News – 2006.11.06

  • Sequence Receives Patent for Optimizing Multi-Threshold CMOS Designs
    Sequence Design, the EDA leader in power-aware SoC design solutions, today announced it has extended its technology lead by adding the 22nd patent to the company’s design-technology portfolio. U.S. Patent No. 7,117,457 has been granted to Jerry Frenkil, Sequence’s general manager, Silicon Business Unit, CTO and VP of R&D, and describes a new “current scheduling system and method for optimizing MTCMOS (Multi-Threshold CMOS) designs.”
  • Tektronix Acquires Minacom, Gains Active Probe Test Solutions
    Tektronix, Inc. (NYSE: TEK), a leading worldwide provider of test, measurement and monitoring solutions, today announced that it has signed a definitive agreement to acquire Minacom, a leading provider of active probe test solutions used by telecommunications carriers, cable multi-system operators (MSOs), wireless and VoIP providers worldwide. Minacom is based in Montreal, Canada and has an installed base in 30 countries worldwide. The acquisition will expand Tektronix’ leadership and addressable market in Next Generation Network (NGN) Management Solutions.
  • Intel, Micron Provide Updates to NAND Flash Memory Joint Venture
    Intel Corporation and Micron Technology Inc., today announced they are ahead of schedule on their development of the NAND flash memory joint venture, IM Flash Technologies. Since the formation of IM Flash in January, the companies have brought online a state-of-the-art 300 millimeter (mm) NAND fabrication facility in Manassas, Virginia, and a Lehi, Utah, 300mm facility is on track to be in production early next year. The venture also currently produces NAND memory through existing capacity at Micron’s Boise, Idaho, fabrication facilities.
  • Actel, Aldec Target High-Reliability Design for Aerospace, Avionics
    Actel Corporation (NASDAQ: ACTL) today announced it has partnered with Aldec, Inc., to offer two highly integrated solutions designed specifically for Actel’s field-programmable gate arrays (FPGAs) in high-reliability avionics and aerospace applications. With the industry’s first hardware/software verification package to ease DO-254 certification, the two companies are alleviating the verification bottleneck in the design assurance process. In addition, Aldec and Actel are unveiling a flash-based prototyping solution for Actel’s space-optimized RTAX-S FPGAs, allowing aerospace customers to tap the flexibility and reprogrammability of flash-based prototypes for multiple aerospace applications.
  • TI Reveals Transcoding as Key to Video Entertainment Market
    As the accelerating video market extends its reach to products such as cell phones, portable media players and automotive infotainment systems, consumers are demanding easy access to their video content throughout the home and on the go. The next stage of the video revolution must solve the challenge of seamlessly moving multi-format video content between all types of video devices. According to Texas Instruments Incorporated (TI) (NYSE: TXN), transcoding is crucial to addressing this challenge and enabling electronics manufacturers to drive the continued evolution of the video entertainment market.
  • TI Debuts Power Management IC for DaVinci-Based Portable Electronics
    Texas Instruments Incorporated (TI) (NYSE: TXN) introduced today the first power management integrated circuit (PMIC) fully optimized to support all power system requirements of a multimedia device based on DaVinci(TM) technology. Simplifying power design in portable media players, digital still cameras and other lithium-battery powered electronics, the flexible device provides dynamic voltage scaling and up to 95 percent power conversion efficiency.
  • Microchip Introduces PIC16F88X PIC Microcontrollers
    Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, today announced a new four-member family of 28- and 40/44-pin PIC(R) microcontrollers for use in a wide range of applications. The PIC16F88X family maintains compatibility with the PIC16F87XA family for easy migration, while providing a host of new features designed to save users time and money—both during and after their design cycle.
  • Cadence and UMC Create Wireless Reference Design
    Cadence Design Systems, Inc. , the leader in global electronic-design innovation, and leading global semiconductor foundry UMC today announced the success of their RF integrated-circuit design and verification on a co-developed wireless system-on-chip (SoC) reference flow. The flow, featuring the Cadence(R) QRC Extraction and the Virtuoso(R) UltraSim Full-chip Simulator, combines the Cadence Virtuoso custom design platform and UMC’s RFCMOS process to deliver silicon-accurate chip simulation and verification flows.
  • Western Design Center Joins ispLeverCORE Connection Partners Program
    Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the availability of an 8-bit 65xx microprocessor intellectual property (IP) core from the Western Design Center (WDC), a new member of the ispLeverCORE(TM) Connection IP partners program. Through the program, Lattice and WDC will provide complete system solutions for their mutual customers who are integrating system-level IP with the most advanced FPGA silicon architectures. The Lattice Connection program allows customers to easily access and integrate approved third-party IP products into Lattice programmable devices.
