Cingular, LG Electronics, Motorola, and Samsung that include Tensilica processor cores performing audio and video encoding and decoding.
Microtune Ships Over 50 Million Tuner Chips
Microtune(R), Inc. (NASDAQ: TUNE), a supplier of innovative radio frequency (RF) silicon and systems solutions for the consumer electronics and broadband communications markets, announced that it has surpassed the significant milestone of shipping more than fifty-million MicroTuner(TM) chips. This achievement reconfirms the Company’s market position as a world-leading supplier of single-chip silicon TV tuners.
IMEC Promotes Guido Groeseneken and Paul Heremans to Fellow
IMEC admitted Guido Groeseneken, scientific advisor for the department CMOS device and technology research, and Paul Heremans, scientific advisor for the department solar and organic technologies, to the degree of IMEC fellow for their exceptional scientific research advancing IMEC’s technical position, their very strong world-wide recognition as expert in their field and their renown academic activities and mentoring skills.
Encirq Names Deborah Goslin as Chief Executive Officer
Encirq Corporation, the global leader in device data management and the creator of DeviceSQL, announced that its board of directors has appointed Deborah Goslin as the company’s chief executive officer. Chartered with leading the company through its next phase of rapid growth in the burgeoning device data management market, Goslin succeeds founder Mark Vogel who will continue as a strategic advisor and member of Encirq’s board of directors.
System Interconnect Fabrics: Ethernet Versus RapidIO White Paper
A white paper, System Interconnect Fabrics: Ethernet Versus RapidIO(R) Technology, released by the RapidIO(R) Trade Association and by Freescale Semiconductor Corporation, concludes that for many embedded applications, RapidIO technology outperforms Ethernet. The paper offers embedded designers a detailed technology comparison that will prove invaluable as they design and specify standards for next-generation applications. The paper, authored by Greg Shippen, system architect for Freescale Semiconductor’s Digital Systems Division, NCSG and a member of the RapidIO Trade Association’s Technical Working Group and Steering Committee, is available on the RapidIO web site.
GE Fanuc Embedded Systems Unveils Rugged RES-110 Ethernet Switch
GE Fanuc Embedded Systems, a leading provider of embedded military and commercial solutions, expands their already extensive line of network products with the introduction of the rugged RES-110 Layer 2 and 3 managed Ethernet switch.
NI Rolls Out New PXI Embedded Controllers
National Instruments (Nasdaq:NATI) announced a family of PXI, PXI Express and PXI real-time embedded controllers based on the 2.16 GHz dual-core Intel Core 2 Duo processor T7400. The NI PXI-8106 and NI PXIe-8106 controllers deliver a performance improvement of more than 100 percent compared to systems running traditional single-core processors. With two cores, or computing engines, in one processor, the new PXI and PXI Express controllers can simultaneously execute two computing tasks.
Xilinx to Showcase Programmable Logic Solutions at 3GSM
Xilinx, Inc. (Nasdaq: XLNX) announced that its industry-leading programmable logic solutions for the communications infrastructure and handset markets will be showcased at the 3GSM World Congress, February 12-15, 2007 in Barcelona.
NXP Introduces Nexperia Cellular Linux System for 3G Handsets
NXP, the newly independent semiconductor company founded by Philips, announced the availability of the Linux open source operating system for its 3G mobile phone system solution. Working in collaboration with Purple Labs, a French design company offering fully integrated solutions for mobile communication products, NXP has launched the Nexperia(TM) cellular system solution 7210 with Linux for 3G handsets. Not having the additional cost and complexity of integrating a dedicated application processor, manufacturers will be able to enjoy the time-to-market advantages of using a high level operating system. Operators will also be able to provide a stable and powerful, yet cost effective platform to offer new connected services.