News – 2006.10.20

  • Xilinx Showcases Radio Modem, Cryptography Power Solutions at Milcom
    Xilinx, Inc. (NASDAQ: XLNX), the world’s leading PLD provider today announced that it will showcase modem and crypto solutions designed to reduce the size, weight and power of military radios at the Military Communications (MILCOM) 2006 conference, October 23 -25, 2006 in Washington, D.C.
  • Caltech Licenses Thin-Film Thermoelectric Technology to Nextreme Thermal
    Nextreme Thermal Solutions, a pioneer in solid-state thermal management in electronics and semiconductors, today announced that it has signed an exclusive option to license new, thin-film thermoelectric technology from the California Institute of Technology (Caltech). The technology covers pioneering work on thin-film thermoelectric devices carried out at NASA’s Jet Propulsion Laboratory (JPL), an operating division of Caltech. The addition of this pioneering technology to Nextreme’s intellectual property portfolio complements technology previously acquired from RTI International in 2004 and significantly strengthens the company’s IP portfolio as a leading developer of embedded thermoelectric cooling solutions.
  • ABI Research Expects Femtocell Shipments to Reach 19 Million in 2011
    By 2011 the worldwide market for femtocell products is expected to reach nearly 19 million units per annum. An interesting factor that is often overlooked when considering the femtocell market is that of functionality. Initial offerings are likely to be simple affairs that rely on Ethernet connections to existing ADSL gateways.
  • NA Semiconductor Equipment Industry Posts Book-to-Bill Ratio of 1.00
    North American-based manufacturers of semiconductor equipment posted $1.62 billion in orders in September 2006 (three-month average basis) and a book-to-bill ratio of 1.00 according to the September 2006 Book-to-Bill Report published today by SEMI. A book-to-bill of 1.00 means that $100 worth of orders were received for every $100 of product billed for the month.
  • Synplicity Joins ARM Connected Community
    Synplicity, Inc. (Nasdaq:SYNP), a leading provider of software for the design and verification of semiconductors, today announced it has joined the ARM(R) Connected Community, the industry’s largest ecosystem of ARM technology-based products and services. As part of the ARM Connected Community, Synplicity will gain access to a full range of resources to help it market and deploy innovative solutions that enable developers to get their ARM Powered(R) products to market faster.
  • Genesys, Magma Integrate ArraytestMaker with Blast Create
    Genesys Testware and Magma(R) Design Automation (Nasdaq: LAVA), a provider of semiconductor design software, today announced an automated design-for-test (DFT) solution that integrates Genesys’ ArraytestMaker(TM) test, diagnosis and repair solution into Magma’s Blast Create(TM) physical synthesis design flow, simplifying the overall flow by removing the need to import and export design data into Blast Create. Genesys and Magma will demonstrate this solution at the International Test Conference Oct. 24-26 in Santa Clara, in Booth #118.
  • Magma to Showcase Design-for-Test (DFT), DFM Solutions at ITC
    Magma(R) Design Automation Inc. (Nasdaq: LAVA), a provider of semiconductor design software, today announced it will showcase advanced design-for-test (DFT) and design-for-manufacturability (DFM) solutions at the International Test Conference Oct. 24-26 in Santa Clara. Featured demonstrations will highlight the interoperability between Magma’s Blast Create(TM) physical synthesis flow and DFT tools from major vendors Genesys Testware, LogicVision, Mentor Graphics and Virage Logic.