  • Aonix, ProSyst Create Java-based Remotely Managed Service Platform
    Aonix(R), a provider of complete solutions for safety- and mission-critical applications, and ProSyst Software GmbH, a leading provider of OSGi(TM)-compliant software to embedded Java developers, have joined forces to provide a Java-based service platform that can be remotely managed. This framework addresses growing distributed computing complexities in the real-time market by creating a common platform architecture to ensure that all software involved in an application communicates consistently and effectively.
  • Connect One Debuts iChipSec CO2128 Secure IP Communication Controller
    Connect One(TM), the Device Networking Authority(TM), today announced the planned release in January, 2007 of iChipSec(TM) CO2128, a secure Internet Protocol (IP) communication controller chip that reduces the cost and speeds the design of new IP-enabled point-of-sale (POS) terminals. The chip also includes many hardware enhancements that ensure high-throughput by offloading IP and network security protocols from the host processor.
  • Ronetix Upgrades PEEDI High Speed JTAG Emulator and Flash Programmer
    Ronetix today announced the availability of the new firmware of its high speed, low cost JTAG Emulator and Flash Programmer. The new firmware adds support of debugging and FLASH programming of Freescale MCP5500 devices. This includes all Nexus enabled CPUs like MPC5533, MPC5534, MPC5553, MPC5554, MPC5565, MPC5566 and MPC5567.
  • Raytheon Selects PrismTech Real-Time Java Middleware for Navy Destroyer
    PrismTech(TM), a leading provider of productivity tools and middleware, announced that its OpenFusion(R) RTOrb Java(TM) Edition CORBA(R) middleware has been selected by Raytheon for development and deployment in the U.S. Navy’s DDG 1000 Zumwalt Class Destroyer program.
  • Catalyst Rolls Out Openmake Application Lifecycle Management
    Catalyst Systems Corporation announced the general availability of the latest version of Openmake, the advanced solution for centralizing and controlling application lifecycle processes from source control management through build, testing and deployment without the need for writing highly customized ALM (application lifecycle management) scripts.
  • Optima EPS Creates F-Series Cabinets Ready for Harsh Environments
    Optima EPS, an Elma Company, has announced its F-series Harsh Environment Cabinets. The enclosure series was specifically designed to handle dust, moisture, and EMC suppression. The F-series comes in three styles: non-gasketed, NEMA12/UL-508, and Shielded EMC/NEMA.
  • NXP Licenses Tessera’s Semiconductor Packaging Technology
    Tessera Technologies, Inc. (Nasdaq:TSRA), a leading provider of miniaturization technologies for the electronics industry, today announced that it has signed a new technology licensing agreement with NXP B.V., one of Europe’s largest semiconductor companies.
  • Agilent Offers Largest Display Size, Deepest Memory Logic Analyzer
    Agilent Technologies Inc. (NYSE:A) today expanded its industry-leading logic analyzer portfolio with a new modular mainframe, two new logic analyzer modules offering up to 4X the available memory in the industry, and new applications for developers of PCI Express and Altera FPGAs.
  • Agilent Debuts LXI Class C Oscilloscopes Optimized for Test Systems
    Agilent Technologies Inc. (NYSE: A) today introduced the first LXI class C compliant oscilloscope family optimized for use in test systems. The Agilent 6000L Series digital storage oscilloscopes (DSOs) offer four channels of measurements in a compact, rack-mountable 1U-high form factor, giving engineers a space-efficient way to integrate oscilloscopes into their test systems.
  • Xilinx Accelerates Growth of Electronic Design Innovation in China
    In a series of press briefings last week, Xilinx, Inc. (NASDAQ: XLNX) Chairman, President and CEO Wim Roelandts underscored the company’s commitment to accelerate growth of electronic design innovation in China. Among the key areas of expansion are new a multi-million dollar technology fund, dedicated support facilities including an applications development lab, an expanded third-party ecosystem and significant investment in local universities.
  • Xilinx Creates $75 Million Asia Pacific Technology Fund
    At the Global Entrepolis Singapore event today, Xilinx, Inc. (NASDAQ:XLNX) the world’s leading supplier of programmable logic solutions, announced its Asia Pacific Technology Fund, a US$75 million corporate venture capital fund focused on accelerating programmable systems innovation and development within the Asia Pacific technology market.