- EMA Acquires TimingDesigner, Chronology from Forte Design Systems
EMA Design Automation(TM), a full-service provider of Electronic Design Automation (EDA) solutions, announced that it has acquired the Chronology(R) Division of Forte Design Systems, which includes the TimingDesigner(R) product line. “This acquisition is in line with our goal to provide complete and comprehensive EDA solutions to Cadence(R) customers,” said Manny Marcano, president and CEO of EMA Design Automation. “By owning the technology, we now have better control over its future direction and integration with our core product offerings.”
- Altera Rolls Out PELE Signal Integrity Technology to EDA Partners
Altera Corporation (NASDAQ:ALTR) announced that it is making its Pre-emphasis and Equalization Link Estimator (PELE) technology available through its EDA partners to designers who need to estimate the signal integrity settings in Altera’s Stratix(R) II GX FPGAs. Mentor Graphics Corporation is the first EDA partner to integrate PELE into its tool flow. Originally available only to Altera’s internal signal integrity experts, PELE, combined with Mentor Graphics(R) HyperLynx tools, allows high-speed designers to simulate and predict system performance in a matter of hours; otherwise, verifying performance on a laboratory test bench could take months.
- WIN Enterprises Debuts Control Board with Dual Intel Xeon Processors
WIN Enterprises, Inc., a leading designer and manufacturer of embedded controllers and platforms for OEMs, announces the MB-09015, a high-performance network control board with dual Intel(R) Xeon(R) processors and ten GbE LAN Ports. The dual-socketed board is designed for network security and other demanding enterprise network applications, including anti-spam, antivirus, load balancing, firewall and Unified Threat Management.
- Freescale Joins IBM Technology Alliance for Semiconductor Research
Freescale Semiconductor and IBM announced that Freescale will join the IBM technology alliance for joint semiconductor research and development. The agreement includes Complementary Metal Oxide Semiconductor (CMOS) and Silicon-on-Insulator (SOI) technologies as well as advanced semiconductor research and design enablement transitioning at the 45-nanometer generation. Freescale is the first technology development partner in the IBM technology alliance to participate in both low-power and high-performance technology research and development.
- CoWare, Tenison Accelerate Creation of Virtual Hardware Platforms
CoWare(R) Inc., the leading supplier of platform-driven electronic system-level (ESL) design software and services, and Tenison Design Automation Inc., a company focused on delivering ESL tools that synthesize C++ and SystemC models from hardware designs described in Verilog or VHDL, jointly announced significant enhancements to the two companies’ integrated design flow. These enhancements will accelerate the creation of virtual hardware platforms for architectural exploration and software development.
- SLE Introduces Interlaken Interconnect Protocol IP Core
Silicon Logic Engineering Inc. (SLE), a high-end semiconductor design services division of Tundra Semiconductor Corporation, announced the development of a licensable Interlaken protocol IP core for use in ASIC or FPGA designs.
- CoWare, Tensilica Debut ESL Design Platform for Xtensa, Diamond Standard
CoWare(R), Inc., the leading supplier of platform-driven electronic system-level (ESL) design software and services, and Tensilica(R), Inc., the leading provider of configurable processor cores, announced they have collaborated to deliver a comprehensive ESL design environment with CoWare’s Platform Architect for Tensilica’s processors. CoWare will distribute a SystemC-based Processor Support Package (PSP) with the flexibility to match all configurations of Tensilica’s Xtensa(R) configurable processor family as well as Tensilica’s Diamond Standard family of processor cores.
- Transystem Integrates NemeriX Chipsets into i-Blue Wireless GPS Receiver
NemeriX, a leading fabless semiconductor company specialising in ultra low power semiconductors and solutions for GPS and location-based services, announced that TransystemInc., has incorporated NemeriX’s GPS chipsets into its i-Blue Wireless GPS Receiver.
- VITA Standards Organization Approves Patent Policy Changes
The members of the VITA Standards Organization (VSO) voted 35 to 2 to adopt changes to VITA patent policy procedures aimed at significantly improving the standards-setting capabilities within the VSO.
- SDC to Showcase Graphical Interface Development Technology at AAE-2007
Leading European supplier of embedded technologies, SDC Systems, will be exhibiting a new and innovative graphical interface development technology at AAE-2007 (Advanced Automotive Electronics Show), to be held at the Heritage Motor Centre in Gaydon on January 31st. The Tilcon Interface Development Suite is one of SDC’s latest products and enables engineers to develop powerful graphical user interfaces (GUI’s) for embedded systems such as telematic systems, man machine interfaces, consumer devices and medical systems.
