News – 2006.12.06

  • Mentor Graphics Unveils UI Technology for Consumer Electronic Devices
    Mentor Graphics Corporation (Nasdaq: MENT) announced the availability of technology that enables the rapid creation, customization and deployment of advanced user interfaces (UI) for consumer electronic devices. The new technology is integrated with the Mentor Graphics Nucleus(r) operating system (OS), the most widely used commercial embedded OS for mobile phones and consumer devices.
  • Samsung Creates Thinnest Cell Phone with Agere’s Chip Packaging
    Samsung Electronics has delivered to market the thinnest cell phone ever made. Incorporating Agere Systems’ (NYSE: AGR) innovative chip packaging design, Samsung could make Ultra Edition 6.9 (X820 bar design) and Ultra Edition 9.9 (D830 clamshell design) cell phones, the thinnest ever among its form factors.
  • Analog Devices’ Blackfin Powers 3Way Networks’ Home Base Station
    Leading 3G niche infrastructure manufacturer 3Way Networks announced that it is using Analog Devices’ (ADI) Blackfin(r) processor to power its new home base station (HBS) solution. The 3Way HBS solution is designed to allow mobile operators to offer converged voice, video and data solutions in the home. By leveraging the price/performance attributes of the Blackfin processor, 3Way is able to offer European customers a cost-effective solution. Commercial shipments will start at the beginning of next year.
  • Six New Members Join Open Core Protocol International Partnership
    Open Core Protocol International Partnership (OCP-IP) announced six new members: AerieLogic, Arasan, Inicore, Motorola, Regulus, and Silicon Valley PA, Inc. (SVPA). The breadth of technologies represented by the new members illustrates the combined industry-wide acceptance and adoption of the OCP standard.
  • Cadence, Advantest Team on Zero-Defect Digital Automotive Electronics
    Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, and Advantest Corporation (TSE: 6857, NYSE: ATE), the global leader in semiconductor test, announced a collaborative partnership to deliver a methodology for zero-defect testing of digital automotive electronics. The collaboration will enable faster time-to-market and more complete testing of complex digital devices for new automobiles.
  • Catalyst Openmake 6.4.1.1 Achieves Ready for IBM Rational Validation
    Catalyst Systems Corporation, a leading provider of Build to Release Workflow technology, announced that it is continuing to provide new offerings validated with IBM through the Ready for IBM Rational offering, receiving validation for the inter-operability between Openmake 6.4.1.1 and the IBM Rational Software Delivery Platform, desktop products V7.0. The announcement confirms that Openmake is validated for the complete Rational application lifecycle from IBM Rational Application Developer to IBM Rational ClearCase and to the IBM Rational Software Delivery Platform product lines.
  • QNX Momentics Memory Analysis Tool Find Leaks Instantly
    Memory errors are the bane of embedded development, causing mysterious crashes that can take weeks or even months to debug. But with the new memory analysis tool from QNX Software Systems, developers can immediately detect subtle memory leaks and errors, even when debugging the most complex embedded design.
  • Pextra Joins In-Sequence Technology Partner Program
    Sequence Design announced Pextra Corporation has joined its In-Sequence Technology Partner Program, promoting EDA interoperability and advanced design methodologies. Pextra, known for its IC and package parasitic extraction acumen, is currently working with Sequence to integrate its fast, accurate field solver technology with the Columbus Library Builder.