News – 2006.11.21

  • ST Creates Ultra-Low-Power Precision Temperature Sensor for 3G Phones
    STMicroelectronics (NYSE: STM) announced a precision temperature sensor with an ultra-low supply current requirement of less than 4.3-microamps (typical) and a tiny 4-lead UDFN package, making it ideal for 3G cell phones and other battery applications where low power, coupled with small size, accuracy and linearity over the full temperature range, are essential. The new STLM20 is the lowest-current drop-in replacement for industry-standard LM20 devices, and is the first in a new series of precision temperature sensors from ST.
  • TI, Arrow Electronics Offer Live Analog eLab Webcast on EMI, RFI
    Texas Instruments Incorporated (TI) (NYSE: TXN) and Arrow Electronics, Inc. (NYSE: ARW) will present a live Analog eLab Webcast for designers entitled “EMI/RFI as Seen by Analog ICs” on Wednesday, December 6, 2006, at 11:00 a.m. CST (18:00 hrs CET). During the online discussion, TI analog expert Bill Klein, P.E., and eLab panelists Carl Wolfe of TI and Peter Goad of Arrow Electronics will talk about types of interference that can impact analog circuit performance. In addition, they will discuss test techniques for measuring circuit sensitivity and useful design modifications for eliminating interference.
  • CSR Qualifies Industry’s First Class 1 Bluetooth Silicon
    CSR announced the qualification of the world’s first Class 1 Bluetooth single-chip solution. The BlueCore device is part of the company’s 5th generation silicon and is also the first product from the BlueMedia roadmap, incorporating a sensitive FM radio receiver in a small, single-chip design. Available in 4x4mm WLCSP or 6x6mm VFBGA packages, BlueCore5-FM features the highest performance Bluetooth on the market today, offering connectivity of up to 3Mb/s and unrivalled output power of +10 dBM. This allows the device to easily cover the 100m range required for a Class 1 Bluetooth radio without the need for an external amplifier – all within a PCB footprint of only 39.2mm2.
  • Denali Licenses MMAV IP to CeRoma for Digital Video Broadcasting
    Denali Software, Inc., a world- leading provider of electronic design automation (EDA) software and intellectual property (IP), announced that its MMAV(TM) verification intellectual property (IP) software has been licensed to CeRoma Semiconductor to help verify their latest high-performance system-on-chip (SoC) used in digital broadcasting devices within high-volume consumer products. CeRoma Semiconductor utilized Denali’s MMAV solution to simulate DDR feature rich specifications for their next-generation integrated digital television products while providing significant time-to-market advantages.
  • Code Generation Model-Based Development Conference
    The Code Generation Network, operated by Cambridge-based Software Acumen, has announced a new event to take place in May 2007 in Cambridge, UK. Code Generation 2007 will bring together leading software developers, vendors and consultants in Cambridge’s Homerton College from 18th – 20th May 2007.
  • Aeroflex 6413A UMTS Test System Supports Inverse Multiplexed ATM
    Aeroflex has enhanced the testing support provided by its highly successful 6413A UMTS basestation test system to support testing of basestations using an Inverse Multiplexed ATM (IMA) configuration.
  • Apical Expands Video Enhancement Software in UK with Kane Computing
    Kane Computing Ltd (KCL) have signed a distribution agreement for the UK and Northern Ireland with Apical Ltd to sell the iridix(R) range of video enhancement software, based on Apical’s proprietary Retina-Morphic image processing algorithms.
  • FEI Sells Knights Technology to Magma Design Automation
    Magma Design Automation Inc. (Nasdaq: LAVA), a provider of chip design solutions, announced it has acquired Knights Technology, a provider of yield management and failure analysis software solutions to the semiconductor industry, from FEI Company (Nasdaq: FEIC). Knights Technology products, employees and management team will be part of Magma’s Fab Analysis Business Unit.
  • Samsung Creates Industry’s Thinnest Mobile LCD Screen
    Samsung Electronics Co., Ltd., the world’s largest provider of thin-film transistor, liquid crystal display (TFT-LCD) panels announced that it has developed the thinnest reported LCD panel, one no thicker than a credit card at 0.82mm, which is 0.07mm thinner than the panel previously reported to be the world’s slimmest. The company also announced that it has developed a new mobile technology, which it is calling “i-Lens,” for integrating the entire panel assembly, including a protective layer, into a single, thinner module that is more shock-resistant and easier to read than conventional panels.
  • Sybase Acquires Embedded Software Licensing, Services of iFoundry
    Sybase, Inc. (NYSE: SY), a leading provider of enterprise infrastructure and mobile software, announced that it has acquired certain assets from Singapore-based iFoundry Systems, a privately held engineering services company focused on designing, developing and building wireless mobility solutions, in an all-cash transaction. The transaction is not expected to have a material impact on 2006 consolidated results.
  • NXP, Sony to Develop Secure Chips for Contactless Mobile Transactions
    NXP Semiconductors, formerly Philips Semiconductors, and Sony Corporation have signed a memorandum of understanding (MOU) to establish by mid-year 2007 a joint venture (JV) that will drive global adoption of contactless smart card applications in mobile phones. The anticipated JV will plan, develop, produce and market a secure chip that will include both MIFARE(R) and FeliCa(TM) operating systems and applications, as well as other contactless card operating systems and applications.
  • Altera, WEDC Target Military-Aerospace with FPGA Packaging Options
    Altera Corporation (NASDAQ: ALTR) and White Electronic Designs Corporation (NASDAQ: WEDC) announced a partnership that will enable military and aerospace customers access to a broad variety of packaging options for FPGAs that meet the rigorous requirements of defense applications. This is the first cooperative packaging agreement of its kind in the programmable logic industry.
  • Freescale Selects Synopsys EDA Tools for Functional Verification
    Freescale Semiconductor, Inc. (NYSE: FSL) (NYSE: FSL.B), a global leader in the design and manufacture of embedded semiconductors for wireless, networking, automotive, consumer and industrial markets and Synopsys, Inc. (Nasdaq:SNPS), a world leader in semiconductor design software, announced that they have signed an agreement for Freescale’s use of Synopsys electronic design automation software for the functional verification of complex semiconductor designs. Freescale currently deploys Synopsys’ Discovery(TM) Verification Platform for SystemVerilog-based verification, including the VCS(R) functional verification solution with Native Testbench (NTB) technology.
  • Synopsys Enables Wolfson to Meet Tight Area, Power, Performance Goals
    Synopsys, Inc. (Nasdaq:SNPS), a world leader in semiconductor design software, announced that Wolfson Microelectronics plc, a global leader in high-performance mixed-signal chips for the digital market, has selected Synopsys’ Galaxy(TM) Design and Discovery(TM) Verification Platforms, as well as Synopsys’ DesignWare(R) Library intellectual property (IP), for the design and verification of Wolfson’s high-performance analog mixed-signal (AMS) integrated circuits (ICs).