- Mouser Electronics Offers Actel FPGAs in Small Quantities
Mouser Electronics, Inc., the fastest growing distributor in the electronics industry, and Actel Corporation (Nasdaq: ACTL), the leading supplier of nonvolatile field-programmable gate array (FPGA) technologies, announced that the two companies have signed a global distribution agreement. This partnership complements Actel’s existing distributor relationships and expands Actel’s reach to customers seeking readily available, small-volume quantities.
- Renesas Partners with Key Stream to Create Wireless LAN Solutions
Renesas Technology Corp. announced an agreement to invest in Key Stream Corporation, a provider of wireless LAN chipsets, and to collaborate in the field of wireless LAN solutions. As the trend in networked mobile devices continues to grow, there is strong demand for wireless LAN solutions with reduced power consumption and lower cost. Renesas Technology possesses the world’s leading manufacturing capability of microcontrollers (MCU) and advanced system-on-chip (SoC) technology, which has been applied to products for the mobile, digital consumer electronics, and automotive fields.
- Magma and TOOL Speed Physical Verification, Debugging of Large Designs
Magma(R) Design Automation Inc. (Nasdaq: LAVA), a provider of semiconductor design software, and TOOL Corporation, a leading developer of EDA tools, announced the integration of Magma’s Quartz(TM) DRC and Quartz LVS physical verification solution and TOOL’s LAVIS layout visualization platform. Through an easy-to-use GUI these high-per formance, high-capacity tools allow users to speed physical verification and debug, accelerating turnaround time and reducing development costs of very large nanometer IC designs.
- Oki Improves Test Quality with Synopsys DFT MAX Compression Automation
Synopsys, Inc. (Nasdaq: SNPS), a world leader in semiconductor design software, announced that Oki Electric Industry Co., Ltd. (OKI) has adopted the Synopsys DFT MAX scan compression automation solution to enable higher test quality for its digital designs. DFT MAX implements compression on-chip that results in significantly less data required for each test pattern. Using DFT MAX, OKI was able to apply comprehensive at-speed testing in addition to its regular tests to improve the quality of volume testing without having to increase the memory capacity of its testers.
- AXIOM, Averant Team on Formal Property Checking Technology
AXIOM Design Automation and Averant announced a dynamic new partnership between the two companies that will rapidly advance the adoption and use of formal property checking technology. Averant will integrate AXIOM’s popular “Designer” debugging GUI with its powerful formal verification tool Solidify(TM). AXIOM’s MPSim simulator will also be used in the flow as a platform to demonstrate failed properties to the user.
- Toshiba Rolls Out Microcontroller Based on New 8-Bit CPU Core
Toshiba America Electronic Components, Inc. (TAEC) announced the introduction of its first product based on the new Toshiba 8-bit TLCS-870/C1 CPU core. Designated TMP89FS60UG/FG, the new general-purpose microcontroller (MCU) combines 60 Kbytes of SuperFlash(R) memory with various interfaces for serial communications, a 10-bit analog-to-digital converter and analog IP blocks that provide voltage-level detection and power-on reset functions.
- VeriSilicon, Chips&Media Combine Audio and Video Solutions
VeriSilicon Holdings Co., Ltd. (VeriSilicon), a leading world class ASIC design foundry and semiconductor IP provider, and Chips&Media, a leading video IP and solution provider, announced the companies have entered into a strategic partnership to offer combined Audio & Video solutions based on each other’s technology. The new products will incorporate best-in-class DSP solutions from VeriSilicon, for advanced audio processing and ultra-low power scalable video solutions from Chips&Media, as well as a complete system software framework.
- Red Bend Updates 80 Million Handsets with Firmware Over-the-Air
Red Bend Software, the market leader in Mobile Software Management and Firmware Over-the-Air (FOTA) updating solutions for mobile phones, announced that its market-leading FOTA client software is now embedded in 58 handset models used by 80 million consumers worldwide, affording the company 34 percent market share of all FOTA-enabled phones shipping. With its FOTA client software increasingly adopted by manufacturers and deployed globally by operators, Red Bend forecasts that its vCurrent(R) Mobile software will be embedded in 100 million mobile phones by the end of first quarter 2007.