- Cadence Introduces Incisive Palladium III Accelerator-Emulator
Cadence Design Systems, Inc. (NASDAQ: CDNS) launched the Cadence(R) Incisive(R) Palladium(R) III Accelerator/Emulator, the industry’s highest throughput accelerator/emulator for verification and validation of complex hardware, software and full systems in the wireless, graphics, networking and consumer markets. Palladium III is the first hardware-assisted verification solution to combine high-performance, advanced system-wide automation and management, rapid bring-up, and fast turnaround, for specialists at every level of the system-on-chip (SoC) design chain.
- OSCI Announces Draft SystemC Transaction-Level Modeling 2.0 Kit
The Open SystemC Initiative (OSCI), an independent non-profit organization dedicated to supporting and advancing SystemC(TM) as an industry standard language for electronic system-level (ESL) design, announced the delivery of the Draft SystemC Transaction-Level Modeling (TLM) 2.0 kit, containing proposed extensions to OSCI TLM application programming interface (API) standards, an open-source library implementation, and interoperable modeling examples for world-wide public review by the SystemC community.
- TI Announces Cost-Effective, High-Performance TMS320C6454 DSP
Allowing designers to transition to higher-performing digital signal processors (DSPs) without compromising price, Texas Instruments Incorporated (TI) (NYSE: TXN) announced the availability of the cost-effective, high-performance TMS320C6454 DSP. Targeted for a myriad of infrastructure equipments including high-end telecom, wireless infrastructure, and video and imaging applications, the new 1-GHz C6454 DSP is based on the improved TMS320C64x+(TM) DSP core and TI’s highest-performing DSP architecture.
- Y-Lynx Rolls Out Long Range 868-870MHz OEM Radio Modem
Y-Lynx, a key player in wireless radio communication protocol for electronic devices, announced the release of its first new generation of products with the YLX-TRM8053-500 Long Range 868-870MHz OEM Radio Modem.
- Kontron Intelligent Minicomputer Scales to Intel Core 2 Duo
Kontron unveiled the Kontron Intelligent Minicomputer or KIM product family. This extremely compact, multifunctional minicomputer series is hightly scalable, offering processors from Intel(R) Celeron(R) M for cost sensitive applications, up to the latest Intel(R) Core(TM) 2 Duo T7400 with PCI Express for high end use.
- Cadence Introduces Enterprise System-level Verification
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, announced a solution for enterprise system-level (ESL) verification, which for the first time combines automated hardware, embedded software and system-level verification with system-wide management and new high-performance engines. This solution, combined with the Cadence(R) Incisive(R) Plan-to-Closure Methodology, extends the traditional electronic system level approaches focused only on systems engineers and C-level tools to the rest of the enterprise with a path from an executable plan to system-level closure. It enforces the system requirements across all engineering functions doing design and verification from an abstract system-level model and verification plan to in-system IP verification, systems integration, validation and closure.
- Kontron Debuts Panel-PC V Panel Express with Scaleable Multicore
Kontron introduced its new Panel-PC – Kontron V Panel Express equipped with Intel(R) Core(TM) Duo T2500 technology on a COM Express compliant, scaleable ETXexpress(R) Computer-On-Modules (COMs).
- AMCC Licenses Mercury Computer Systems’ Serial RapidIO
Mercury Computer Systems, Inc. (Nasdaq: MRCY) announced that Applied Micro Circuits Corporation (Nasdaq: AMCC), a leader in network and embedded PowerPC(R) processing, optical transport and storage solutions, has licensed Mercury’s Serial RapidIO(R) Verification Intellectual Property (IP) and Serial RapidIO IP core products for its chip design and verification efforts.
- Kontron NotePAC Ultra-Rugged Notebook Features Intel Multi-Core
Kontron announces its latest addition to the NotePAC family, NotePAC ultra-rugged modular notebook with Intel(R) Core(TM) Duo processors. This high-performance notebook with magnesium alloy housing is designed for extreme environments and modular configurations. Target segments are defence, field service, utilities, industry and public services. Application areas are off-road business and mobile data acquisition and data visualisation.
- Lattice Achieves Automotive Quality Standard ISO/TS 16949 Certification
Lattice Semiconductor Corporation (NASDAQ: LSCC) announced it has achieved certification of its quality systems to Automotive Industry Quality Standard ISO/TS 16949. The certification is formal recognition that Lattice provides its automotive customers with programmable devices that meet rigorous standards for quality and reliability. Lattice has previously satisfied the stringent requirements of additional quality standards, including ISO 9001 and MIL-PRF-38535.
- Sagem Selects Celoxica IP for Altera Cyclone II, Nios II FPGA
Celoxica (LSE:CXA) announced the deployment of its multimedia, video and imaging (MVI) intellectual property (IP) solutions by Sagem Défense Sécurité (Sagem-DS), a part of the SAFRAN Group of high-technology companies and leading provider of defence and security electronics. Celoxica technology was used by hardware and software teams and the product design was targeted at a Cyclone II/ Nios II FPGA based system-on-programmable-chip (SOPC) from Altera Corporation.
- Hynix Creates Fastest and Smallest 200MHz 512Mb Mobile DRAM
Hynix Semiconductor, Inc. announced it has developed the world’s fastest and smallest 512Megabit mobile DRAM. This product meets the JEDEC standards and operates at the world’s fastest speed of 200MHz.
- ZTE, Digit Wireless Develop Fastap-Enabled Mobile Devices
Digit Wireless, Inc., the innovators of Fastap(TM), a patented keypad design technology, today announced that ZTE is licensing Fastap to facilitate the increased demand for a simple and intuitive mobile device interface by mobile operators that are trying to increase adoption and use of all wireless data services.
- VaST Academic Program Educates Students in Embedded Design
VaST Systems, the technology leader in embedded design, announced the VaST Academic Program which allows selected universities and other academic institutions to receive VaST technology free for educational and some research purposes.
- Jinvani Systech Introduces SD Designer for SD Host Driver Development
Jinvani Systech, the World leader in SD flash memory / SDIO development and testing technology, announces a unique development tool allowing users to use their own easy to write scripts to develop or validate SD/SDIO devices without going through a complex process of device driver development. It means much easier and quicker completion of SD / MMC/ SD/IO engineering projects.
- Tundra Semiconductor Reports Revenue of $22 Million for Recent Quarter
Tundra Semiconductor Corporation (TSX:TUN), the leader in System Interconnect, reported financial results for the second quarter of fiscal year 2007, which ended October 29, 2006.