News – 2006.12.11

  • IBM, Macronix, Qimonda Demonstrate New Memory Chip Technology
    Scientists from IBM, Macronix and Qimonda announced joint research results that give a major boost to a new type of computer memory with the potential to be the successor to flash memory chips, which are widely used in computers and consumer electronics like digital cameras and portable music players.
  • CoWare Virtual Platform Interoperable with Windows Embedded CE
    CoWare(R), Inc., the leading supplier of platform-driven electronic system-level (ESL) design software and services, announced the CoWare Virtual Platform product family is now interoperable with the Windows Embedded CE operating system. As a result, companies developing Windows Embedded CE-based electronics devices can start their software development before physical hardware is available, which results in lower cost product development and faster time-to-market.
  • VMETRO Ships Virtex-5 LX FPGA-based PCI/PCI-X and PMC Products
    VMETRO demonstrated its leadership by shipping its first Virtex(TM)-5 LX FPGA based PCI/PCI-X and PMC board-level products. Illustrating VMETRO’s commitment to provide innovative computing solutions for use from development to deployment, these high-performance reconfigurable computing solutions merge the best in performance, innovation and reliability. These products are well suited for Virtex-5 FPGA evaluation and development as well as use in deployed signal processing systems in diverse markets and applications; from telecommunications infrastructure to defense and signal intelligence.
  • STARC Selects Synopsys Design Compiler for STARCAD-CEL Methodology
    Synopsys, Inc. (Nasdaq: SNPS), a world leader in semiconductor design software, announced that the Semiconductor Technology Academic Research Center (STARC) has deployed Synopsys Design Compiler(R) topographical technology in its 65-nanometer (nm) Synopsys Galaxy(TM) Design Platform-based design flow (project name: Eagle Flow) in the STARCAD(R)-CEL methodology.
  • IMEC Demonstrates Copper Contact Potential for (sub-)32nm Node
    At today’s IEEE International Electron Devices Meeting, IMEC presents the potential of copper contact technology for the (sub-)32nm node which has clear advantages for performance and power consumption. Using the proper copper contact barriers will be key to guarantee reliability and yield of the CMOS front-end.
  • IMEC Showcases High-Performance Germanium (Ge) pMOS Device
    At today’s IEEE International Electron Devices Meeting, IMEC presents high-performance germanium (Ge) pMOS devices using a silicon (Si) compatible process flow. The hole mobility obtained in these devices is up to 2.7 times higher than the universal hole mobility for silicon. This result is obtained without using enhancement techniques such as strain. Record drain currents were also achieved for Ge devices with the shortest gate length ever reported.
  • IMEC Demonstrates Laser Anneal for 32nm Node
    At today’s IEEE International Electron Devices Meeting, IMEC reports that laser anneal is a promising option for further transistor scaling to the 32nm node. By device demonstration, IMEC shows that laser anneal allows to scale junction depth without degradation of series resistance and overlap capacitance.
  • IMEC Shows Potential of 3D-Stacked IC Integration
    At today’s IEEE International Electron Devices Meeting, IMEC shows potential of 3D integration using standard front-end techniques for via fabrication. Extremely thinned bulk-silicon die containing through silicon vias are stacked and interconnected by direct Cu-to-Cu thermo-compression bonding.
  • RTI Becomes Principal Partner in Sun Partner Advantage Program for ISV
    Real-Time Innovations (RTI), The Real-Time Middleware Company, announced that it has been named a Principal Partner in the Sun Partner Advantage Program for Independent Software Vendors (ISVs). RTI qualified for this designation by meeting Sun Microsystems’ stringent criteria for excellence as a supplier of high-performance messaging solutions and by committing to tight strategic and technical alignment with Sun.
  • BFO, Hallmark, Venspro Make Christmas Interactive
    Big Faceless Organization (BFO), provider of high quality Java software components, are excited to add Venspro, Holland’s leading Marketing and PR Consultancy, to their enviable client base.
  • Renesas Debuts SH7652 Microcontroller with On-chip Ethernet Controller
    Renesas Technology America, Inc. announced the SH7652 microcontroller. The 200MHz SuperH(R) family device with an on-chip Ethernet controller is the industry’s first to incorporate both copyright protection function for IP broadcasting(1) and the Digital Transmission Contents Protection Over Internet Protocol (DTCP-IP)(2) copyright protection standard for in-home distribution. The new device enables simultaneous transmission of two-channel High-Definition (HD) digital content over the network, ideal for digital audio-visual and office automation products that feature built-in networking functions.
  • Multimedia, Portable Audio-Media Processor IC Industry to Consolidate
    Functional integration in the portable media player and multimedia processor system-on-chip (SoC) markets will fundamentally change the value proposition for today’s integrated circuit (IC) vendors, according to Gartner, Inc.
  • Atmel Introduces 1.8V CPLDs with 5uA Standby Power Consumption
    Atmel(R) Corporation (Nasdaq: ATML), announced its ATF15xxBE family of ROHS-compliant, 1.8V CPLDs with standby power consumption of just 5 uA — over 60% less power drain than the nearest competing CPLD. Operating power consumption is 1 mA at 20 MHz or less. Available in densities ranging from 32 to 128 macrocells, ATF15xxBE CPLDs can be used to implement system watchdog, MCU I/O port expansion, memory interface, LCD display module drivers, and voltage translators.
  • IDC Reveals Results of Mobile Phone and Smartphone Survey
    Results obtained from a recent IDC survey of more than 4,000 mobile phone and smartphone subscribers from five countries suggests that interest in emerging applications will drive future smartphone sales. The survey results, part of an IDC multiclient study, show that interest in WiFi access and location-based services are highest in the U.S. and U.K., while storage capacity, music quality, and photo quality are the highest in Germany, India, and China.
  • NI Simplifies Remote Monitoring, Control with Measurement Studio 8.1
    National Instruments announced the release of NI Measurement Studio 8.1, a comprehensive suite of class libraries and user interface controls for test, measurement and automation applications built using Microsoft Visual Studio. Measurement Studio 8.1 simplifies and accelerates remote monitoring and control with new network variables that help engineers communicate between Microsoft Windows or Web-based applications and remote test machines. Measurement Studio 8.1 also introduces new user interface controls and extended graph functionality to help engineers better inspect acquired data.
  • In-Building Wireless Systems Deployments to Grow by 20%
    Customers’ dependence on wireless communications and their adoption of high-bandwidth 3G cellular services are the primary drivers of the global growth of in-building wireless systems that extend and create wireless coverage indoors. According to a new study from ABI Research, deployments of these systems are expected to result in revenues in excess of $3.6 billion by 2011.