- ZiLOG Releases ZLR64400 Microcontrollers with On-Chip Learning
In a development that further reinforces its position as the leading supplier of microcontroller (MCU) solutions for the universal infrared (UIR) remote control market, ZiLOG(R) Inc. (Nasdaq: ZILG) today announced the release of the ZLR64400 family of 8-bit MCU devices, the latest addition to its Crimzon(TM) line of infrared-specific silicon. In common with ZLP12840 OTP (One Time Programmable device), launched in November 2005, the ZLR64400 features an “on-chip” ability to learn codes from other infrared remote controls for consumer products via a learning circuit.
- Acrosser Rolls Out AR-B1652 Fanless 3.5-inch SBC with VIA Mark Processor
Acrosser Technology, Co., LTD today announces the availability of AR-B1652, the 3.5″ SBC built with power-efficient VIA Mark Corefusion Processor and VT82C686B chipset feature low power consumption and fanless operation. Integrating with VIA S3 ProSavage 4 Graphics core, AR-B1652 supports dual independent display, LVDS/TTL LCD interfaces and VGA display resolution of up to 1600 x 1200 pixels.
- Strategic Test Creates Smallest Monahans P System on Module (SOM)
Strategic Test has announced the World’s smallest Intel/Marvel ‘Monahans P’ System on Module (SOM). Called the TRITON-290, it measures just 67.6 x 26 x 4.2 mm (2.6″ x 1″ x 0.16″) and contains an 806 MHz PXA290 processor coupled with 64 MB SDRAM and 128 MB Flash. The module uses a 200 pin SODIMM connector and as standard has an extended temperature range of -25 degC to +85 degC. First shipments are slated to start in November, together with a complete Development Kit running Linux 2.6.17 and Microsoft Windows CE 5.0.
- Redback Verifies Network Processor with Cadence Xtreme III System
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, today announced that Redback Networks Inc., a leader in next-generation broadband networks, has selected the Cadence(R) Incisive(R) Design Team Xtreme III acceleration and emulation solution. The new Xtreme III System is capable of verifying 72-millon-gate designs and delivers performance gains in the range of 10 to100,000 times compared to simulation. The system is designed to improve overall verification throughput and quality of Redback’s next-generation flagship network processor.
- Mentor Graphics LeonardoSpectrum Supports Xilinx Virtex-5 LXT FPGAs
Mentor Graphics(R) Corporation (NASDAQ: MENT) today announced that its suite of advanced synthesis products supports the newly introduced Virtex(TM)-5 LXT field programmable gate arrays (FPGAs) from Xilinx, Inc. (NASDAQ: XLNX). Synthesis support for Virtex-5 LXT FPGAs is available now in Precision(R) Synthesis, release 2006a. Support within the LeonardoSpectrum(TM) tool suite will follow.
- IMEC Validates Flexible Air Interface for Nomadic Terminals
IMEC has validated the hardware implementation of its software-defined radio digital baseband – called flexible air interface – for nomadic terminals, achieving power consumption comparable with dedicated solutions. The cost- and power-efficient architecture supports all radio standards from next generation cellular (3GPP-LTE) to high data rate WLAN-WiMAX-DVB (OFDM-MIMO-based).
- IMEC Combines Multi-Disciplinary Research
IMEC announces that it will give momentum to its ‘More than Moore’ research, building on its 130nm CMOS base process and expertise in heterogeneous technologies. Using its existing 200mm infrastructure, IMEC will offer CMOS-based process R&D combined with additional process modules and devices and application-specific demonstrators for ‘More than Moore’ processes and systems.
- IMEC Demonstrates Double Patterning Immersion Litho for 32nm Node
IMEC showed in collaboration with ASML the potential of double patterning 193nm immersion lithography at 1.2NA for 32nm node Flash and logic. These results prove that double patterning might be an intermediate solution before extreme ultraviolet (EUV) lithography and very high NA (beyond water) 193nm immersion lithography will be ready for production. Meanwhile, installation of both ASML’s XT:1700i immersion scanner and EUV alpha demo tool (ADT) runs at full speed in IMEC’s 300mm clean room.
- IMEC, NSC Develop Copper-Top (Cu-top) Interconnect Technology
IMEC successfully transferred its Copper-Top (Cu-top) interconnect process technology to National Semiconductor’s production facility in Malacca Malaysia. The Cu-top technology is a low resistance, post-passivation interconnect module particularly suited for analog and mixed-signal applications. It improves system-efficiency and results in a significant chip-size reduction of such semiconductor devices.
- Lingoport Globalyzer 2.3 Improves Globalization of Software
Lingoport, Inc., a leading developer of globalization software and services, today announced its release of Globalyzer(TM) 2.3 to help companies make their software ready to meet the demands of world market customers. Globalyzer 2.3 enhancements further enable a company’s software to support worldwide language, locale and cultural formatting requirements so the software will perform gracefully in any target market.
- Blue Mountain’s Glass Cockpit Flies with FSMLabs RTLinux
FSMLabs RTLinuxPro is shipping in the just released Gen4 EFIS/One glass cockpit from Blue Mountain Avionics. The EFIS/One is a state-of-the-art, complete glass cockpit designed specifically for experimental aircraft that is fast becoming the standard choice of sport pilots from RV drivers to L-39 jet jockeys.
- Atmel Debuts Microcontroller-Transmitter RF ICs for Automotive TPMS
Atmel(R) Corporation (Nasdaq: ATML), a global leader in the development and fabrication of advanced semiconductor solutions, announced today the availability of the new highly-integrated and low-power ATA6285 and ATA6286 microcontroller-transmitter ICs with sensor interface for tire pressure monitoring (TPMS) sensor gauge systems. The new devices include all necessary building blocks to support the measurement and calibration of simple capacitive pressure and motion sensors plus the complete RF transmission functionality. These are the first such devices on the market.
- WinSystems Launches Rugged SBC with GSM/CDMA Cellular Modem, ZigBee
WinSystems introduced their LBC-GX500, a highly integrated, single board computer (SBC) designed for machine-to-machine connectivity. What sets the LBC-GX500 apart from any other industrial embedded SBC in its class is its wide variety of wired and wireless connectivity options. Among them are 802.11 wireless Ethernet, GSM/GPRS cellular modem, CDMA cellular modem, ZigBee wireless RF module, 10/100 wired Ethernet port, global-compliant dial-up modem, six USB ports, and six COM channels on a single board.
- MEN Micro Creates Wireless LAN Module for Harsh Industrial Conditions
MEN Micro, Inc., a leading supplier of industrial real-time and embedded computer products, has introduced a new wireless local area networking (WLAN) module for 3U Compact PCI systems in harsh environmental conditions. The F209L operates over the industrial temperature range of -40 to 85 degrees C and the module can be coated with a conformal film to protect against humidity and dust in challenging industrial environments. In addition, all components are secured to the printed circuit board in such a way that they are highly resistant to shock and vibration.
- Mercury Computer Debuts First Intel Core Duo Advanced Mezzanine Card
Mercury Computer Systems, Inc. (NASDAQ: MRCY) introduced its new Intel(R) Core(TM) Duo-based Advanced Mezzanine Card (AMC) that nearly doubles the compute resource available in an AMC form factor. The Momentum(TM) Series AXA-100 AMC represents the industry’s next-generation mezzanine standard supporting high-speed interfaces for use in both AdvancedTCA(R) as well as MicroTCA systems. The AMC is fast becoming one of the main foundations upon which communications equipment providers are building their systems.
- Microchip Tests for ZigBee Compliance with NTS ZigTest
National Technical Systems, Inc. (NASDAQ: NTSC) (NTS), a leading provider of engineering services, announced today that they have been selected by Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller and analog semiconductors, to provide compliance testing to the ZigBee(TM) wireless standard.